Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1017C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1017C is a high-performance, cost-efficient Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and is housed in a 1017-ball Fine-Pitch BGA (FBGA) package — making it one of the most capable devices in the Spartan-II lineup. Whether you’re working on digital signal processing, embedded control, or communication systems, the XC2S200-6FGG1017C offers a compelling combination of logic density, speed, and I/O flexibility.

For engineers and procurement teams looking to source or compare Xilinx FPGA devices, this guide covers everything you need to know — from core architecture to ordering details and application use cases.


What Is the XC2S200-6FGG1017C? Decoding the Part Number

Understanding the part number helps buyers quickly identify the exact variant they need:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed grade 6 (fastest in the family, commercial only)
FGG Fine-Pitch Ball Grid Array (Pb-Free package)
1017 1017-pin package
C Commercial temperature range (0°C to +85°C)

The “G” in FGG indicates a Pb-free (RoHS-compliant) packaging option, which is critical for manufacturers adhering to environmental compliance standards.


XC2S200-6FGG1017C Key Specifications at a Glance

Core Logic and Memory Specifications

Parameter Value
Device Family Xilinx Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Supply Voltage (VCCINT) 2.5V
Speed Grade -6 (fastest available)
Configuration Bits 1,335,840

Package and Environmental Specifications

Parameter Value
Package Type Fine-Pitch BGA (FBGA)
Package Code FGG1017
Pin Count 1017
Pb-Free Yes (RoHS Compliant)
Temperature Range Commercial: 0°C to +85°C
Technology Node 0.18µm
Process CMOS

XC2S200-6FGG1017C Architecture and Design Features

Configurable Logic Blocks (CLBs)

The XC2S200 uses a 28 × 42 array of Configurable Logic Blocks, giving designers 1,176 CLBs in total. Each CLB contains four logic cells, and each logic cell includes:

  • A 4-input Look-Up Table (LUT) for implementing any combinatorial function
  • A D-type flip-flop with optional clock enable
  • Fast carry logic for arithmetic operations
  • Support for both synchronous and asynchronous reset/set

This architecture gives the XC2S200-6FGG1017C exceptional flexibility for implementing state machines, arithmetic circuits, and custom digital logic.

Input/Output Blocks (IOBs) and I/O Flexibility

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1017C supports a wide range of I/O standards:

I/O Standard Supported
LVCMOS 2.5V / 3.3V ✅ Yes
LVTTL ✅ Yes
SSTL2 / SSTL3 ✅ Yes
GTL / GTL+ ✅ Yes
PCI (3.3V) ✅ Yes
HSTL ✅ Yes

This multi-standard I/O support makes the XC2S200-6FGG1017C ideal for interfacing with a wide variety of processors, memory devices, and peripherals.

Block RAM and Distributed Memory

The XC2S200 provides two types of on-chip memory:

  • 75,264 bits of Distributed RAM — implemented within the CLBs, ideal for small FIFOs and register files
  • 56K bits of Block RAM — dedicated dual-port SRAM blocks suitable for larger data buffers, lookup tables, and packet buffering

Delay-Locked Loops (DLLs) for Clock Management

The XC2S200-6FGG1017C includes four Delay-Locked Loops (DLLs), one at each corner of the die. The DLLs provide:

  • Zero clock skew distribution
  • Clock frequency synthesis (multiplication and division)
  • Phase shifting and duty cycle correction

This makes the device highly suitable for synchronous, multi-clock-domain designs.

Configuration Modes

The XC2S200-6FGG1017C supports multiple configuration modes for flexible system integration:

Configuration Mode Data Width CCLK Direction
Master Serial 1-bit Output
Slave Serial 1-bit Input
Slave Parallel (SelectMAP) 8-bit Input
Boundary-Scan (JTAG) 1-bit N/A

Performance: Why Choose Speed Grade -6?

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered for the commercial temperature range. This grade provides the lowest propagation delays and supports system clock frequencies up to approximately 200+ MHz on critical paths.

Speed Grade Target Use Max Performance
-4 Industrial/budget designs Moderate
-5 General commercial use High
-6 High-speed commercial designs Highest

If your design demands the tightest timing margins and fastest logic operation, the -6 speed grade is the right choice.


