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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC4085XLA-O8BGG432I: High-Performance Xilinx XC4000XLA FPGA

Product Details

The XC4085XLA-O8BGG432I is a high-density, low-voltage field-programmable gate array (FPGA) from Xilinx’s XC4000XLA family. Designed for demanding industrial and commercial applications, this device delivers exceptional logic density, advanced I/O flexibility, and reliable operation in extended temperature environments. Whether you are designing embedded systems, communications hardware, or digital signal processing circuits, the XC4085XLA-O8BGG432I provides the programmable logic resources to meet your requirements.

For engineers seeking a broad portfolio of programmable logic solutions, explore our full range of Xilinx FPGA products.


XC4085XLA-O8BGG432I Key Specifications at a Glance

Parameter Value
Manufacturer Part Number XC4085XLA-O8BGG432I
Manufacturer Xilinx (now AMD)
Family XC4000XLA
Package 432-Ball BGA (BG432)
Logic Cells ~85,000 (equivalent)
Speed Grade -08
Supply Voltage (VCC) 2.5V (XLA low-voltage series)
I/O Voltage 3.3V tolerant
Temperature Range Industrial (-40°C to +85°C)
Operating Frequency Up to 80 MHz (speed grade dependent)
Configuration Interface Master/Slave Serial, SelectMAP
RoHS Status Consult manufacturer

What Is the XC4085XLA-O8BGG432I?

The XC4085XLA-O8BGG432I is a member of Xilinx’s XC4000XLA architecture — an advanced evolution of the classic XC4000 FPGA family optimized for lower core voltages (2.5V) without sacrificing performance. The “XLA” designation refers to the extended low-voltage architecture, which reduces power consumption compared to standard 5V and 3.3V predecessors while maintaining compatibility with 3.3V I/O standards.

The part number suffix breakdown is as follows:

Segment Meaning
XC4085 85K-gate-equivalent logic density
XLA Extended Low-voltage Architecture (2.5V core)
-O8 Speed grade -08 (commercial to industrial)
BG Ball Grid Array package type
G432 432-ball BGA package
I Industrial temperature range (-40°C to +85°C)

XC4085XLA-O8BGG432I Architecture and Logic Resources

Configurable Logic Blocks (CLBs)

The XC4085XLA-O8BGG432I uses Xilinx’s proven CLB-based architecture, where each Configurable Logic Block contains:

  • Two independent 4-input Look-Up Tables (LUTs) capable of implementing any 4-input logic function
  • Dedicated fast carry logic for high-speed arithmetic operations
  • Two flip-flops per CLB for sequential logic
  • Wide function multiplexers for combining logic across multiple CLBs
  • Internal 3-state buffers for local bus implementations

On-Chip Memory

Memory Feature Details
Distributed RAM Implemented using LUTs as RAM cells
Block RAM Dedicated SRAM blocks available within the architecture
Shift Registers Configurable via LUT-based shift register mode

I/O Capabilities

The 432-ball BGA package provides a large number of user I/O pins, making this device well-suited for designs requiring extensive bus interfaces or peripheral connectivity.

I/O Feature Specification
Total Package Pins 432
User I/O (approximate) 256–320
I/O Standards Supported LVTTL, LVCMOS, PCI (3.3V)
Drive Strength Programmable (2mA to 24mA)
Slew Rate Control Yes (fast/slow selectable)
Input Hysteresis Optional Schmitt trigger inputs
Pull-up / Pull-down Programmable per I/O pin

XC4085XLA-O8BGG432I Package Information

The BG432 (432-Ball BGA) package is a surface-mount ball grid array that offers excellent PCB routing density due to its area-array pin distribution. This package is favored in space-constrained designs where high pin counts must fit within a compact footprint.

