Contact Sales & After-Sales Service

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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1008C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1008C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this 2.5V FPGA delivers 200,000 system gates, 284 user I/O pins, and a speed grade of -6 — making it one of the most capable devices in the Spartan-II lineup. Whether you are building embedded systems, telecommunications equipment, or industrial control devices, the XC2S200-6FGG1008C offers the logic density and I/O flexibility your design demands.


What Is the XC2S200-6FGG1008C?

The XC2S200-6FGG1008C is part of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device optimized for cost-effective, high-density digital design. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200,000 system gates
-6 Speed grade (fastest available in Spartan-II)
FGG Fine Pitch Ball Grid Array (FBGA) package
1008 1008 pins
C Commercial temperature range (0°C to +85°C)

For designers looking to explore the full Spartan-II product ecosystem and compatible devices, visit Xilinx FPGA for a comprehensive selection guide.


XC2S200-6FGG1008C Key Specifications

Core Logic Resources

Specification Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits

Electrical & Timing Characteristics

Parameter Value
Core Voltage 2.5V
Speed Grade -6 (Fastest in Spartan-II)
Operating Temperature 0°C to +85°C (Commercial)
Package Type FGG (Fine Pitch BGA)
Pin Count 1008
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, CTT

XC2S200-6FGG1008C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features a 28×42 CLB array totaling 1,176 CLBs. Each CLB contains look-up tables (LUTs) and flip-flops, enabling flexible implementation of combinational and sequential logic. The distributed RAM capacity of 75,264 bits allows efficient on-chip data storage without consuming external memory resources.

Input/Output Blocks (IOBs)

With 284 user I/O pins, the XC2S200-6FGG1008C supports a wide variety of single-ended and differential I/O standards. Each IOB supports:

  • Programmable output slew rate control
  • Optional pull-up and pull-down resistors
  • Input delay elements for timing optimization
  • 3-state output capability

Block RAM

The device integrates 56K bits of dedicated block RAM, organized in two columns on opposite sides of the die. Block RAM supports true dual-port access, making it ideal for FIFOs, data buffers, and lookup tables.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) are placed at each corner of the die. DLLs eliminate clock distribution delays, enable clock multiplication/division, and support precise phase shifting — critical for high-speed synchronous designs.


Spartan-II Family Comparison Table

The table below shows how the XC2S200 compares to other devices in the Spartan-II family, helping you determine if this part meets your design requirements.

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Dist. RAM (bits) Block RAM
XC2S15 432 15,000 8×12 96 86 6,144 16K
XC2S30 972 30,000 12×18 216 92 13,824 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1008C the top choice when maximum logic density and I/O count are required.


Configuration Modes

The XC2S200-6FGG1008C supports multiple configuration modes, offering design flexibility for different system architectures.

Configuration Mode Pre-config Pull-ups CCLK Direction Data Width Serial DOUT
Master Serial No Output 1-bit Yes
Slave Serial Yes Input 1-bit Yes
Slave Parallel Yes Input 8-bit No
Boundary-Scan (JTAG) Yes N/A 1-bit No

Top Features of the XC2S200-6FGG1008C

High-Density Programmable Logic

With 5,292 logic cells and 200,000 equivalent system gates, the XC2S200 supports complex digital designs that would otherwise require expensive ASICs or multiple smaller FPGAs.

-6 Speed Grade Performance

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the commercial temperature range. This enables high-frequency operation, critical for applications in networking, signal processing, and real-time control.

Large I/O Count for Complex Interfaces

284 user-configurable I/O pins allow the XC2S200-6FGG1008C to interface with a wide range of external peripherals, memory devices, and buses simultaneously, reducing the need for external interface logic.

Integrated DLLs for Clock Management

Four on-chip DLLs provide robust clock management with zero propagation delay, phase adjustment, and frequency synthesis — enabling reliable high-speed synchronous system design.

Low-Power 2.5V Core

Operating from a 2.5V supply, the Spartan-II family was designed for low-power consumption, making it suitable for power-sensitive embedded and portable applications.

JTAG Boundary-Scan Support

Full IEEE 1149.1 JTAG boundary-scan support simplifies board-level testing and in-system debugging, reducing time-to-market for complex PCB designs.


