The XC2S200-6FGG1031C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for commercial-grade applications, this device delivers 200,000 system gates, a 1031-ball Fine Pitch BGA package, and a -6 speed grade — making it one of the most capable members of the Spartan-II lineup. Whether you are an embedded systems engineer, hardware designer, or procurement specialist, this guide covers everything you need to know about the XC2S200-6FGG1031C FPGA.
What Is the XC2S200-6FGG1031C FPGA?
The XC2S200-6FGG1031C is a member of the Xilinx Spartan-II FPGA family, a 2.5V programmable logic device built on 0.18µm CMOS process technology. It is part number that breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II device with 200K system gates |
| -6 |
Speed Grade 6 (fastest in the family) |
| FGG |
Fine Pitch Ball Grid Array (Pb-free) |
| 1031 |
1031-pin package |
| C |
Commercial temperature range (0°C to +85°C) |
For a broader look at the full Spartan-II product lineup, visit Xilinx FPGA for detailed comparison and sourcing information.
XC2S200-6FGG1031C Key Specifications
Core Logic Specifications
| Parameter |
XC2S200 Value |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 bits |
| Block RAM Bits |
56K bits |
| Delay-Locked Loops (DLLs) |
4 |
Device Identification & Ordering Details
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Part Number |
XC2S200-6FGG1031C |
| FPGA Family |
Spartan-II |
| Speed Grade |
-6 (Commercial only) |
| Package Type |
FGG (Fine Pitch BGA, Pb-free) |
| Pin Count |
1031 |
| Operating Voltage |
2.5V core |
| Temperature Range |
Commercial (0°C to +85°C) |
| Process Technology |
0.18µm CMOS |
XC2S200-6FGG1031C Features and Architecture
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1031C features 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells, enabling highly parallel, flexible design implementations. The CLB architecture supports:
- Look-Up Tables (LUTs) for combinatorial logic
- Flip-flops for sequential logic
- Distributed RAM for small on-chip memory needs
- Fast carry and arithmetic logic chains
Input/Output Blocks (IOBs)
The device provides up to 284 user-programmable I/Os, each supported by a flexible IOB. IOB capabilities include:
- Selectable input delay for setup time control
- Programmable drive strength
- Multiple I/O standards support (LVTTL, LVCMOS, GTL, SSTL, and more)
- Slew-rate control for EMI management
Block RAM
The XC2S200-6FGG1031C includes 56K bits of block RAM organized in two columns on either side of the CLB array. Block RAM features:
- Synchronous read and write operations
- Dual-port access capability
- Configurable word widths
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops are embedded — one at each corner of the die. DLLs provide:
- Clock deskewing and edge alignment
- Frequency synthesis and multiplication
- Duty-cycle correction
Spartan-II Family Comparison: Where Does XC2S200 Fit?
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Dist. RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 bits |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, most I/O pins, and the largest memory resources.
XC2S200-6FGG1031C Speed Grade: Understanding the -6 Rating
The -6 speed grade is the fastest available in the Spartan-II family and is exclusively available in the commercial temperature range. This makes the XC2S200-6FGG1031C ideal for high-speed digital design applications where maximum operating frequency is critical.
Speed Grade Comparison
| Speed Grade |
Temperature Range |
Typical Max Frequency |
Availability |
| -5 |
Commercial & Industrial |
Standard |
General |
| -6 |
Commercial only |
Highest |
Limited |
Package Information: FGG1031 Fine Pitch BGA
The FGG1031 package designation indicates a Pb-free (RoHS-compliant) Fine Pitch Ball Grid Array with 1,031 solder balls. The “G” in FGG distinguishes the lead-free variant from the standard FG package.
