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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC4085XLA-07BG560C – Xilinx XC4000XLA Series FPGA

Product Details

Part Number: XC4085XLA-07BG560C
Manufacturer: AMD Xilinx (formerly Xilinx, Inc.)
Product Category: Embedded – Complex Logic (FPGA)
Package: BG560 (560-Ball BGA)
Speed Grade: -07
Temperature Range: Commercial (0°C to +85°C)

The XC4085XLA-07BG560C is a high-density, high-performance field-programmable gate array (FPGA) from Xilinx’s XC4000XLA series. Designed for demanding digital logic applications, this device offers 85,000 system gates, advanced I/O capabilities, and robust configuration options. It is ideal for engineers and system designers seeking a proven, reliable solution for telecommunications, networking, industrial control, and digital signal processing applications.

For a broader selection of compatible devices, explore our full range of Xilinx FPGA products.


XC4085XLA-07BG560C Key Features

  • 85,000 system gates for complex logic implementations
  • 560-ball BGA package (BG560) offering compact, high pin-count footprint
  • -07 speed grade – optimized for high-speed design requirements
  • Commercial temperature range (0°C to +85°C)
  • 3.3V I/O with 5V tolerant inputs (XLA process technology)
  • SelectRAM+ embedded memory for on-chip data storage
  • Boundary-scan (JTAG) support – IEEE 1149.1 compliant
  • Low-power XLA process – optimized for power-sensitive applications
  • Multiple configuration modes: Master Serial, Slave Serial, Peripheral, JTAG

XC4085XLA-07BG560C Full Technical Specifications

Parameter Value
Part Number XC4085XLA-07BG560C
Manufacturer AMD Xilinx
Series XC4000XLA
Logic Capacity 85,000 System Gates
CLBs (Configurable Logic Blocks) Approx. 1,862
Flip-Flops ~7,448
Maximum User I/O 448
Package Type BGA (Ball Grid Array)
Package Code BG560
Total Pins 560
Speed Grade -07
Operating Voltage (VCC) 3.3V
I/O Voltage 3.3V (5V tolerant)
Operating Temperature 0°C to +85°C (Commercial)
Configuration Interface JTAG, Master/Slave Serial, Peripheral
Embedded RAM SelectRAM+
JTAG Support IEEE 1149.1 (Boundary Scan)
Technology Node XLA (0.22µm)
RoHS Status Check with supplier

XC4085XLA-07BG560C vs. Related Variants

The XC4085XLA is available in multiple speed grades and temperature ranges. The table below compares the most common variants:

Part Number Speed Grade Temperature Range Package
XC4085XLA-07BG560C -07 (Fastest) Commercial (0°C to +85°C) BG560
XC4085XLA-09BG560C -09 Commercial (0°C to +85°C) BG560
XC4085XLA-09BG560I -09 Industrial (-40°C to +100°C) BG560
XC4085XLA-07PQ240C -07 Commercial (0°C to +85°C) PQ240
XC4085XLA-09PQ240I -09 Industrial (-40°C to +100°C) PQ240

Note: The “C” suffix denotes Commercial grade and the “I” suffix denotes Industrial grade. The lower the speed grade number (e.g., -07 vs. -09), the faster the device.


XC4085XLA Architecture Overview

Configurable Logic Blocks (CLBs)

The XC4085XLA-07BG560C is built around Xilinx’s proven CLB architecture. Each CLB contains:

  • Two 4-input Look-Up Tables (LUTs) configurable as logic functions or 16×1 RAM
  • Two D flip-flops with dedicated clock enable and reset
  • Carry and arithmetic logic for efficient adder and counter implementation
  • Wide-input multiplexing for complex combinational logic

SelectRAM+ Embedded Memory

The XC4085XLA features SelectRAM+, allowing on-chip dual-port RAM implementation using CLB resources. This enables fast, single-cycle synchronous memory without consuming external pins, making it suitable for FIFO buffers, lookup tables, and data queues.

