The XC2S200-6FGG1006C is a high-density field-programmable gate array (FPGA) from the Xilinx Spartan-II family, designed for high-volume applications that demand a versatile, cost-effective programmable logic solution. With 200,000 system gates, a 1006-pin Fine-Pitch BGA (FBGA) package, and operating at 2.5V, this device is an ideal alternative to mask-programmed ASICs — offering field upgradability, rapid development cycles, and proven 0.18μm technology.
Whether you’re an engineer sourcing components for embedded systems, communications equipment, or industrial designs, this guide covers everything you need to know about the XC2S200-6FGG1006C.
What Is the XC2S200-6FGG1006C?
The XC2S200-6FGG1006C is part of Xilinx’s Spartan-II FPGA family, a product line engineered to deliver ASIC-like performance at programmable logic cost points. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II device with 200K system gates |
| -6 |
Speed grade 6 (fastest commercial grade) |
| FGG |
Fine-Pitch Ball Grid Array (FBGA) package type |
| 1006 |
1006 total pins |
| C |
Commercial temperature range (0°C to +85°C) |
This makes it one of the largest package variants in the XC2S200 lineup, providing a maximum number of available I/O pins for complex, multi-interface designs. For a broader selection of Xilinx programmable logic devices, visit Xilinx FPGA.
XC2S200-6FGG1006C Key Specifications
Core Device Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx (now AMD) |
| Product Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 CLBs) |
| Maximum Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (14 × 4,096-bit blocks) |
| User I/O Pins |
284 |
| Total Package Pins |
1,006 |
| Package Type |
1006-Pin FBGA (Fine-Pitch BGA) |
| Process Technology |
0.18μm |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Commercial, fastest available) |
| Temperature Range |
0°C to +85°C (Commercial) |
| Configuration Bits |
1,335,840 |
| Delay-Locked Loops (DLLs) |
4 |
XC2S200-6FGG1006C Architecture Overview
Configurable Logic Blocks (CLBs)
The Spartan-II architecture is built around a regular, flexible array of Configurable Logic Blocks (CLBs). The XC2S200 features a 28×42 array of CLBs, delivering 1,176 total CLBs. Each CLB contains four logic cells — each with a 4-input look-up table (LUT), a storage element (flip-flop), and dedicated carry logic.
Input/Output Blocks (IOBs)
Surrounding the CLB array is a perimeter of programmable Input/Output Blocks (IOBs). The XC2S200-6FGG1006C provides 284 user I/O pins, supporting a wide variety of single-ended and differential I/O standards.
Supported I/O Standards
| I/O Standard |
Type |
| LVTTL |
Single-Ended |
| LVCMOS2 |
Single-Ended |
| PCI (3.3V, 66 MHz) |
Single-Ended |
| GTL / GTL+ |
Single-Ended |
| HSTL (Class I, III) |
Single-Ended |
| SSTL2 (Class I, II) |
Single-Ended |
| SSTL3 (Class I, II) |
Single-Ended |
| AGP |
Single-Ended |
Block RAM
The XC2S200 contains 56 Kbits of block RAM organized as 14 fully synchronous, dual-port 4,096-bit RAM blocks. Each block RAM features independent control signals for each port, and the data width of each port can be configured independently.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock deskewing, frequency synthesis, and phase shifting. The DLL can eliminate clock distribution delay and synchronize the internal clock to an external reference, enabling zero-skew designs.
XC2S200-6FGG1006C Configuration Modes
The XC2S200-6FGG1006C supports four standard configuration modes. Configuration data is stored externally (in a PROM or other non-volatile storage) and loaded at power-up.
| Configuration Mode |
Pre-Config Pull-ups |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
No |
Output |
1-bit |
Yes |
| Slave Serial |
Yes |
Input |
1-bit |
Yes |
| Slave Parallel |
Yes |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
Yes |
N/A |
1-bit |
No |
Speed and Timing Performance
The -6 speed grade is the fastest commercial grade available for the XC2S200, making it optimal for timing-critical designs. The -6 grade is exclusively available in the commercial temperature range (0°C to +85°C).
| Performance Parameter |
Value |
| Maximum System Frequency |
Up to 200+ MHz (design-dependent) |
| Internal Clock Speed |
263 MHz (maximum) |
| Speed Grade |
-6 (Fastest Commercial) |
| Temperature Grade |
Commercial (0°C to +85°C) |
XC2S200-6FGG1006C vs. Other XC2S200 Package Variants
Xilinx offers the XC2S200 in multiple package options. The FGG1006 is the largest, enabling the full 284 user I/Os.
| Part Number |
Package |
Total Pins |
User I/Os |
| XC2S200-6FG256C |
FBGA |
256 |
140 |
| XC2S200-6PQ208C |
PQFP |
208 |
140 |
| XC2S200-6FGG456C |
FBGA |
456 |
176 |
| XC2S200-6FGG1006C |
FBGA |
1,006 |
284 |
The FGG1006 package is the optimal choice when your design requires the maximum user I/O count of 284 pins.
