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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1037C: Xilinx Spartan-II FPGA – Complete Product Guide

Product Details

The XC2S200-6FGG1037C is a high-density, 2.5V field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, cost-sensitive applications, this device delivers up to 200,000 system gates, 284 user I/O pins, and a 1037-ball Fine-Pitch BGA (FGG) package — making it one of the most capable members of the Spartan-II lineup. Whether you are a hardware engineer, procurement specialist, or embedded systems designer, this guide covers everything you need to know about the XC2S200-6FGG1037C specifications, features, ordering information, and applications.


What Is the XC2S200-6FGG1037C?

The XC2S200-6FGG1037C is part of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device built on an advanced 0.18 µm process technology. It is the largest device in the Spartan-II family, offering the highest gate count and I/O density in the series.

Part Number Breakdown

Understanding the part number helps confirm compatibility and ordering accuracy:

Field Code Description
Device Family XC2S Spartan-II FPGA
Gate Count 200 200,000 system gates
Speed Grade -6 Fastest commercial speed grade
Package Type FGG Fine-Pitch Ball Grid Array (Pb-free)
Pin Count 1037 1,037 solder balls
Temperature Range C Commercial (0°C to +85°C)

Note: The “G” in “FGG” denotes a Pb-free (RoHS-compliant) package, which is the lead-free version of the standard FG package.


XC2S200-6FGG1037C Key Specifications

Core Logic Resources

Parameter XC2S200 Specification
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K (56,000 bits)
Delay-Locked Loops (DLLs) 4

Electrical & Timing Specifications

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V
Speed Grade -6 (fastest in Spartan-II family)
Operating Temperature 0°C to +85°C (Commercial)
Technology Node 0.18 µm
Configuration Width Serial / Parallel SelectMAP

Package Information

Parameter Value
Package FGG1037 (Fine-Pitch BGA)
Total Pins / Balls 1,037
RoHS / Pb-free Yes (FGG = Pb-free variant)
Mounting Type Surface Mount

Spartan-II Family Comparison Table

The XC2S200 is the flagship device in the Spartan-II lineup. The table below compares all family members to help you select the right device for your design:

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 96 86 6,144 bits 16K
XC2S30 972 30,000 12×18 216 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 bits 56K

XC2S200-6FGG1037C Architecture & Key Features

Configurable Logic Blocks (CLBs)

The XC2S200 features a 28×42 array of CLBs, each containing two slices. Every slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), dedicated carry logic, and wide-function multiplexers. This flexible architecture supports efficient implementation of both combinatorial and registered logic.

Block RAM

The device integrates 56K bits of block RAM arranged in two columns along opposite sides of the die. Each block RAM supports true dual-port operation, configurable width/depth ratios, and synchronous operation — ideal for FIFOs, buffers, and on-chip data storage.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops are placed at the four corners of the die. DLLs provide zero-propagation-delay clock distribution, clock frequency synthesis (multiply/divide), and phase shifting — ensuring precise, low-skew clocking across the entire device.

Input/Output Blocks (IOBs)

The XC2S200 offers 284 user-configurable I/O pins supporting a wide range of interface standards, including LVTTL, LVCMOS (1.8V, 2.5V, 3.3V), PCI, GTL, GTL+, SSTL, and HSTL. Each IOB features programmable input delay, output slew-rate control, and optional weak pull-up/pull-down resistors.

Configuration Options

The device supports multiple configuration modes for maximum design flexibility:

Configuration Mode Description
Master Serial FPGA loads config from serial PROM
Slave Serial Config driven by external source
Master Parallel (SelectMAP) Parallel byte-wide configuration
Slave Parallel (SelectMAP) Byte-wide, externally controlled
JTAG (Boundary Scan) IEEE 1149.1 compliant

Why Choose the XC2S200-6FGG1037C?

✅ Highest Gate Count in Spartan-II Family

With 200,000 system gates and 5,292 logic cells, the XC2S200 is the most powerful device in the Spartan-II series — ideal for complex logic designs that require maximum capacity.

✅ Fastest Commercial Speed Grade (-6)

The -6 speed grade is the fastest available in the Spartan-II Commercial temperature range, ensuring the lowest propagation delays and highest system clock frequencies.

