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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1038C: Complete Guide to Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1038C is a high-performance, 2.5V programmable logic device from Xilinx’s Spartan-II FPGA family. Designed for cost-sensitive, high-volume applications, this device delivers up to 200,000 system gates, 284 user I/Os, and advanced clock management — all within a compact Fine-Pitch Ball Grid Array (FBGA) package. Whether you are designing industrial control systems, embedded processing platforms, or communications equipment, the XC2S200-6FGG1038C offers the flexibility and performance engineers demand.


What Is the XC2S200-6FGG1038C?

The XC2S200-6FGG1038C is a member of the Xilinx Spartan-II 2.5V FPGA family — one of the most widely deployed FPGA families in embedded and industrial markets. It is the largest device in the Spartan-II lineup, offering the maximum gate count and I/O resources available within this series.

For a broader selection of programmable logic solutions from Xilinx, visit Xilinx FPGA.

Part Number Breakdown

Understanding the part number helps you identify the exact variant for your design:

Code Segment Meaning Value in This Part
XC2S200 Device type (Spartan-II, 200K) 200,000 System Gates
-6 Speed Grade Fastest (-6) Commercial
FGG Package type (Fine-Pitch BGA, Pb-free) FBGA
1038 Pin count 1,038 balls
C Temperature range Commercial (0°C to +85°C)

XC2S200-6FGG1038C Key Specifications

Core Logic Resources

Parameter XC2S200 Specification
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K (56,000 bits)
Delay-Locked Loops (DLLs) 4

Electrical and Timing Characteristics

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V, 2.5V, or 3.3V
Speed Grade -6 (fastest in family)
Maximum System Clock Up to 200 MHz (typical)
Operating Temperature Range 0°C to +85°C (Commercial)

Package Information

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Package Code FGG (Pb-free)
Pin Count 1,038
Mounting Style Surface Mount Technology (SMT)

XC2S200-6FGG1038C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 Configurable Logic Blocks, arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This structure provides a rich fabric for implementing combinational and sequential logic efficiently.

Input/Output Blocks (IOBs)

With 284 user-programmable I/Os, the XC2S200-6FGG1038C supports a wide range of I/O standards, including:

  • LVTTL
  • LVCMOS2 / LVCMOS33
  • PCI (3.3V, 33 MHz and 66 MHz)
  • GTL / GTL+
  • SSTL2 and SSTL3
  • AGP
  • CTT
  • HSTL

Each IOB includes programmable pull-up, pull-down, and keeper circuitry, along with configurable output slew rate control for signal integrity management.

Block RAM

The XC2S200 includes 56Kb of dual-port block RAM, split into two columns on opposite sides of the device. Each block RAM can be configured as:

Configuration Depth × Width
Single-port mode 4K × 1 to 512 × 8
Dual-port mode Flexible widths

Block RAMs can be cascaded to implement larger memory structures such as FIFOs, look-up tables, or data buffers.

Delay-Locked Loops (DLLs)

The device incorporates four Delay-Locked Loops, one at each corner of the die. DLLs are used to:

  • Eliminate clock distribution delays
  • Multiply or divide clock frequencies
  • Generate phase-shifted clocks
  • Improve setup and hold timing margins

XC2S200-6FGG1038C vs. Other Spartan-II Family Members

The table below compares all Spartan-II FPGA family members to help you select the right device for your design:

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8 × 12 96 86 6,144 16K
XC2S30 972 30,000 12 × 18 216 92 13,824 24K
XC2S50 1,728 50,000 16 × 24 384 176 24,576 32K
XC2S100 2,700 100,000 20 × 30 600 176 38,400 40K
XC2S150 3,888 150,000 24 × 36 864 260 55,296 48K
XC2S200 5,292 200,000 28 × 42 1,176 284 75,264 56K

The XC2S200 is the flagship device of the family, offering the largest logic density, I/O count, and memory resources — making it the optimal choice for the most demanding applications in this series.


XC2S200-6FGG1038C: Features and Benefits

#### High-Density Programmable Logic

With 5,292 logic cells and a 200,000-gate equivalent capacity, the XC2S200 is suitable for complex digital designs that require substantial logic resources without moving to higher-cost FPGA families.

#### Fast -6 Speed Grade

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively available in the commercial temperature range. This makes the XC2S200-6FGG1038C ideal for timing-critical applications requiring maximum clock performance.

#### Pb-Free (RoHS-Compliant) Package

The “G” in the package code (FGG) indicates a Pb-free, RoHS-compliant package — an important consideration for designs targeting environmentally regulated markets such as the EU.

#### Versatile I/O Standards

Support for over 10 different I/O standards allows seamless integration with legacy and modern interface buses, processors, and memory devices.