FGG1031 Package Highlights
| Package Attribute |
Value |
| Package Type |
Fine Pitch BGA |
| Total Balls |
1,031 |
| RoHS Compliance |
Yes (Pb-free) |
| Mounting |
Surface Mount (SMD) |
| PCB Design Complexity |
High-density BGA routing required |
Typical Applications for XC2S200-6FGG1031C
The XC2S200-6FGG1031C is widely deployed across industries where cost-effective programmable logic, fast performance, and a rich I/O count are required. Common application areas include:
- Telecommunications – Line cards, protocol bridging, and switching fabrics
- Industrial Automation – Motor control, sensor interfaces, and real-time control loops
- Consumer Electronics – Display controllers, image processing pipelines
- Embedded Computing – Co-processing and hardware acceleration
- Test & Measurement – Signal acquisition, data capture, and pattern generation
- Networking – Packet processing, Ethernet MAC/PHY interfacing
XC2S200-6FGG1031C vs. Comparable FPGAs
| Feature |
XC2S200-6FGG1031C |
XC2S150-6FGG456C |
XC3S200-4FGG320C |
| Family |
Spartan-II |
Spartan-II |
Spartan-3 |
| System Gates |
200K |
150K |
200K |
| Logic Cells |
5,292 |
3,888 |
4,320 |
| Max I/O |
284 |
260 |
173 |
| Block RAM |
56K |
48K |
216K |
| Core Voltage |
2.5V |
2.5V |
1.2V |
| Package Pins |
1031 |
456 |
320 |
Configuration and Design Tools
The XC2S200-6FGG1031C is configured using a bitstream loaded at power-up via one of several configuration modes:
- Master Serial / Slave Serial – Simple SPI-based configuration
- Master Parallel / Slave Parallel – Faster parallel bus configuration
- JTAG Boundary Scan – IEEE 1149.1 compliant for in-system programming and debug
Supported Design Tools
| Tool |
Vendor |
Use Case |
| ISE Design Suite |
Xilinx (legacy) |
Synthesis, P&R, Bitstream generation |
| ModelSim / XSIM |
Mentor / Xilinx |
RTL Simulation |
| Synplify Pro |
Synopsys |
Third-party synthesis |
| ChipScope Pro |
Xilinx |
On-chip debug and logic analysis |
Note: The Spartan-II family is supported through Xilinx ISE. Vivado does not support the Spartan-II architecture.
Ordering Information & Part Number Decoder
When ordering the XC2S200-6FGG1031C, understanding the full part number ensures you receive the correct device:
XC 2S 200 -6 FGG 1031 C
| | | | | | |
| | | | | | └─ Temperature: C = Commercial (0 to +85°C)
| | | | | └──────── Pin Count: 1031
| | | | └───────────── Package: FGG = Fine Pitch BGA, Pb-free
| | | └───────────────── Speed Grade: -6 (fastest)
| | └────────────────────── Gate Count: 200K
| └────────────────────────── Family: Spartan-II (2S)
└────────────────────────────── Xilinx Device Prefix
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1031C used for?
The XC2S200-6FGG1031C is used in applications requiring high-speed, high-density programmable logic — including telecom, industrial control, networking, and embedded processing systems.
Is XC2S200-6FGG1031C RoHS compliant?
Yes. The “G” in the FGG package designation indicates that this is a Pb-free (lead-free), RoHS-compliant package.
What software is used to program the XC2S200-6FGG1031C?
The device is programmed using Xilinx ISE Design Suite. HDL designs written in VHDL or Verilog are synthesized, placed, routed, and then generated as a bitstream for loading onto the FPGA.
What is the operating voltage of XC2S200-6FGG1031C?
The core operating voltage is 2.5V, while I/O voltage can vary depending on the configured I/O standard.
Can the XC2S200-6FGG1031C operate in industrial temperature ranges?
No. The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). For industrial temperature (-40°C to +85°C), the -5 speed grade must be used.
Summary: Why Choose the XC2S200-6FGG1031C?
The XC2S200-6FGG1031C is the flagship of the Xilinx Spartan-II family, offering the highest logic capacity (200K gates / 5,292 cells), the widest I/O count (284 pins), and the fastest speed grade (-6) available in its generation. With its Pb-free FGG1031 BGA package, it satisfies modern environmental compliance requirements while delivering proven, reliable FPGA performance for commercial-grade designs.
If you are sourcing Xilinx FPGAs or need expert guidance on device selection, visit Xilinx FPGA to explore inventory, datasheets, and technical support