Package Attribute Value
Package Type Ball Grid Array (BGA)
Ball Count 432
Body Size 23 mm × 23 mm (approximate)
Ball Pitch 1.00 mm
Ball Diameter 0.60 mm (approximate)
Mounting Surface Mount Technology (SMT)
PCB Land Pattern Standard BGA footprint

PCB Design Considerations for the BG432 Package

When designing a PCB for the XC4085XLA-O8BGG432I, engineers should account for:

  • Via-in-pad or dogbone fanout strategies to escape inner ball rows
  • A minimum of 8 PCB layers recommended for full signal and power/ground plane integrity
  • Controlled impedance routing for high-speed I/O and clock signals
  • Proper decoupling capacitor placement near VCC and VCCIO balls for noise suppression
  • Thermal relief considerations given the BGA’s center thermal pad (if present)

Electrical Characteristics and Power Requirements

Absolute Maximum Ratings

Parameter Value
Core Supply Voltage (VCCINT) 2.5V ±10%
I/O Supply Voltage (VCCIO) 3.3V max
Storage Temperature -65°C to +150°C
Operating Temperature (Industrial) -40°C to +85°C

Typical Power Consumption

Power consumption in FPGAs depends heavily on design utilization and operating frequency. The XC4085XLA-O8BGG432I’s 2.5V core voltage provides a measurable reduction in dynamic power versus earlier 3.3V XC4000E/L devices.

Condition Estimated ICCINT
Static (no switching) ~50–100 mA
Typical application (50% utilization, 40 MHz) ~200–400 mA
Maximum (full utilization, max frequency) Consult Xilinx datasheet

Configuration and Programming

Supported Configuration Modes

The XC4085XLA-O8BGG432I supports multiple configuration modes to suit different system architectures:

Configuration Mode Description
Master Serial FPGA generates CCLK; reads bitstream from serial PROM
Slave Serial External logic provides CCLK and bitstream data
Master Parallel (SelectMAP) High-speed byte-wide parallel configuration
Slave Parallel (SelectMAP) External processor drives parallel config interface
Boundary Scan (JTAG) IEEE 1149.1-compliant in-system programming and debug

Configuration Storage Options

Because FPGAs are volatile (they lose configuration on power-off), the bitstream must be stored externally and loaded on every power cycle. Common storage solutions include:

  • Xilinx Platform Flash (XCF series) — serial PROM optimized for Xilinx FPGAs
  • Parallel NOR Flash — used with SelectMAP mode for faster configuration
  • Microcontroller-driven — embedded processor streams bitstream via JTAG or SelectMAP
  • EPROM / Parallel PROM — legacy storage option for older system designs

Timing and Clock Resources

Global Clock Networks

The XC4085XLA-O8BGG432I provides dedicated global clock routing that minimizes clock skew across the entire device:

Clock Feature Details
Global Clock Inputs 4 dedicated global clock buffers
Clock Skew <1 ns across the full device
DLL / DCM Not available in XC4000XLA (available in Virtex and later)
Internal Oscillator Not present

Speed Grade -08 Performance

The -08 speed grade indicates the device’s timing performance tier. In the XC4000XLA numbering convention, smaller numbers indicate faster devices.

Timing Parameter XC4085XLA-08
Maximum System Clock (Fmax) ~80 MHz (design-dependent)
CLB-to-CLB Propagation Delay ~2–5 ns
Setup Time (flip-flop) ~3 ns
Clock-to-Output Delay ~5–8 ns

Note: Actual achievable frequency depends on the specific design, routing congestion, and temperature.


Industrial Temperature Range Advantages

The “I” suffix in XC4085XLA-O8BGG432I confirms the industrial temperature rating, which is critical for systems deployed in environments with wide thermal variation. Industrial-grade FPGAs are characterized to operate reliably from -40°C to +85°C, unlike commercial-grade parts limited to 0°C to +70°C.

Temperature Grade Range Typical Applications
Commercial (C) 0°C to +70°C Office equipment, consumer electronics
Industrial (I) -40°C to +85°C Factory automation, telecom, test equipment
Military/Automotive -55°C to +125°C Defense, aerospace, automotive ECUs

The XC4085XLA-O8BGG432I’s industrial rating makes it particularly suitable for:

  • Industrial control systems and PLCs
  • Telecommunications infrastructure equipment
  • Medical instrumentation operating in varied environments
  • Test and measurement systems requiring long lifecycle operation

XC4085XLA-O8BGG432I vs. Related Parts Comparison

Part Number Logic Gates Package Speed Grade Temp Range Core Voltage
XC4085XLA-O8BGG432I ~85K BG432 -08 Industrial 2.5V
XC4085XLA-08BG432C ~85K BG432 -08 Commercial 2.5V
XC4062XLA-08BG432I ~62K BG432 -08 Industrial 2.5V
XC4036XLA-08BG432I ~36K BG432 -08 Industrial 2.5V
XC4085XL-08BG432I ~85K BG432 -08 Industrial 3.3V

The XC4085XLA-O8BGG432I is the industrial temperature counterpart to the XC4085XLA-08BG432C, offering identical logic resources and performance in a wider temperature specification.