I/O Blocks (IOBs)

Each IOB supports:

  • Programmable drive strength for signal integrity control
  • Slew rate control to reduce EMI
  • Optional pull-up or pull-down resistors
  • Registered inputs and outputs with configurable delay

Clock Management

The device includes dedicated global clock buffers and delay-locked loops (DLLs) for:

  • Zero-delay clock distribution
  • Clock frequency synthesis and phase shifting
  • Jitter reduction in high-speed designs

BG560 Package Pinout Information

Package Overview

Parameter Value
Package Type PBGA (Plastic Ball Grid Array)
Total Ball Count 560
Maximum User I/O 448
Ball Pitch 1.27 mm
Body Size 31 mm × 31 mm
Ball Diameter ~0.75 mm
PCB Via Recommendation NSMD (Non-Solder Mask Defined)

BG560 Ball Assignment Summary

Function Approximate Pin Count
User I/O Up to 448
Dedicated Power (VCCINT) Multiple (distributed)
Dedicated Power (VCCO) Multiple (per bank)
Ground (GND) Multiple (distributed)
Configuration Pins 8–12
Clock Inputs (GCLK) 4 dedicated
JTAG Pins (TDI, TDO, TMS, TCK) 4

Configuration Modes

The XC4085XLA-07BG560C supports multiple configuration methods to suit different system architectures:

Mode Description Use Case
Master Serial FPGA drives configuration clock Standalone from SPI Flash
Slave Serial External master drives clock Daisy-chain multi-FPGA systems
Slave Parallel (SelectMAP) 8-bit parallel bus High-speed configuration
JTAG (Boundary Scan) IEEE 1149.1 compliant In-circuit programming & debug
Peripheral/Processor Microprocessor-driven Embedded system integration

Typical Applications

The XC4085XLA-07BG560C is widely used in the following application domains:

Industry Application Examples
Telecommunications Line cards, protocol bridging, framing logic, SONET/SDH interfaces
Networking Packet processing, switching fabric, routing logic
Industrial Automation Motor control, real-time control loops, sensor fusion
Defense & Aerospace Signal acquisition, radar processing (COTS builds)
Video & Imaging Frame buffers, image pre-processing pipelines
Test & Measurement Logic analyzers, protocol emulation, data capture
Embedded Systems Co-processor acceleration, bus bridging

Why Choose the XC4085XLA-07BG560C?

✅ Proven Silicon Technology

The XC4000XLA family has decades of proven deployment across mission-critical systems. The XLA process delivers reliable 3.3V operation with 5V input tolerance, supporting legacy board designs.

✅ High-Speed -07 Grade

The -07 speed grade is the fastest available in this family, featuring typical pin-to-pin delays as low as 7ns, enabling high-frequency designs in the range of 100+ MHz.

✅ Dense 560-Ball BGA Footprint

The BG560 package maximizes I/O count while maintaining a manageable 31mm × 31mm PCB footprint, making it ideal for space-constrained boards requiring 400+ user IOs.

✅ Long-Term Availability

Distributed through authorized remarketers such as Rochester Electronics, the XC4085XLA-07BG560C remains available for long production lifecycle support and maintenance designs.


Ordering Information

Field Value
Full Part Number XC4085XLA-07BG560C
Manufacturer AMD Xilinx
Package 560-Ball BGA (BG560)
Speed Grade -07
Temp Grade Commercial
MOQ Typically 1 unit
Lead Time Contact distributor
Export Control EAR99 – verify ECCN for export

Frequently Asked Questions (FAQ)

What does the “07” speed grade mean in XC4085XLA-07BG560C?

The “-07” speed grade indicates the device’s maximum propagation delay performance. A lower number means faster logic. The -07 grade is the fastest in this series, suitable for designs requiring higher clock frequencies and tighter timing margins compared to -09 or -10 grade parts.

What is the difference between XC4085XLA-07BG560C and XC4085XLA-09BG560I?

The key differences are the speed grade (-07 is faster than -09) and the temperature grade. The “-07BG560C” is a commercial grade (0°C to +85°C), while the “-09BG560I” is an industrial grade (-40°C to +100°C). Choose the industrial variant for harsh environment deployments.

Is the XC4085XLA-07BG560C still in production?

The XC4000XLA series has been discontinued by Xilinx (now AMD). However, the part remains available through authorized lifecycle and surplus distributors such as Rochester Electronics, which provides continuity supply for existing designs.

What software is used to program the XC4085XLA-07BG560C?

This device is supported by Xilinx ISE Design Suite (not Vivado, which targets newer 7-Series and UltraScale devices). The recommended ISE version for XC4000XLA support is ISE 14.7 or earlier.

What FPGA programmer can be used with this device?

The XC4085XLA-07BG560C supports JTAG-based in-circuit configuration using the Xilinx Platform Cable USB II or compatible third-party JTAG programmers (e.g., Digilent JTAG-HS3).

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.