Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1031C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1031C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for commercial-grade applications, this device delivers 200,000 system gates, a 1031-ball Fine Pitch BGA package, and a -6 speed grade — making it one of the most capable members of the Spartan-II lineup. Whether you are an embedded systems engineer, hardware designer, or procurement specialist, this guide covers everything you need to know about the XC2S200-6FGG1031C FPGA.


What Is the XC2S200-6FGG1031C FPGA?

The XC2S200-6FGG1031C is a member of the Xilinx Spartan-II FPGA family, a 2.5V programmable logic device built on 0.18µm CMOS process technology. It is part number that breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed Grade 6 (fastest in the family)
FGG Fine Pitch Ball Grid Array (Pb-free)
1031 1031-pin package
C Commercial temperature range (0°C to +85°C)

For a broader look at the full Spartan-II product lineup, visit Xilinx FPGA for detailed comparison and sourcing information.


XC2S200-6FGG1031C Key Specifications

Core Logic Specifications

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM Bits 75,264 bits
Block RAM Bits 56K bits
Delay-Locked Loops (DLLs) 4

Device Identification & Ordering Details

Parameter Value
Manufacturer Xilinx (AMD)
Part Number XC2S200-6FGG1031C
FPGA Family Spartan-II
Speed Grade -6 (Commercial only)
Package Type FGG (Fine Pitch BGA, Pb-free)
Pin Count 1031
Operating Voltage 2.5V core
Temperature Range Commercial (0°C to +85°C)
Process Technology 0.18µm CMOS

XC2S200-6FGG1031C Features and Architecture

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1031C features 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells, enabling highly parallel, flexible design implementations. The CLB architecture supports:

  • Look-Up Tables (LUTs) for combinatorial logic
  • Flip-flops for sequential logic
  • Distributed RAM for small on-chip memory needs
  • Fast carry and arithmetic logic chains

Input/Output Blocks (IOBs)

The device provides up to 284 user-programmable I/Os, each supported by a flexible IOB. IOB capabilities include:

  • Selectable input delay for setup time control
  • Programmable drive strength
  • Multiple I/O standards support (LVTTL, LVCMOS, GTL, SSTL, and more)
  • Slew-rate control for EMI management

Block RAM

The XC2S200-6FGG1031C includes 56K bits of block RAM organized in two columns on either side of the CLB array. Block RAM features:

  • Synchronous read and write operations
  • Dual-port access capability
  • Configurable word widths

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops are embedded — one at each corner of the die. DLLs provide:

  • Clock deskewing and edge alignment
  • Frequency synthesis and multiplication
  • Duty-cycle correction

Spartan-II Family Comparison: Where Does XC2S200 Fit?

Device Logic Cells System Gates CLB Array Max User I/O Dist. RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 bits 16K
XC2S30 972 30,000 12×18 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 284 75,264 bits 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, most I/O pins, and the largest memory resources.


XC2S200-6FGG1031C Speed Grade: Understanding the -6 Rating

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively available in the commercial temperature range. This makes the XC2S200-6FGG1031C ideal for high-speed digital design applications where maximum operating frequency is critical.

Speed Grade Comparison

Speed Grade Temperature Range Typical Max Frequency Availability
-5 Commercial & Industrial Standard General
-6 Commercial only Highest Limited

Package Information: FGG1031 Fine Pitch BGA

The FGG1031 package designation indicates a Pb-free (RoHS-compliant) Fine Pitch Ball Grid Array with 1,031 solder balls. The “G” in FGG distinguishes the lead-free variant from the standard FG package.