Typical Applications for the XC2S200-6FGG1006C
The Spartan-II XC2S200-6FGG1006C is widely deployed across industries requiring flexible, high-I/O programmable logic:
- Telecommunications equipment — line cards, protocol bridging, SONET/SDH framing
- Embedded processing systems — coprocessing, bus bridging, glue logic elimination
- Industrial control — motor control interfaces, sensor fusion, real-time control planes
- Networking and switching — packet processing, crossbar switching, traffic management
- Test and measurement — signal capture, pattern generation, logic analysis
- Consumer electronics — high-volume products requiring rapid time-to-market
- Military and aerospace legacy designs — long lifecycle component in existing systems
Why Choose the XC2S200-6FGG1006C Over a Custom ASIC?
| Feature |
XC2S200-6FGG1006C (FPGA) |
Mask-Programmed ASIC |
| NRE (Non-Recurring Engineering) Cost |
None |
Very High |
| Development Time |
Weeks |
Months to Years |
| Field Upgradability |
Yes — in-system reprogrammable |
No |
| Prototype Risk |
Very Low |
Very High |
| Volume Cost |
Moderate |
Low (at very high volumes) |
| Design Change Flexibility |
Unlimited iterations |
Respin required (costly) |
The XC2S200-6FGG1006C gives engineering teams the freedom to iterate, upgrade, and ship without the economic burden of ASIC tape-out costs.
Development Tools & Design Support
Xilinx ISE Design Suite
The XC2S200-6FGG1006C is fully supported by the Xilinx ISE Design Suite (the appropriate legacy toolchain for Spartan-II devices). ISE provides:
- HDL synthesis (VHDL / Verilog)
- Place-and-route for Spartan-II architecture
- Timing analysis and simulation
- Configuration file (bitstream) generation
Boundary-Scan (JTAG) Support
The device includes full IEEE 1149.1 JTAG boundary-scan support, enabling in-circuit testing, configuration, and debugging via standard JTAG interfaces.
Ordering Information & RoHS Status
| Parameter |
Details |
| Manufacturer |
Xilinx, Inc. (AMD) |
| Part Number |
XC2S200-6FGG1006C |
| RoHS Compliance |
Not RoHS Compliant (Standard Packaging) |
| Pb-Free Alternative |
XC2S200-6FGG1006G (Pb-free version) |
| Temperature Range |
Commercial: 0°C to +85°C |
| Package |
1006-Pin Fine-Pitch BGA |
Note: The “G” suffix in the part number (e.g., XC2S200-6FGG1006GC) denotes the Pb-free (RoHS-compliant) version. For new designs requiring RoHS compliance, specify the “G” variant.
Frequently Asked Questions (FAQ)
What does the -6 speed grade mean for the XC2S200-6FGG1006C?
The -6 speed grade is the fastest speed grade available for the XC2S200 in the commercial temperature range. It indicates tighter timing parameters (shorter propagation delays), allowing the device to operate at higher clock frequencies compared to -5 grade devices.
Is the XC2S200-6FGG1006C still in production?
The Spartan-II family has been declared end-of-life (EOL) by Xilinx/AMD. The XC2S200-6FGG1006C is available through authorized distributors and component brokers from existing inventory. Engineers sourcing this part for legacy system maintenance should verify stock availability and consider last-time-buy orders.
What is the maximum I/O count of the XC2S200-6FGG1006C?
In the FGG1006 package, the XC2S200-6FGG1006C provides 284 user I/O pins (not including 4 dedicated global clock inputs), making it the highest I/O variant of the XC2S200.
Can the XC2S200-6FGG1006C be reprogrammed in the field?
Yes. Like all Xilinx Spartan-II FPGAs, the XC2S200-6FGG1006C is SRAM-based and fully reprogrammable in the field. Configuration data is loaded from external non-volatile storage (PROM or flash) at power-up, and designs can be updated without hardware replacement.
What I/O voltage standards does the XC2S200-6FGG1006C support?
The device supports a wide range of standards including LVTTL, LVCMOS2, PCI (3.3V), GTL/GTL+, HSTL (Class I and III), SSTL2 (Class I and II), SSTL3 (Class I and II), and AGP.