The XC2S200-6FGG1022C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 284 user I/Os, and a fast -6 speed grade — all in a compact Fine-Pitch Ball Grid Array (FBGA) package. Whether you are developing embedded systems, communications hardware, or consumer electronics, the XC2S200-6FGG1022C offers the programmable logic density and flexibility engineers demand.

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What Is the XC2S200-6FGG1022C?

The XC2S200-6FGG1022C is part of Xilinx’s Spartan-II 2.5V FPGA family — a series engineered as a cost-efficient alternative to mask-programmed ASICs. The part number breaks down as follows:

For engineers sourcing programmable logic solutions, understanding this Xilinx FPGA part number is essential to selecting the right device for your design.

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XC2S200-6FGG1022C Key Specifications

General Specifications

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Logic and Memory Resources

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Spartan-II Family Comparison

The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1022C ideal for designs requiring maximum logic density within this product line.

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XC2S200-6FGG1022C Features and Architecture

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1022C is its array of 1,176 Configurable Logic Blocks (CLBs). Each CLB contains look-up tables (LUTs), flip-flops, and carry logic that can be programmed to implement virtually any combinational or sequential logic function. The 28×42 CLB array provides a dense, interconnected fabric suitable for complex digital designs.

Input/Output Blocks (IOBs)

With 284 maximum user I/O pins, the XC2S200-6FGG1022C provides abundant connectivity for interfacing with external components. Each IOB supports:

• Programmable input and output delay
• Optional output register or latch
• 3-state output control
• Pull-up and pull-down resistors
• Various I/O standards compatible with 2.5V logic

Block RAM and Distributed RAM

The device features 56K bits of Block RAM organized in two columns on opposite sides of the die. Additionally, 75,264 bits of distributed RAM is available from the CLB look-up tables. This dual-RAM architecture enables efficient implementation of FIFOs, buffers, and lookup tables directly within the FPGA fabric.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock management capabilities including:

• Clock deskew
• Clock frequency synthesis
• Phase shifting
• Duty cycle correction

Configuration Modes

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Speed Grade and Performance

The -6 speed grade is the fastest option available in the Spartan-II family and is exclusively offered in the commercial temperature range. This makes the XC2S200-6FGG1022C the optimal choice for latency-sensitive, high-frequency designs operating in standard commercial environments (0°C to +85°C).

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Packaging: FGG (Fine-Pitch Ball Grid Array)

Package Details

The FGG package designation indicates Pb-free (lead-free) packaging, making this component compliant with RoHS and other environmental regulations. The 1,022-ball BGA footprint is well-suited to high-density PCB designs where board space is a premium.

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Applications of the XC2S200-6FGG1022C

The XC2S200-6FGG1022C is a versatile FPGA used across a wide range of industries and applications:

• Telecommunications – Protocol processing, line-card interfaces, and signal routing
• Industrial Automation – Motor control, sensor interfaces, and real-time processing
• Consumer Electronics – Display controllers, set-top boxes, and media processing
• Embedded Systems – Co-processing, hardware acceleration, and custom peripherals
• Test & Measurement – Data acquisition, pattern generation, and signal analysis
• Networking – Packet filtering, switching, and protocol bridging

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Why Choose the XC2S200-6FGG1022C?

Cost-Effective Alternative to ASICs

The Spartan-II family was specifically designed as a low-cost replacement for mask-programmed ASICs, delivering the benefits of custom hardware without the high NRE (Non-Recurring Engineering) costs. The XC2S200-6FGG1022C shortens product development cycles while maintaining competitive unit costs at volume.

Maximum Logic Density in Spartan-II

As the top-of-range device in the Spartan-II family, the XC2S200 provides the highest gate count, I/O count, and memory resources available — giving designers maximum headroom for complex designs.

Proven Xilinx Architecture

Built on Xilinx’s proven 2.5V SRAM-based programmable logic architecture, the XC2S200-6FGG1022C benefits from decades of silicon development, robust IP ecosystem support, and comprehensive design tool compatibility (Xilinx ISE and beyond).

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Ordering Information and Part Number Guide

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XC2S200-6FGG1022C vs. Other XC2S200 Variants

The XC2S200-6FGG1022C stands out with its 1,022-ball package, which offers the highest pin count and greatest I/O flexibility within the XC2S200 device variants.

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Frequently Asked Questions (FAQ)

What does the “6” mean in XC2S200-6FGG1022C?

The “-6” refers to the speed grade, which is the fastest available for the Spartan-II family. A higher speed grade number indicates faster propagation delays and higher operating frequencies.

Is XC2S200-6FGG1022C RoHS compliant?

Yes. The “G” in “FGG” indicates Pb-free (lead-free) packaging, making it fully RoHS compliant.

What is the operating temperature range of XC2S200-6FGG1022C?

The “C” suffix indicates a Commercial temperature range of 0°C to +85°C.

Can the XC2S200-6FGG1022C be used in industrial applications?

The -6 speed grade is only available in the commercial temperature range. For industrial temperature range (-40°C to +85°C) requirements, consider the -5 speed grade variants with an “I” suffix.

How many I/O pins does the XC2S200-6FGG1022C have?

The XC2S200 supports up to 284 maximum user I/Os, not including the four global clock/user input pins.

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Summary

The XC2S200-6FGG1022C is Xilinx’s highest-density Spartan-II FPGA, combining 200,000 system gates, 5,292 logic cells, 284 user I/Os, and 56K bits of Block RAM in a fast -6 speed grade, Pb-free 1,022-ball BGA package. It is purpose-built for commercial applications that demand maximum programmable logic density, high-speed operation, and a cost-efficient ASIC alternative. With its proven architecture, rich on-chip memory, and four DLLs for flexible clock management, the XC2S200-6FGG1022C remains a compelling choice for digital design engineers sourcing high-performance FPGAs.