FGG1031 Package Highlights

Package Attribute Value
Package Type Fine Pitch BGA
Total Balls 1,031
RoHS Compliance Yes (Pb-free)
Mounting Surface Mount (SMD)
PCB Design Complexity High-density BGA routing required

Typical Applications for XC2S200-6FGG1031C

The XC2S200-6FGG1031C is widely deployed across industries where cost-effective programmable logic, fast performance, and a rich I/O count are required. Common application areas include:

  • Telecommunications – Line cards, protocol bridging, and switching fabrics
  • Industrial Automation – Motor control, sensor interfaces, and real-time control loops
  • Consumer Electronics – Display controllers, image processing pipelines
  • Embedded Computing – Co-processing and hardware acceleration
  • Test & Measurement – Signal acquisition, data capture, and pattern generation
  • Networking – Packet processing, Ethernet MAC/PHY interfacing

XC2S200-6FGG1031C vs. Comparable FPGAs

Feature XC2S200-6FGG1031C XC2S150-6FGG456C XC3S200-4FGG320C
Family Spartan-II Spartan-II Spartan-3
System Gates 200K 150K 200K
Logic Cells 5,292 3,888 4,320
Max I/O 284 260 173
Block RAM 56K 48K 216K
Core Voltage 2.5V 2.5V 1.2V
Package Pins 1031 456 320

Configuration and Design Tools

The XC2S200-6FGG1031C is configured using a bitstream loaded at power-up via one of several configuration modes:

  • Master Serial / Slave Serial – Simple SPI-based configuration
  • Master Parallel / Slave Parallel – Faster parallel bus configuration
  • JTAG Boundary Scan – IEEE 1149.1 compliant for in-system programming and debug

Supported Design Tools

Tool Vendor Use Case
ISE Design Suite Xilinx (legacy) Synthesis, P&R, Bitstream generation
ModelSim / XSIM Mentor / Xilinx RTL Simulation
Synplify Pro Synopsys Third-party synthesis
ChipScope Pro Xilinx On-chip debug and logic analysis

Note: The Spartan-II family is supported through Xilinx ISE. Vivado does not support the Spartan-II architecture.


Ordering Information & Part Number Decoder

When ordering the XC2S200-6FGG1031C, understanding the full part number ensures you receive the correct device:

XC  2S  200  -6  FGG  1031  C
|   |   |    |   |    |     |
|   |   |    |   |    |     └─ Temperature: C = Commercial (0 to +85°C)
|   |   |    |   |    └──────── Pin Count: 1031
|   |   |    |   └───────────── Package: FGG = Fine Pitch BGA, Pb-free
|   |   |    └───────────────── Speed Grade: -6 (fastest)
|   |   └────────────────────── Gate Count: 200K
|   └────────────────────────── Family: Spartan-II (2S)
└────────────────────────────── Xilinx Device Prefix

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1031C used for?

The XC2S200-6FGG1031C is used in applications requiring high-speed, high-density programmable logic — including telecom, industrial control, networking, and embedded processing systems.

Is XC2S200-6FGG1031C RoHS compliant?

Yes. The “G” in the FGG package designation indicates that this is a Pb-free (lead-free), RoHS-compliant package.

What software is used to program the XC2S200-6FGG1031C?

The device is programmed using Xilinx ISE Design Suite. HDL designs written in VHDL or Verilog are synthesized, placed, routed, and then generated as a bitstream for loading onto the FPGA.

What is the operating voltage of XC2S200-6FGG1031C?

The core operating voltage is 2.5V, while I/O voltage can vary depending on the configured I/O standard.

Can the XC2S200-6FGG1031C operate in industrial temperature ranges?

No. The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). For industrial temperature (-40°C to +85°C), the -5 speed grade must be used.


Summary: Why Choose the XC2S200-6FGG1031C?

The XC2S200-6FGG1031C is the flagship of the Xilinx Spartan-II family, offering the highest logic capacity (200K gates / 5,292 cells), the widest I/O count (284 pins), and the fastest speed grade (-6) available in its generation. With its Pb-free FGG1031 BGA package, it satisfies modern environmental compliance requirements while delivering proven, reliable FPGA performance for commercial-grade designs.

If you are sourcing Xilinx FPGAs or need expert guidance on device selection, visit Xilinx FPGA to explore inventory, datasheets, and technical support

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.