XC2S200-6FGG1017C vs. Other Spartan-II Family Members

Device Logic Cells System Gates Max I/O Block RAM
XC2S15 432 15,000 86 16K
XC2S50 1,728 50,000 176 32K
XC2S100 2,700 100,000 176 40K
XC2S150 3,888 150,000 260 48K
XC2S200 5,292 200,000 284 56K

The XC2S200 sits at the top of the Spartan-II family, offering the highest gate count, the most logic cells, the most I/O pins, and the largest block RAM — making it the best choice for demanding applications within the Spartan-II portfolio.


Typical Applications for the XC2S200-6FGG1017C

The XC2S200-6FGG1017C is widely deployed across a broad range of industries and applications:

#### Digital Signal Processing (DSP)

Its large CLB array and distributed RAM make it excellent for FIR/IIR filters, FFT engines, and real-time signal conditioning.

#### Embedded Control Systems

The device’s flexible I/O and configurable logic allow it to implement custom microcontrollers, bus bridges, and peripheral controllers.

#### Communication and Networking Equipment

Support for high-speed I/O standards like HSTL and GTL+ makes the XC2S200 suitable for line cards, protocol converters, and data serialization/deserialization.

#### Industrial Automation

Deterministic, reconfigurable logic enables PLC-style control, motor drive interfaces, and sensor data acquisition systems.

#### Rapid Prototyping and ASIC Replacement

The Spartan-II family was specifically designed as a cost-effective alternative to mask-programmed ASICs. The XC2S200-6FGG1017C enables teams to prototype designs quickly and deploy field-upgradeable logic without expensive ASIC re-spins.


Ordering Information and Part Variants

The XC2S200 is available in several package and speed grade combinations. The table below shows common variants:

Part Number Package Pins Speed Grade Temp Range Pb-Free
XC2S200-6FGG1017C FBGA 1017 -6 Commercial ✅ Yes
XC2S200-5FGG1017C FBGA 1017 -5 Commercial ✅ Yes
XC2S200-6PQ208C PQFP 208 -6 Commercial ❌ No
XC2S200-5FG456C FBGA 456 -5 Commercial ❌ No
XC2S200-5FG256C FBGA 256 -5 Commercial ❌ No

Note: The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature requirements (−40°C to +85°C), use the -5 or -4 speed grade variants.


Design Tools and Software Support

The XC2S200-6FGG1017C is fully supported by Xilinx (now AMD) design tools:

  • ISE Design Suite — the legacy toolchain specifically designed for Spartan-II devices; includes synthesis, place-and-route, timing analysis, and bitstream generation
  • ChipScope Pro — for in-system logic analysis and debugging
  • CORE Generator — for instantiating pre-built IP cores including memory controllers, FIFOs, and DSP functions

Note: Spartan-II devices are not supported by the Vivado Design Suite. Use ISE Design Suite 14.7 (the final release) for all XC2S200 design work.


Frequently Asked Questions About the XC2S200-6FGG1017C

Q: Is the XC2S200-6FGG1017C RoHS compliant? Yes. The “G” in FGG designates a Pb-free (lead-free) package, making this part RoHS compliant.

Q: What is the operating voltage of the XC2S200-6FGG1017C? The core voltage (VCCINT) is 2.5V. The I/O voltage (VCCO) can vary depending on the I/O standard used (1.5V to 3.3V).

Q: Can this device be reconfigured in the field? Yes. Like all FPGAs, the XC2S200-6FGG1017C is fully reprogrammable, allowing in-field design updates without hardware replacement — a major advantage over ASICs.

Q: What is the maximum system clock frequency? The -6 speed grade supports the highest clock frequencies in the Spartan-II family, with internal clock distribution up to approximately 200+ MHz depending on design complexity and routing.

Q: Is the XC2S200-6FGG1017C still in production? Xilinx has issued a Product Discontinuation Notice (PDN) for some Spartan-II variants. Buyers should verify current availability and consider sourcing from authorized distributors or excess inventory suppliers.


Why Buy the XC2S200-6FGG1017C?

The XC2S200-6FGG1017C remains a trusted, proven FPGA for legacy system maintenance, industrial control upgrades, and cost-sensitive commercial designs. Its combination of high gate density, rich I/O support, on-chip clock management, and Pb-free packaging makes it a versatile choice for engineers who need reliable programmable logic in a proven 2.5V CMOS process.

Whether you’re maintaining an existing design or evaluating Spartan-II for a new high-volume application, the XC2S200-6FGG1017C delivers the performance and flexibility to meet your needs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.