The XC2S200-6FGG1038C is a high-performance, 2.5V programmable logic device from Xilinx’s Spartan-II FPGA family. Designed for cost-sensitive, high-volume applications, this device delivers up to 200,000 system gates, 284 user I/Os, and advanced clock management — all within a compact Fine-Pitch Ball Grid Array (FBGA) package. Whether you are designing industrial control systems, embedded processing platforms, or communications equipment, the XC2S200-6FGG1038C offers the flexibility and performance engineers demand.
What Is the XC2S200-6FGG1038C?
The XC2S200-6FGG1038C is a member of the Xilinx Spartan-II 2.5V FPGA family — one of the most widely deployed FPGA families in embedded and industrial markets. It is the largest device in the Spartan-II lineup, offering the maximum gate count and I/O resources available within this series.
For a broader selection of programmable logic solutions from Xilinx, visit Xilinx FPGA.
Part Number Breakdown
Understanding the part number helps you identify the exact variant for your design:
| Code Segment |
Meaning |
Value in This Part |
| XC2S200 |
Device type (Spartan-II, 200K) |
200,000 System Gates |
| -6 |
Speed Grade |
Fastest (-6) Commercial |
| FGG |
Package type (Fine-Pitch BGA, Pb-free) |
FBGA |
| 1038 |
Pin count |
1,038 balls |
| C |
Temperature range |
Commercial (0°C to +85°C) |
XC2S200-6FGG1038C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Specification |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
Electrical and Timing Characteristics
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V, 2.5V, or 3.3V |
| Speed Grade |
-6 (fastest in family) |
| Maximum System Clock |
Up to 200 MHz (typical) |
| Operating Temperature Range |
0°C to +85°C (Commercial) |
Package Information
| Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG (Pb-free) |
| Pin Count |
1,038 |
| Mounting Style |
Surface Mount Technology (SMT) |
XC2S200-6FGG1038C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200 contains 1,176 Configurable Logic Blocks, arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This structure provides a rich fabric for implementing combinational and sequential logic efficiently.
Input/Output Blocks (IOBs)
With 284 user-programmable I/Os, the XC2S200-6FGG1038C supports a wide range of I/O standards, including:
- LVTTL
- LVCMOS2 / LVCMOS33
- PCI (3.3V, 33 MHz and 66 MHz)
- GTL / GTL+
- SSTL2 and SSTL3
- AGP
- CTT
- HSTL
Each IOB includes programmable pull-up, pull-down, and keeper circuitry, along with configurable output slew rate control for signal integrity management.
Block RAM
The XC2S200 includes 56Kb of dual-port block RAM, split into two columns on opposite sides of the device. Each block RAM can be configured as:
| Configuration |
Depth × Width |
| Single-port mode |
4K × 1 to 512 × 8 |
| Dual-port mode |
Flexible widths |
Block RAMs can be cascaded to implement larger memory structures such as FIFOs, look-up tables, or data buffers.
Delay-Locked Loops (DLLs)
The device incorporates four Delay-Locked Loops, one at each corner of the die. DLLs are used to:
- Eliminate clock distribution delays
- Multiply or divide clock frequencies
- Generate phase-shifted clocks
- Improve setup and hold timing margins
XC2S200-6FGG1038C vs. Other Spartan-II Family Members
The table below compares all Spartan-II FPGA family members to help you select the right device for your design:
| Device |
Logic Cells |
System Gates |
CLB Array |
Total CLBs |
Max User I/O |
Dist. RAM (bits) |
Block RAM (bits) |
| XC2S15 |
432 |
15,000 |
8 × 12 |
96 |
86 |
6,144 |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
216 |
92 |
13,824 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
384 |
176 |
24,576 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
600 |
176 |
38,400 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
864 |
260 |
55,296 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
1,176 |
284 |
75,264 |
56K |
The XC2S200 is the flagship device of the family, offering the largest logic density, I/O count, and memory resources — making it the optimal choice for the most demanding applications in this series.
XC2S200-6FGG1038C: Features and Benefits
#### High-Density Programmable Logic
With 5,292 logic cells and a 200,000-gate equivalent capacity, the XC2S200 is suitable for complex digital designs that require substantial logic resources without moving to higher-cost FPGA families.
#### Fast -6 Speed Grade
The -6 speed grade is the fastest available in the Spartan-II family and is exclusively available in the commercial temperature range. This makes the XC2S200-6FGG1038C ideal for timing-critical applications requiring maximum clock performance.
#### Pb-Free (RoHS-Compliant) Package
The “G” in the package code (FGG) indicates a Pb-free, RoHS-compliant package — an important consideration for designs targeting environmentally regulated markets such as the EU.
#### Versatile I/O Standards
Support for over 10 different I/O standards allows seamless integration with legacy and modern interface buses, processors, and memory devices.
#### JTAG Boundary Scan
Full IEEE 1149.1 JTAG boundary scan support simplifies board-level testing and in-system programming/debugging.
