The XC2S200-6FGG1039C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD), belonging to the renowned Spartan-II family. With 200,000 system gates, 5,292 logic cells, and a large 1,039-pin Fine-Pitch Ball Grid Array (FBGA) package, this device is engineered for high-volume, complex digital design applications. Whether you are developing embedded systems, digital signal processing pipelines, or communication interfaces, the XC2S200-6FGG1039C delivers the programmability and performance your project demands.

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What Is the XC2S200-6FGG1039C?

The XC2S200-6FGG1039C is part of Xilinx’s Spartan-II FPGA product line — a 2.5V FPGA family built on advanced 0.18µm process technology. The part number breaks down as follows:

For engineers sourcing programmable logic solutions, this part represents the top-tier density option in the Spartan-II lineup, paired with the fastest available speed grade in commercial temperature operation. To explore a broader range of Xilinx programmable logic solutions, visit Xilinx FPGA.

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XC2S200-6FGG1039C Key Specifications

Core Logic Resources

Electrical & Timing Characteristics

Package Information

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XC2S200-6FGG1039C Features and Architecture

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1039C is its array of 1,176 Configurable Logic Blocks (CLBs). Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops, providing a rich fabric for implementing combinational and sequential logic. The 28×42 CLB array enables the implementation of deeply pipelined, high-throughput designs.

Block RAM and Distributed RAM

The XC2S200-6FGG1039C provides 56K bits of dedicated block RAM, organized in two columns flanking the CLB array. Additionally, 75,264 bits of distributed RAM can be configured from LUT resources. This dual-RAM architecture supports efficient data buffering, FIFOs, and lookup tables within the same device.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide precise clock management. The DLLs enable:

• Clock deskewing across the chip
• Clock frequency synthesis (multiply/divide)
• Phase shifting for source-synchronous interfaces
• Reduced clock-to-output delays

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1039C supports a wide range of single-ended and differential I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and more. Each IOB features programmable slew rate control, optional pull-up/pull-down resistors, and input delay elements for reliable high-speed interfacing.

Hierarchical Routing Architecture

The device employs a hierarchical interconnect structure with local, long-line, and global routing resources. This architecture balances routing flexibility with performance, minimizing propagation delays for timing-critical paths.

JTAG Boundary Scan

Full IEEE 1149.1 JTAG Boundary Scan support is built in, enabling in-system configuration, programming, and debugging. The XC2S200-6FGG1039C can be configured via JTAG, master serial, slave serial, or peripheral modes.

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Spartan-II Family Comparison Table

The XC2S200 is the largest and most capable device in the Spartan-II family. Here is how it compares to its siblings:

The XC2S200-6FGG1039C combines the largest logic capacity in the family with the fastest speed grade (-6) and a high pin-count Pb-free package, making it the go-to choice for density-demanding applications.

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Applications of the XC2S200-6FGG1039C

The XC2S200-6FGG1039C FPGA is well-suited for a broad range of embedded and industrial applications, including:

• Digital Signal Processing (DSP): FIR/IIR filters, FFT engines, and real-time signal conditioning
• Communication Systems: Protocol bridging, SerDes interfaces, and packet processing
• Industrial Automation: Motor control, PLCs, and sensor data aggregation
• Video & Image Processing: Frame buffering, pixel manipulation, and video scaling
• Embedded Computing: Soft-processor cores (MicroBlaze), custom accelerators
• Test & Measurement Equipment: High-speed data capture and pattern generation
• Telecommunications: Line card logic, framing, and multiplexing

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Configuration and Programming

Supported Configuration Modes

The XC2S200-6FGG1039C stores its configuration in internal SRAM cells, meaning it must be reconfigured at power-on. Non-volatile configuration data is typically stored in a companion Xilinx Platform Flash PROM.

Design Tools

Xilinx’s ISE Design Suite (legacy) fully supports the Spartan-II family. Designers can use:

• ISE Project Navigator for RTL synthesis and implementation
• CORE Generator for pre-optimized IP cores
• ChipScope Pro for in-system logic analysis
• ModelSim / Xilinx Simulator for functional and timing simulation

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XC2S200-6FGG1039C Ordering and Part Number Variants

The -6FGG1039C variant provides the highest pin count in a Pb-free package with the fastest speed grade, making it the preferred option when maximum I/O density and performance are both required.

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Why Choose the XC2S200-6FGG1039C Over a Custom ASIC?

One of the strongest value propositions of the Spartan-II FPGA family is its position as a superior alternative to mask-programmed ASICs. The XC2S200-6FGG1039C eliminates:

• High NRE (Non-Recurring Engineering) costs associated with ASIC tape-out
• Long development and fabrication cycles typically spanning months
• Inflexibility — FPGA designs can be updated in the field without hardware replacement

For high-volume production where design iterations are expected or where time-to-market is critical, the XC2S200-6FGG1039C delivers a compelling cost-performance balance.

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1039C used for?

The XC2S200-6FGG1039C is used in digital logic design applications including DSP, communications, industrial automation, video processing, and embedded computing. Its high gate count and I/O density make it suitable for complex, multi-interface system designs.

What voltage does the XC2S200-6FGG1039C operate at?

The device operates at 2.5V core voltage (VCCINT). The I/O voltage (VCCO) is configurable from 1.5V to 3.3V per I/O bank, allowing compatibility with multiple interface standards.

Is the XC2S200-6FGG1039C RoHS compliant?

Yes. The “G” in the FGG package designator indicates this is a Pb-free (lead-free), RoHS-compliant package.

What temperature range does the XC2S200-6FGG1039C support?

The “C” suffix indicates the commercial temperature range: 0°C to +85°C. Industrial-range variants carry an “I” suffix and support –40°C to +100°C.

What is the maximum clock speed of the XC2S200-6FGG1039C?

With the -6 speed grade, the device supports system clock frequencies up to approximately 263 MHz, depending on the design complexity and logic depth.

Can I configure the XC2S200-6FGG1039C in-system?

Yes, via JTAG boundary scan, the XC2S200-6FGG1039C supports full in-system configuration and reprogramming without removing the device from the board.

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Summary: XC2S200-6FGG1039C at a Glance

The XC2S200-6FGG1039C remains a proven, reliable programmable logic device for engineers who need maximum gate density, broad I/O capability, and fast commercial-grade timing — all within a compact, RoHS-compliant BGA package. Its robust ecosystem of design tools, IP cores, and community support make it an enduring choice for both new designs and legacy system maintenance.