Supported I/O Standards

The XC2S200-6FGG1008C supports a broad selection of I/O voltage standards, enabling seamless integration with both legacy and modern digital systems.

I/O Standard Type Description
LVTTL Single-ended Low-voltage TTL, 3.3V
LVCMOS Single-ended Low-voltage CMOS, 2.5V/3.3V
PCI Single-ended 3.3V PCI bus compatible
GTL / GTL+ Single-ended Gunning Transceiver Logic
HSTL Single-ended High-Speed Transceiver Logic
SSTL2 / SSTL3 Single-ended Stub Series Terminated Logic
CTT Single-ended Center-Tapped Termination

Typical Applications for the XC2S200-6FGG1008C

The XC2S200-6FGG1008C is widely used across many industries and application segments:

  • Telecommunications – Protocol processing, line card logic, and interface bridging
  • Industrial Automation – Real-time control, motor drivers, and sensor fusion
  • Consumer Electronics – Video processing, display controllers, and set-top boxes
  • Embedded Systems – Co-processing, custom peripheral implementation
  • Test & Measurement – Data acquisition, pattern generation, and signal analysis
  • Networking Equipment – Packet processing, switching logic, and traffic management
  • Military & Aerospace (with appropriate qualification) – Signal intelligence, radar processing

Ordering & Part Number Decoding Guide

When ordering Spartan-II devices, it is important to understand the full part number to ensure you receive exactly the right device.

Field Example Options
Device XC2S200 XC2S15, XC2S30, XC2S50, XC2S100, XC2S150, XC2S200
Speed Grade -6 -5 (slowest), -6 (fastest)
Package FGG PQ (PQFP), TQ (TQFP), FG/FGG (FBGA), VQ (VQFP)
Pin Count 1008 Varies by package
Temperature Range C C = Commercial (0°C to +85°C), I = Industrial (−40°C to +100°C)

Note: The “G” in “FGG” indicates a Pb-free (RoHS-compliant) package. Standard (non-Pb-free) packages omit this character.


Why Choose the XC2S200-6FGG1008C?

The XC2S200-6FGG1008C stands out as the premier device in the Spartan-II family for several reasons:

  1. Maximum Logic Density – 200K gates offer the most room for complex designs within the Spartan-II series.
  2. Best Speed Performance – The -6 speed grade provides the lowest propagation delays available.
  3. Widest I/O Availability – 284 user I/Os in a 1008-pin FBGA package maximizes connectivity options.
  4. Proven Technology – The Spartan-II architecture has been validated across millions of production units in demanding real-world applications.
  5. Cost-Effective Alternative to ASICs – FPGAs eliminate NRE (non-recurring engineering) costs associated with custom silicon, enabling faster prototyping and time-to-market.

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1008C used for?

The XC2S200-6FGG1008C is used in digital logic design applications requiring high gate counts and many I/O connections, such as networking, telecommunications, industrial automation, and embedded computing.

What does the “-6” speed grade mean?

The -6 speed grade indicates the fastest timing performance available in the Spartan-II family. A higher number (closer to -6) means lower propagation delays and higher maximum operating frequency.

Is the XC2S200-6FGG1008C RoHS compliant?

The “G” in the FGG package designator indicates a Pb-free (lead-free), RoHS-compliant package.

What temperature range does the XC2S200-6FGG1008C support?

The “C” suffix indicates a commercial temperature range of 0°C to +85°C. Industrial-range variants (−40°C to +100°C) use an “I” suffix.

How many configuration bits does the XC2S200 require?

The XC2S200 requires 1,335,840 configuration bits to fully program the device.

What tools are used to program this FPGA?

The XC2S200-6FGG1008C is programmed using Xilinx ISE Design Suite (legacy) with synthesis tools such as XST or Synplify, and place-and-route via Xilinx implementation tools.


Conclusion

The XC2S200-6FGG1008C is a powerful, proven, and cost-effective FPGA solution for engineers who need maximum logic resources within the Xilinx Spartan-II family. With 200,000 system gates, 284 I/O pins, -6 speed grade performance, integrated DLLs, and 56K bits of block RAM, this device handles complex digital designs across a broad range of demanding applications.

Whether you are upgrading an existing design, sourcing replacement stock, or selecting an FPGA for a new project, the XC2S200-6FGG1008C delivers the performance, flexibility, and reliability you need.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.