#### SelectRAM™ Distributed Memory
In addition to block RAM, Spartan-II devices support distributed RAM built from LUT resources, providing 75,264 bits of flexible on-chip memory for the XC2S200.
Typical Applications for the XC2S200-6FGG1038C
The XC2S200-6FGG1038C is widely used across numerous industries and application domains, including:
| Application Area |
Use Cases |
| Industrial Automation |
Motion control, PLC co-processing, sensor fusion |
| Telecommunications |
Protocol bridging, line cards, framing logic |
| Embedded Processing |
Co-processors, memory controllers, bus interfaces |
| Test & Measurement |
Signal acquisition, pattern generation |
| Automotive Electronics |
Control units (with appropriate temp grade) |
| Consumer Electronics |
Image processing, display controllers |
| Medical Devices |
Data acquisition, diagnostic imaging |
Configuration and Programming
Supported Configuration Modes
The XC2S200-6FGG1038C supports several configuration modes to match various system boot architectures:
| Configuration Mode |
Description |
| Master Serial |
FPGA drives clock to serial PROM |
| Slave Serial |
External controller provides clock |
| Master Parallel (SelectMAP) |
8-bit parallel interface |
| JTAG / Boundary Scan |
IEEE 1149.1 compliant in-system programming |
| Slave Parallel (SelectMAP) |
Parallel loading from processor or CPLD |
FPGA Configuration Flow
- Design Entry — Use Xilinx ISE or equivalent schematic/HDL entry
- Synthesis — Convert RTL to a gate-level netlist
- Implementation — Map, place, and route to the XC2S200 device
- Bitstream Generation — Produce
.bit configuration file
- Programming — Load via JTAG or serial/parallel interface at power-up
Ordering Information and Part Number Variants
The XC2S200 is available in multiple package and speed grade combinations. The table below summarizes common orderable variants:
| Part Number |
Speed Grade |
Package |
Pins |
Temp Range |
Pb-Free |
| XC2S200-6FGG1038C |
-6 |
FBGA |
1038 |
Commercial |
Yes |
| XC2S200-6FGG456C |
-6 |
FBGA |
456 |
Commercial |
Yes |
| XC2S200-6FGG256C |
-6 |
FBGA |
256 |
Commercial |
Yes |
| XC2S200-6PQG208C |
-6 |
PQFP |
208 |
Commercial |
Yes |
| XC2S200-5FGG456I |
-5 |
FBGA |
456 |
Industrial |
Yes |
| XC2S200-5FGG256I |
-5 |
FBGA |
256 |
Industrial |
Yes |
Note: The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). For industrial temperature range (-40°C to +85°C), use the -5 speed grade.
Why Choose the XC2S200-6FGG1038C?
The XC2S200-6FGG1038C stands out as the highest-density, fastest-speed, Pb-free variant of the Spartan-II series packaged in a large 1038-ball BGA form factor. This package provides:
- Maximum pin accessibility for designs requiring large I/O counts with relaxed PCB routing pitch constraints
- Pb-free compliance for global regulatory alignment
- Commercial-grade speed at the -6 performance level
- Cost-effective programmability as an alternative to custom ASICs
For engineers seeking a proven, reliable Xilinx programmable logic solution backed by extensive tool support and community resources, the XC2S200-6FGG1038C remains a solid choice in legacy and new designs alike.
Frequently Asked Questions (FAQ)
Q: What is the maximum I/O count of the XC2S200-6FGG1038C?
A: The XC2S200 supports up to 284 user I/Os. Note that four additional global clock/user input pins are not included in this count.
Q: Is the XC2S200-6FGG1038C RoHS compliant?
A: Yes. The “G” in the FGG package designator indicates a Pb-free, RoHS-compliant package.
Q: What design tools are compatible with the XC2S200-6FGG1038C?
A: The device is supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-II devices), as well as third-party synthesis tools such as Synopsys Synplify.
Q: What voltage does the XC2S200-6FGG1038C operate at?
A: The core logic (VCCINT) operates at 2.5V. The I/O banks (VCCO) support 1.5V, 2.5V, or 3.3V depending on the target I/O standard.
Q: Can the XC2S200-6FGG1038C be used in industrial temperature applications?
A: The -6 speed grade (as in this part number) is rated for commercial temperature only (0°C to +85°C). For industrial temperature requirements, select a -5 speed grade variant with the “I” suffix.
Summary
The XC2S200-6FGG1038C is a powerful, flexible, and cost-efficient FPGA solution ideal for a wide range of digital design applications. With 200,000 system gates, 284 I/Os, 56Kb of block RAM, four DLLs, and the fastest -6 speed grade in a Pb-free 1038-ball BGA package, it delivers maximum performance within the Spartan-II family. Its support for multiple I/O standards, JTAG programming, and a mature tool ecosystem makes it a reliable choice for both new designs and legacy system maintenance.