Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1033C: Xilinx Spartan-II FPGA – Complete Product Guide

Product Details

The XC2S200-6FGG1033C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and operates at a 2.5V core voltage — making it an ideal solution for engineers seeking a flexible, programmable alternative to mask-programmed ASICs. Whether you’re developing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG1033C provides the logic density, I/O flexibility, and speed you need.


What Is the XC2S200-6FGG1033C?

The XC2S200-6FGG1033C is part of the Xilinx Spartan-II FPGA family, a series of 2.5V programmable logic devices engineered for cost-sensitive, high-volume production environments. The part number breaks down as follows:

Part Number Segment Description
XC2S200 Spartan-II device with 200,000 system gates
-6 Speed Grade 6 (fastest available for commercial range)
FGG Fine Pitch Ball Grid Array, Pb-free (green) package
1033 1,033-ball package
C Commercial temperature range (0°C to +85°C)

Note: The -6 speed grade is exclusively available in the commercial temperature range, making the XC2S200-6FGG1033C a top-tier choice for high-speed commercial designs.


XC2S200-6FGG1033C Key Specifications

Core Device Specifications

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Core Voltage 2.5V
Speed Grade -6 (fastest commercial)
Temperature Range Commercial (0°C to +85°C)
Package Type FGG (Fine Pitch BGA, Pb-free)
Pin Count 1,033

Delay-Locked Loops (DLL) & Clock Management

Feature Detail
Number of DLLs 4 (one at each corner of the die)
Clock Distribution Dedicated global clock routing network
Global Clock Inputs 4 dedicated pins (not included in user I/O count)

XC2S200-6FGG1033C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 is built around a regular, flexible array of Configurable Logic Blocks (CLBs). Each CLB contains four-input Look-Up Tables (LUTs), flip-flops, and dedicated carry logic, enabling efficient implementation of both combinatorial and sequential logic functions. With 1,176 total CLBs arranged in a 28×42 grid, this device can handle complex digital designs ranging from state machines to DSP pipelines.

Input/Output Blocks (IOBs)

The device features a perimeter of programmable Input/Output Blocks (IOBs) supporting up to 284 user I/O pins. Each IOB supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and more — giving designers maximum flexibility when interfacing with external components.

Block RAM

Two dedicated columns of Block RAM are embedded within the fabric, providing 56K bits (56,000 bits) of on-chip storage. Block RAM is ideal for FIFOs, lookup tables, and local data buffering, reducing the need for external memory in many applications.

Distributed RAM

In addition to block RAM, the CLB-based distributed RAM offers 75,264 bits of flexible, high-speed storage distributed throughout the logic fabric — perfect for small memory structures like register files and shift registers.


Spartan-II Family Comparison Table

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 96 86 6,144 bits 16K
XC2S30 972 30,000 12×18 216 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 bits 56K

The XC2S200 sits at the top of the Spartan-II lineup, delivering the highest logic density, largest CLB array, most user I/O, and the greatest RAM resources in the family.


Ordering Information & Part Number Decoder

Xilinx Spartan-II devices follow a standardized ordering code structure. Understanding the part number helps engineers confirm compatibility before purchasing.

Ordering Code Structure

XC2S200 - 6 - FGG - 1033 - C
  │        │    │     │     └─ Temperature: C = Commercial (0°C to +85°C)
  │        │    │     └─────── Pin Count: 1033 balls
  │        │    └───────────── Package: FGG = Fine Pitch BGA, Pb-free
  │        └────────────────── Speed Grade: -6 (fastest commercial)
  └─────────────────────────── Device: XC2S200 Spartan-II, 200K gates

Package & Temperature Options

Package Code Package Type Pb-Free?
FG Fine Pitch BGA Standard
FGG Fine Pitch BGA ✅ Yes (Pb-free / Green)
PQ Plastic Quad Flat Pack Standard
PQG Plastic Quad Flat Pack ✅ Yes (Pb-free / Green)
Temperature Code Range Description
C 0°C to +85°C Commercial
I -40°C to +100°C Industrial

Key Features of the XC2S200-6FGG1033C

  • 200,000 system gates — largest device in the Spartan-II family
  • 5,292 logic cells with fast CLB-based architecture
  • 284 maximum user I/O with support for multiple I/O standards
  • Speed Grade -6 — the fastest commercial speed option available
  • Four Delay-Locked Loops (DLLs) for clock management and skew elimination
  • 75,264 bits distributed RAM + 56K bits block RAM
  • 2.5V core voltage for low-power operation
  • Pb-free (FGG) packaging — RoHS compliant
  • JTAG boundary scan (IEEE 1149.1) support
  • Infinite reprogrammability — non-volatile via external PROM

Supported I/O Standards

The XC2S200-6FGG1033C IOBs support a wide range of industry-standard interfaces, making system-level integration straightforward:

I/O Standard Type
LVTTL Single-ended
LVCMOS2 Single-ended
PCI (3.3V) Single-ended
GTL / GTL+ Open-drain
SSTL2 Class I & II Differential
AGP-2x Single-ended
CTT Single-ended

Typical Applications of the XC2S200-6FGG1033C

The XC2S200-6FGG1033C is widely used across a broad range of industries and applications:

  • Telecommunications: Protocol bridging, data framing, line card control
  • Industrial Automation: Motor control, PLC logic, sensor interfaces
  • Embedded Systems: Co-processor acceleration, memory controllers
  • Consumer Electronics: Signal processing, display controllers
  • Medical Devices: Data acquisition, real-time processing
  • Networking: Packet processing, switching fabric control
  • Test & Measurement: Logic analysis, signal generation

Why Choose the XC2S200-6FGG1033C Over ASICs?