✅ Large BGA Package for High I/O Density

The FGG1037 package provides access to 284 user I/Os in a compact, surface-mount form factor — essential for signal-dense PCB designs.

✅ RoHS-Compliant (Pb-free)

The “FGG” variant is fully RoHS and Pb-free compliant, meeting international environmental regulations for electronics manufacturing.

✅ Cost-Effective Alternative to ASICs

The Spartan-II family was specifically designed as a superior, programmable alternative to mask-programmed ASICs, offering faster time-to-market, re-programmability, and significantly reduced NRE costs.


Typical Applications of the XC2S200-6FGG1037C

The XC2S200-6FGG1037C is widely used in industries requiring high-density, cost-optimized programmable logic:

Industry Application Examples
Telecommunications Protocol bridging, line cards, signal routing
Industrial Automation Motor control, PLC logic replacement, sensor interfacing
Consumer Electronics Video processing, display controllers
Medical Devices Data acquisition, signal conditioning
Embedded Computing Custom processor peripherals, memory controllers
Test & Measurement Pattern generation, data capture
Automotive (Industrial-grade variants) ECU interfaces, diagnostics

XC2S200-6FGG1037C vs. XC2S200-6FG1037C: What’s the Difference?

A common question when ordering is the difference between FGG and FG packages:

Feature XC2S200-6FG1037C XC2S200-6FGG1037C
Package Type Fine-Pitch BGA Fine-Pitch BGA
Lead (Pb) Content Standard (contains lead) Pb-free / RoHS compliant
RoHS Compliance No Yes
Pin Count 1,037 1,037
Functionality Identical Identical

The FGG variant is the preferred choice for modern designs requiring RoHS compliance for export and sale in the EU, UK, China, and other regulated markets.


Ordering Information & Part Number Guide

When sourcing the XC2S200-6FGG1037C, ensure you verify the complete part number to avoid receiving incompatible variants. Key parameters to confirm:

  • Device: XC2S200 (200K gates, Spartan-II)
  • Speed Grade: -6 (commercial, fastest grade)
  • Package: FGG1037 (Pb-free, 1037-ball Fine-Pitch BGA)
  • Temperature: C (Commercial: 0°C to +85°C)

For a broader selection of Spartan-II and other Xilinx programmable logic devices, explore the full range of Xilinx FPGA products available from trusted distributors.


Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1037C used for?

The XC2S200-6FGG1037C is a programmable logic device used in telecommunications, industrial automation, embedded computing, medical equipment, and consumer electronics for custom digital logic implementation.

Is the XC2S200-6FGG1037C RoHS compliant?

Yes. The “FGG” package designation indicates a Pb-free, RoHS-compliant package. It is safe for use in environmentally regulated markets globally.

What is the maximum operating frequency of the XC2S200-6FGG1037C?

The maximum frequency depends on the implemented logic design, but the -6 speed grade is the fastest available in the Spartan-II Commercial range, with typical toggle frequencies exceeding 200 MHz for simple register paths.

What tools are used to program the XC2S200-6FGG1037C?

Xilinx ISE Design Suite (version 14.7 is the last version to support Spartan-II) is used for synthesis, implementation, and bitstream generation. JTAG-based programming cables (Xilinx Platform Cable USB) are used for device configuration.

Is the XC2S200-6FGG1037C still in production?

The Spartan-II family has reached end-of-life status. However, the XC2S200-6FGG1037C remains widely available through authorized distributors and component brokers for maintenance, repair, and legacy system upgrades.


Summary

The XC2S200-6FGG1037C is the premium configuration of Xilinx’s Spartan-II FPGA family — combining the highest logic density (200,000 system gates), the fastest commercial speed grade (-6), 284 user I/Os, 56K bits of block RAM, and a 1037-ball Pb-free BGA package. It remains a reliable, proven choice for engineers maintaining legacy designs or developing new cost-optimized solutions where programmable logic flexibility is essential.

Summary Specification Value
Part Number XC2S200-6FGG1037C
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
User I/O 284
Block RAM 56K bits
Speed Grade -6 (Commercial)
Package FGG1037 (Pb-free BGA)
Operating Temp 0°C to +85°C
Core Voltage 2.5V
RoHS Compliant Yes

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.