The XC2S200-6FGG1045C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and a 1045-ball Fine Pitch BGA (FGG) package — all powered by a 2.5V supply. Whether you’re building embedded systems, digital signal processing pipelines, or communication interfaces, the XC2S200-6FGG1045C is a proven and reliable choice.

If you’re looking for a broader selection of Spartan-II and other programmable logic solutions, explore our full Xilinx FPGA catalog.

What Is the XC2S200-6FGG1045C? – Product Overview

The XC2S200-6FGG1045C belongs to the Xilinx Spartan-II FPGA family, a cost-optimized series that offers a practical alternative to mask-programmed ASICs. Unlike ASICs, this FPGA avoids long development cycles and high non-recurring engineering (NRE) costs, while allowing field upgrades without hardware replacement.

The part number decodes as follows:

XC2S200-6FGG1045C Key Specifications

Core Logic Resources

Electrical & Timing Specifications

Package & Environmental Specifications

XC2S200-6FGG1045C Architecture & Key Features

Configurable Logic Blocks (CLBs)

The Spartan-II CLB architecture consists of four logic cells per CLB, each containing a 4-input Look-Up Table (LUT), a D-type flip-flop, and dedicated carry logic. The 28×42 CLB array in the XC2S200 provides a dense fabric suitable for complex state machines, arithmetic units, and interface logic.

Block RAM (BRAM)

The XC2S200 includes 56K bits of dedicated Block RAM, organized in two columns on opposite sides of the die. Each block is a true dual-port RAM, configurable as 4K×1, 2K×2, 1K×4, or 512×8/9 — ideal for FIFOs, lookup tables, and data buffers.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — enable clock distribution with zero propagation delay, clock multiplication, and phase shifting. This makes the XC2S200-6FGG1045C well-suited for designs that require tight clock domain management.

Input/Output Blocks (IOBs)

With 284 maximum user I/O pins, the XC2S200 supports a wide range of I/O standards including LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V), PCI, GTL, GTL+, HSTL, SSTL2, and SSTL3. Each IOB contains programmable input delay, output slew-rate control, and optional pull-up/pull-down resistors.

Routing Architecture

The Spartan-II routing fabric uses a hierarchical interconnect of local, long, and global lines, enabling efficient signal routing with minimal propagation delay. Global routing lines support high-fanout clock and reset nets across the entire device.

Spartan-II Family Comparison Table

Use this table to compare the XC2S200 against other members of the Spartan-II family and confirm the XC2S200-6FGG1045C is the right fit for your design.

The XC2S200 is the largest device in the Spartan-II family, offering the most logic resources, I/O pins, and memory — making it the ideal choice when maximum capacity is required.

Configuration & Programming the XC2S200-6FGG1045C

Supported Configuration Modes

The XC2S200-6FGG1045C supports multiple configuration modes to suit different system architectures:

Recommended Configuration PROMs

Xilinx Platform Flash PROMs (XCF series) are the recommended companion devices for storing the XC2S200 bitstream. The configuration bitstream is retained through power cycles, and the device reconfigures automatically on power-up.

Development Tools

The XC2S200-6FGG1045C is supported by Xilinx ISE Design Suite, the legacy toolchain for Spartan-II devices. Key tools include:

• XST (Xilinx Synthesis Technology) – RTL synthesis from VHDL/Verilog
• ISE Implementation – Place & Route for Spartan-II
• ChipScope Pro – On-chip signal analysis and debugging
• iMPACT – JTAG-based programming and configuration

Typical Applications for the XC2S200-6FGG1045C

The Spartan-II XC2S200-6FGG1045C is widely used across a variety of industries and applications:

XC2S200-6FGG1045C vs. Alternative Part Numbers

Xilinx offers the XC2S200 in several package and speed grade variants. The table below helps you identify the best alternative if the FGG1045 package is unavailable:

Note: The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For Industrial temperature range (-40°C to +100°C), use the -5 speed grade variants.

Why Choose the XC2S200-6FGG1045C Over an ASIC?

The XC2S200-6FGG1045C delivers several compelling advantages over traditional mask-programmed ASICs:

• Zero NRE costs – No mask tooling fees, making it economical even for low-to-medium volumes
• Field upgradability – Logic can be updated post-deployment via reconfiguration
• Faster time-to-market – Design, prototype, and iterate in days, not months
• Reduced design risk – Fix bugs in the field without a hardware spin
• Versatility – The same silicon supports multiple product variants through different bitstreams

Ordering Information & Part Number Structure

Understanding the Xilinx part numbering convention helps ensure you order the exact variant you need.

XC2S200  -  6  -  FGG  -  1045  -  C
  |          |     |        |       |
Device    Speed  Pkg     Pin     Temp
Type      Grade  Type    Count   Range

• Device: XC2S200 = Spartan-II, 200K gates
• Speed Grade: -6 = fastest (Commercial only), -5 = standard
• Package: FGG = Fine Pitch BGA, Pb-Free | FG = BGA, standard | PQG = PQFP, Pb-Free | PQ = PQFP standard
• Pin Count: 1045
• Temperature: C = Commercial (0°C to +85°C) | I = Industrial (-40°C to +100°C)

Frequently Asked Questions (FAQ)

What is the difference between XC2S200-6FGG1045C and XC2S200-6FG456C?

The primary difference is the package and pin count. The FGG1045 uses a larger 1045-ball Fine Pitch BGA (Pb-Free), while the FG456 uses a 456-ball BGA. Both share the same -6 speed grade, Commercial temperature rating, and identical core logic resources. The FGG suffix indicates a Pb-Free (RoHS-compliant) package.

Is the XC2S200-6FGG1045C RoHS compliant?

Yes. The “G” in “FGG” indicates a Pb-Free, RoHS-compliant package. This makes it suitable for designs requiring compliance with EU RoHS directives and other environmental regulations.

What software do I use to program the XC2S200-6FGG1045C?

The XC2S200-6FGG1045C is programmed using Xilinx ISE Design Suite. You can write your HDL design in VHDL or Verilog, synthesize it with XST, implement it using ISE, and download the bitstream via JTAG using iMPACT programmer software.

What is the maximum operating frequency of the XC2S200-6FGG1045C?

With the -6 speed grade, the XC2S200 can achieve a maximum system clock frequency of up to 263 MHz for internal logic paths. Actual performance depends on design complexity, routing, and logic depth.

Can the XC2S200-6FGG1045C be used in industrial temperature applications?

No. The -6 speed grade is exclusively rated for the Commercial temperature range (0°C to +85°C). For industrial temperature (-40°C to +100°C) applications, use the -5 speed grade variants such as XC2S200-5FGG456I.

Summary: XC2S200-6FGG1045C at a Glance

The XC2S200-6FGG1045C remains a trusted, battle-tested FPGA for designers who need a powerful, reprogrammable logic platform with a rich I/O complement and ample on-chip memory. Its large pin-count FGG1045 package makes it especially attractive for system-level designs requiring high I/O density.