Applications for the XC4085XLA-O8BGG432I

The combination of high logic density (~85K gates), a large 432-ball BGA package, industrial temperature rating, and mature XC4000XLA architecture makes this device a strong choice across a wide range of applications:

Digital Signal Processing (DSP)

Finite Impulse Response (FIR) filters, FFT engines, and signal conditioning pipelines leverage the device’s CLB arithmetic resources and fast carry chains.

Communications and Networking

Protocol conversion, line interface logic, SONET/SDH framers, and custom MAC layer implementations benefit from the XC4085XLA’s I/O flexibility and logic density.

Industrial Automation

Motion control, PLC I/O expansion, fieldbus bridges (CANopen, PROFIBUS adapters), and safety logic benefit from the wide industrial temperature range.

Embedded System Co-Processing

Pairing with microcontrollers or microprocessors, the FPGA handles hardware-accelerated tasks including interrupt management, DMA control, and custom peripheral interfaces.

Legacy System Maintenance and Replacement

The XC4085XLA-O8BGG432I is widely used for sustaining engineering — replacing obsolete ASICs, gate arrays, or earlier-generation FPGAs with a re-programmable, sourced solution through distributors like Rochester Electronics.


Why Source the XC4085XLA-O8BGG432I Through Authorized Distributors?

The XC4000XLA family has reached end-of-life status with AMD (formerly Xilinx), making authorized independent distributors like Rochester Electronics a critical supply chain partner. Rochester Electronics specializes in the authorized production and supply of end-of-life semiconductors, including the XC4085XLA series.

Benefits of Authorized Sourcing

Benefit Description
Guaranteed Authenticity Parts sourced directly from original manufacturer or licensed production
Traceability Full supply chain documentation from wafer to finished device
Longevity Multi-year supply commitments for maintenance programs
Quality Assurance IEC/ISO-certified testing and inspection processes
Technical Support Application engineering support for design-in and obsolescence migration

Frequently Asked Questions (FAQ)

Q: What is the difference between XC4085XLA-O8BGG432I and XC4085XLA-08BG432C? A: The only difference is the temperature rating. The “I” suffix indicates industrial grade (-40°C to +85°C), while the “C” suffix indicates commercial grade (0°C to +70°C). All logic, package, and speed specifications are identical.

Q: Is the XC4085XLA-O8BGG432I still in production? A: The XC4000XLA family has been discontinued by AMD/Xilinx. However, authorized distributors such as Rochester Electronics continue to supply these parts from existing inventory or through licensed re-manufacturing.

Q: Can I use Xilinx ISE to design for the XC4085XLA-O8BGG432I? A: Yes. Xilinx ISE Design Suite (Legacy) supports the full XC4000XLA family. Note that Vivado does not support this older device family. ISE 14.7 is the final version and remains available for download from AMD’s support archives.

Q: What configuration PROM is compatible with the XC4085XLA-O8BGG432I? A: Xilinx XCF Platform Flash PROMs (e.g., XCF08P or XCF16P) are commonly used. Alternatively, any standard serial PROM with SPI or byte-wide parallel interface compatible with the SelectMAP mode can be used.

Q: What is the bitstream size for the XC4085XLA? A: Approximately 2–4 MB depending on configuration mode and compression. Consult the Xilinx XC4000XLA/XV datasheet for exact frame counts and bitstream length.


Summary

The XC4085XLA-O8BGG432I is a proven, high-density FPGA offering approximately 85,000 logic gate equivalents in a 432-ball BGA package, rated for industrial temperatures from -40°C to +85°C. Its 2.5V core voltage (XLA series), -08 speed grade targeting up to ~80 MHz system clock, and mature CLB-based architecture make it an enduring choice for industrial, communications, and embedded applications — as well as a go-to solution for ASIC and legacy FPGA replacement programs.

For long-term procurement, verify current stock availability through authorized distributors to ensure full traceability and counterfeit protection.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.