Unlike mask-programmed ASICs, the XC2S200-6FGG1033C offers:

Feature XC2S200-6FGG1033C (FPGA) Mask-Programmed ASIC
Non-Recurring Engineering Cost None High ($500K–$5M+)
Time to Market Days to weeks 6–18 months
Design Flexibility Fully reprogrammable Fixed after fabrication
Prototype Risk Very low High
Volume Suitability High-volume friendly Only cost-effective at very high volumes

For volume production with tight schedules and the need for field updates, the XC2S200-6FGG1033C is the preferred alternative.


Configuration & Programming

Spartan-II FPGAs like the XC2S200-6FGG1033C are SRAM-based and require configuration at power-up. Configuration data is typically stored in an external Xilinx Platform Flash PROM or standard serial/parallel flash memory. Supported configuration modes include:

  • Master Serial – using an external serial PROM
  • Slave Serial – driven by an external controller
  • Master Parallel (SelectMAP) – high-speed 8-bit parallel loading
  • JTAG – in-system programming and debugging

Design Tools & Software Support

The XC2S200-6FGG1033C is fully supported by Xilinx design tools:

Tool Description
Xilinx ISE Design Suite Complete FPGA design flow (synthesis, P&R, bitstream)
ChipScope Pro In-system debug and logic analysis
CORE Generator Pre-built IP cores for fast integration
ModelSim / Vivado Simulator HDL simulation support

HDL support includes both VHDL and Verilog, and the device is also compatible with third-party synthesis tools such as Synopsys Synplify.


XC2S200-6FGG1033C vs. Similar Devices

Part Number Gates Speed Grade Package Pins Pb-Free Temp
XC2S200-6FGG1033C 200K -6 FGG BGA 1033 Commercial
XC2S200-6FGG456C 200K -6 FGG BGA 456 Commercial
XC2S200-6FG456C 200K -6 FG BGA 456 Commercial
XC2S200-5FGG456I 200K -5 FGG BGA 456 Industrial
XC2S150-6FGG456C 150K -6 FGG BGA 456 Commercial

The XC2S200-6FGG1033C stands out with the highest pin count (1,033) in the Spartan-II lineup, making it the best choice when maximum I/O connectivity is required alongside top-tier speed and logic density.


Frequently Asked Questions (FAQ)

What does the “G” in FGG mean?

The “G” in the package code indicates Pb-free (lead-free) packaging, compliant with RoHS environmental regulations. The standard non-Pb-free version uses the “FG” designation.

Is the XC2S200-6FGG1033C still in production?

The Spartan-II series is a mature product line. Availability may be limited to distributor stock. Always verify current availability with your authorized distributor before designing in this component for new projects.

What is the difference between speed grade -5 and -6?

Speed grade -6 is faster than -5, offering shorter propagation delays and higher operating frequencies. However, -6 is only available in the commercial temperature range (0°C to +85°C). Industrial temperature range devices are limited to -5.

Can the XC2S200-6FGG1033C be reprogrammed in the field?

Yes. Because Spartan-II FPGAs are SRAM-based, the configuration bitstream can be reloaded at any power cycle from an updated external PROM, enabling field updates and bug fixes without hardware replacement.


Where to Buy the XC2S200-6FGG1033C

The XC2S200-6FGG1033C is available through authorized electronic component distributors. When sourcing this part, verify:

  • Authenticity — purchase only from authorized or reputable distributors
  • Date code — check for recent manufacturing dates
  • RoHS compliance — confirmed by the “FGG” Pb-free designation

For a broader selection of Xilinx FPGA products including Spartan, Artix, Kintex, Virtex, and Zynq families, explore trusted component sources that specialize in programmable logic devices.


Summary

The XC2S200-6FGG1033C is a mature, proven Xilinx Spartan-II FPGA that continues to serve engineers in commercial applications requiring high gate density, maximum I/O count, and the fastest available speed grade. With 200,000 system gates, 284 user I/Os, 4 DLLs, and Pb-free packaging in a 1,033-ball FGG BGA, it represents the pinnacle of the Spartan-II family. Its reprogrammable nature, broad I/O standard support, and competitive cost structure make it a reliable choice for anyone seeking a flexible, proven alternative to fixed-function ASICs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.