#### JTAG Boundary Scan

Full IEEE 1149.1 JTAG boundary scan support simplifies board-level testing and in-system programming/debugging.

#### SelectRAM™ Distributed Memory

In addition to block RAM, Spartan-II devices support distributed RAM built from LUT resources, providing 75,264 bits of flexible on-chip memory for the XC2S200.


Typical Applications for the XC2S200-6FGG1038C

The XC2S200-6FGG1038C is widely used across numerous industries and application domains, including:

Application Area Use Cases
Industrial Automation Motion control, PLC co-processing, sensor fusion
Telecommunications Protocol bridging, line cards, framing logic
Embedded Processing Co-processors, memory controllers, bus interfaces
Test & Measurement Signal acquisition, pattern generation
Automotive Electronics Control units (with appropriate temp grade)
Consumer Electronics Image processing, display controllers
Medical Devices Data acquisition, diagnostic imaging

Configuration and Programming

Supported Configuration Modes

The XC2S200-6FGG1038C supports several configuration modes to match various system boot architectures:

Configuration Mode Description
Master Serial FPGA drives clock to serial PROM
Slave Serial External controller provides clock
Master Parallel (SelectMAP) 8-bit parallel interface
JTAG / Boundary Scan IEEE 1149.1 compliant in-system programming
Slave Parallel (SelectMAP) Parallel loading from processor or CPLD

FPGA Configuration Flow

  1. Design Entry — Use Xilinx ISE or equivalent schematic/HDL entry
  2. Synthesis — Convert RTL to a gate-level netlist
  3. Implementation — Map, place, and route to the XC2S200 device
  4. Bitstream Generation — Produce .bit configuration file
  5. Programming — Load via JTAG or serial/parallel interface at power-up

Ordering Information and Part Number Variants

The XC2S200 is available in multiple package and speed grade combinations. The table below summarizes common orderable variants:

Part Number Speed Grade Package Pins Temp Range Pb-Free
XC2S200-6FGG1038C -6 FBGA 1038 Commercial Yes
XC2S200-6FGG456C -6 FBGA 456 Commercial Yes
XC2S200-6FGG256C -6 FBGA 256 Commercial Yes
XC2S200-6PQG208C -6 PQFP 208 Commercial Yes
XC2S200-5FGG456I -5 FBGA 456 Industrial Yes
XC2S200-5FGG256I -5 FBGA 256 Industrial Yes

Note: The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). For industrial temperature range (-40°C to +85°C), use the -5 speed grade.


Why Choose the XC2S200-6FGG1038C?

The XC2S200-6FGG1038C stands out as the highest-density, fastest-speed, Pb-free variant of the Spartan-II series packaged in a large 1038-ball BGA form factor. This package provides:

  • Maximum pin accessibility for designs requiring large I/O counts with relaxed PCB routing pitch constraints
  • Pb-free compliance for global regulatory alignment
  • Commercial-grade speed at the -6 performance level
  • Cost-effective programmability as an alternative to custom ASICs

For engineers seeking a proven, reliable Xilinx programmable logic solution backed by extensive tool support and community resources, the XC2S200-6FGG1038C remains a solid choice in legacy and new designs alike.


Frequently Asked Questions (FAQ)

Q: What is the maximum I/O count of the XC2S200-6FGG1038C?
A: The XC2S200 supports up to 284 user I/Os. Note that four additional global clock/user input pins are not included in this count.

Q: Is the XC2S200-6FGG1038C RoHS compliant?
A: Yes. The “G” in the FGG package designator indicates a Pb-free, RoHS-compliant package.

Q: What design tools are compatible with the XC2S200-6FGG1038C?
A: The device is supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-II devices), as well as third-party synthesis tools such as Synopsys Synplify.

Q: What voltage does the XC2S200-6FGG1038C operate at?
A: The core logic (VCCINT) operates at 2.5V. The I/O banks (VCCO) support 1.5V, 2.5V, or 3.3V depending on the target I/O standard.

Q: Can the XC2S200-6FGG1038C be used in industrial temperature applications?
A: The -6 speed grade (as in this part number) is rated for commercial temperature only (0°C to +85°C). For industrial temperature requirements, select a -5 speed grade variant with the “I” suffix.


Summary

The XC2S200-6FGG1038C is a powerful, flexible, and cost-efficient FPGA solution ideal for a wide range of digital design applications. With 200,000 system gates, 284 I/Os, 56Kb of block RAM, four DLLs, and the fastest -6 speed grade in a Pb-free 1038-ball BGA package, it delivers maximum performance within the Spartan-II family. Its support for multiple I/O standards, JTAG programming, and a mature tool ecosystem makes it a reliable choice for both new designs and legacy system maintenance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.