The XC2S200-6FGG1041C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, cost-sensitive applications, this device delivers 200,000 system gates, 5,292 logic cells, and operates at speeds up to 200 MHz — all in a compact 1041-ball Fine Pitch BGA (FGG) package. Whether you’re replacing legacy ASICs, accelerating digital signal processing, or building embedded communication systems, the XC2S200-6FGG1041C offers outstanding flexibility and value.

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What Is the XC2S200-6FGG1041C?

The XC2S200-6FGG1041C is part of Xilinx’s Spartan-II FPGA series, a 2.5V logic family built on advanced 0.18 µm process technology. The part number breaks down as follows:

This device belongs to the top tier of the Spartan-II lineup, offering the largest gate count in the family alongside the highest available I/O count.

XC2S200-6FGG1041C Key Specifications

Core Logic & Memory Resources

Electrical & Timing Specifications

Package & Environmental Specifications

XC2S200-6FGG1041C Features & Architecture

Configurable Logic Blocks (CLBs)

The Spartan-II CLB structure is the foundation of the XC2S200’s programmable logic. Each CLB contains four logic cells, and each logic cell includes a 4-input Look-Up Table (LUT), a D-type flip-flop, and dedicated carry logic. The 28 × 42 array of the XC2S200 provides 1,176 CLBs total, giving designers ample space for complex combinational and sequential logic.

Input/Output Blocks (IOBs)

The XC2S200 supports up to 284 user I/O pins (excluding four global clock inputs). Each IOB supports multiple I/O standards including LVTTL, LVCMOS2, LVCMOS18, SSTL2, SSTL3, GTL, GTL+, HSTL, and CTT. Programmable pull-up and pull-down resistors, 3-state capability, and input delay registers are all available on each IOB.

Block RAM

Two columns of dedicated block RAM sit on opposite sides of the die, providing 56K bits of synchronous, dual-port memory. Block RAM is ideal for implementing FIFOs, lookup tables, and local data buffers without consuming CLB resources.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide clock distribution, clock edge alignment, frequency multiplication and division, and phase shifting. DLLs eliminate clock skew across the device, enabling reliable high-speed synchronous designs.

Configuration

The XC2S200-6FGG1041C supports multiple configuration modes: Master Serial, Slave Serial, Slave Parallel (SelectMAP), and JTAG boundary scan. It can be configured using Xilinx PROMs or third-party SPI/parallel flash devices, offering flexibility for different system architectures.

Spartan-II Family Comparison Table

Understanding how the XC2S200 compares to other Spartan-II devices helps you select the right part for your design.

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the preferred choice for designs that require the highest logic density within this product line.

XC2S200-6FGG1041C Available Package Options

The XC2S200 is available in several package options. The FGG1041 is the largest package, delivering the maximum I/O count.

Note: The FGG1041 package provides the same 284 user I/O as the FGG456 but with a larger ball grid footprint for PCB designs requiring better mechanical stability or thermal characteristics. The “G” in FGG denotes Pb-free (RoHS-compliant) packaging.

Speed Grade Comparison: -6 vs Other Grades

The -6 speed grade is the fastest available for the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). Industrial temperature variants are available in slower speed grades.

For maximum performance in commercial environments, the XC2S200**-6**FGG1041C is the optimal selection.

Typical Applications of the XC2S200-6FGG1041C

The XC2S200-6FGG1041C is well-suited for a wide range of embedded and industrial applications:

• Communications & Networking: Protocol bridging, line card acceleration, serial-to-parallel conversion
• Industrial Control Systems: Motor control, sensor interfaces, real-time data acquisition
• Digital Signal Processing (DSP): FIR/IIR filters, FFT engines, arithmetic pipelines
• Consumer Electronics: Set-top boxes, multimedia interfaces, display controllers
• Legacy ASIC Replacement: Cost-effective migration from mask-programmed ASICs with in-field reprogrammability
• Embedded Systems: Co-processing, custom peripheral interfaces, glue logic replacement
• Aerospace & Defense (non-radiation-hardened): General-purpose prototyping and low-cost production

Why Choose the XC2S200-6FGG1041C Over Mask-Programmed ASICs?

One of the primary selling points of the Spartan-II family is its cost advantage over traditional ASICs. The XC2S200 eliminates several major ASIC drawbacks:

For low-to-medium volume production runs, the XC2S200-6FGG1041C delivers ASIC-like performance without ASIC-level upfront investment.

Development Tools for the XC2S200-6FGG1041C

Xilinx ISE Design Suite

The XC2S200-6FGG1041C is supported by the Xilinx ISE Design Suite (the appropriate toolchain for legacy Spartan-II devices). ISE provides:

• HDL synthesis (VHDL / Verilog)
• Place and route
• Timing analysis
• JTAG programming via iMPACT

Note: Vivado Design Suite does not support the Spartan-II family. Use ISE 14.7 (the final ISE release) for XC2S200-6FGG1041C development.

Configuration Methods

Ordering Information & Part Number Decoder

Use the following guide to decode Xilinx Spartan-II part numbers:

XC2S200  -  6  -  FGG  -  1041  -  C
  |          |      |        |       |
Device    Speed  Package   Pins   Temp
Type      Grade   Type    Count  Range

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1041C used for?

The XC2S200-6FGG1041C is primarily used in communications, industrial automation, digital signal processing, and embedded system applications where reconfigurable logic is preferable to fixed ASICs.

What is the difference between FGG456 and FGG1041 packages?

Both packages offer the same 284 maximum user I/O, but the FGG1041 features a larger physical footprint with 1041 solder balls, offering better mechanical support and heat dissipation characteristics on the PCB.

Is the XC2S200-6FGG1041C RoHS compliant?

Yes. The “G” in FGG indicates a Pb-free (lead-free) package, making the XC2S200-6FGG1041C fully RoHS compliant.

What design tools support the XC2S200-6FGG1041C?

The XC2S200-6FGG1041C is supported by Xilinx ISE 14.7. Vivado does not support the Spartan-II device family.

Can I replace an XC2S200-6FGG1041C with a newer FPGA?

Yes. For new designs, Xilinx recommends migrating to more current families such as the Spartan-6 or Spartan-7. However, for legacy system maintenance, the XC2S200 remains widely available from authorized distributors.

Summary: XC2S200-6FGG1041C at a Glance

The XC2S200-6FGG1041C remains a proven, reliable FPGA solution for both legacy system support and new designs that demand high I/O density, robust on-chip memory, and clock management at commercial speeds. Browse a complete catalog of in-stock Xilinx FPGA solutions at PCBSync for competitive pricing and fast lead times.