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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1001C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1001C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, commercial-grade applications, this device delivers 200,000 system gates in a fine-pitch BGA package, making it a popular choice for embedded systems, digital signal processing, and rapid prototyping. Whether you are an electronics engineer sourcing components or a designer evaluating programmable logic devices, this guide covers everything you need to know about the XC2S200-6FGG1001C.


What Is the XC2S200-6FGG1001C?

The XC2S200-6FGG1001C is part of the Xilinx Spartan-II 2.5V FPGA family. It is the largest device in the Spartan-II lineup, offering the highest logic density, maximum user I/O, and the largest memory capacity in the series. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200,000 system gates
-6 Speed grade 6 (fastest available in commercial range)
FGG Fine Pitch Ball Grid Array (BGA) package, Pb-free
1001 1,001-ball package (note: standard package is FGG456; verify sourcing)
C Commercial temperature range (0°C to +85°C)

Note: The standard Spartan-II XC2S200 was offered in FGG456 packages. If you are sourcing the “FGG1001” variant, always verify with your distributor that this is the correct and compatible footprint for your PCB design.


XC2S200-6FGG1001C Key Features

The XC2S200-6FGG1001C offers a robust set of features tailored for commercial FPGA applications:

  • 200,000 system gates (logic and RAM combined)
  • 5,292 logic cells organized in a 28 × 42 CLB array
  • 1,176 total Configurable Logic Blocks (CLBs)
  • 284 maximum user I/O pins
  • 75,264 bits of distributed RAM
  • 56K bits of block RAM (two dedicated block RAM columns)
  • Four Delay-Locked Loops (DLLs) for clock management
  • 2.5V core voltage operation
  • Speed grade -6 – the fastest commercial speed grade in the Spartan-II family
  • Commercial temperature range: 0°C to +85°C
  • Supports JTAG boundary scan (IEEE 1149.1)
  • Multiple configuration modes: Master Serial, Slave Serial, Slave Parallel, Boundary-Scan
  • Compatible with Xilinx ISE design tools

XC2S200-6FGG1001C Full Technical Specifications

Core Logic Specifications

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56,384 (56K)
Delay-Locked Loops (DLLs) 4

Package & Ordering Specifications

Parameter Details
Package Type FGG – Fine Pitch Ball Grid Array (Pb-free)
Speed Grade -6 (fastest commercial grade)
Operating Temperature 0°C to +85°C (Commercial)
Core Voltage 2.5V
I/O Voltage 2.5V (with multi-voltage I/O support)
Configuration Bits 1,335,840

Configuration Modes

Configuration Mode CCLK Direction Data Width Serial DOUT
Master Serial Output 1-bit Yes
Slave Serial Input 1-bit Yes
Slave Parallel Input 8-bit No
Boundary-Scan (JTAG) N/A 1-bit No

Spartan-II Family Comparison: Where Does XC2S200 Stand?

The XC2S200 is the flagship device of the Spartan-II family. The table below shows how it compares to other family members:

Device Logic Cells System Gates CLB Array Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 8×12 86 6,144 bits 16K
XC2S30 972 30,000 12×18 92 13,824 bits 24K
XC2S50 1,728 50,000 16×24 176 24,576 bits 32K
XC2S100 2,700 100,000 20×30 176 38,400 bits 40K
XC2S150 3,888 150,000 24×36 260 55,296 bits 48K
XC2S200 5,292 200,000 28×42 284 75,264 bits 56K

The XC2S200 offers roughly 12× the logic capacity of the smallest Spartan-II device, making it ideal for applications that demand higher gate counts and more on-chip memory.


XC2S200-6FGG1001C Applications

The XC2S200-6FGG1001C is well-suited for a wide range of embedded and digital design applications, including:

  • Industrial control systems – real-time logic processing with deterministic timing
  • Telecommunications equipment – high-speed serial and parallel data interfaces
  • Digital signal processing (DSP) – FIR filters, FFTs, and data path acceleration
  • Motor control – PWM generation and encoder feedback processing
  • Data acquisition systems – interface bridging and protocol conversion
  • Rapid prototyping – ASIC replacement and pre-production validation
  • Communications buses – PCI, SPI, I²C, UART, and other interface implementations

XC2S200-6FGG1001C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II CLB is the fundamental building block of the XC2S200. Each CLB contains two slices, and each slice includes two function generators (LUTs), two storage elements (flip-flops or latches), carry logic, and arithmetic logic. The 28×42 array provides 1,176 CLBs capable of implementing complex combinational and sequential logic.

Input/Output Blocks (IOBs)

The 284 programmable IOBs support a variety of I/O standards, including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. Each IOB has programmable drive strength, slew rate control, and optional input delay for setup time improvement.

Block RAM

Two columns of dedicated block RAM are embedded between the CLB array and the IOB columns. Each 4K-bit block RAM is fully synchronous and supports simple dual-port and true dual-port operation, providing 56K bits of embedded storage for the XC2S200.

Delay-Locked Loops (DLLs)

Four DLLs — one at each corner of the die — provide zero-propagation-delay clock distribution, clock frequency synthesis, and phase shifting. This is critical for high-speed synchronous design and for eliminating clock skew across the device.


Why Choose the XC2S200-6FGG1001C?

Proven Reliability in Commercial Designs

The Spartan-II FPGA family has been used in production designs across multiple industries for over two decades. The -6 speed grade of the XC2S200 is exclusively available in the commercial temperature range, offering the fastest timing performance within the device family.

Cost-Effective Alternative to ASICs

Xilinx designed the Spartan-II family as a cost-effective alternative to mask-programmed ASICs. The XC2S200-6FGG1001C offers the full reconfigurability of an FPGA with enough gate capacity to implement real-world ASIC functionality, shortening development cycles and eliminating NRE costs.

Design Tool Compatibility

The XC2S200-6FGG1001C is fully supported by Xilinx ISE Design Suite, including the Foundation and WebPACK editions. Designers can use VHDL, Verilog, or schematic entry methods for design implementation.

For more information about Xilinx programmable logic devices and to compare alternative FPGA families, visit Xilinx FPGA.


Ordering Information & Part Number Decoder

Understanding the Xilinx part numbering system helps ensure you order the correct device:

Position Code Meaning
Device XC2S200 Spartan-II, 200K gates
Speed Grade -6 Fastest (commercial only)
Package FGG Fine Pitch BGA, Pb-free
Pin Count 1001 Number of BGA balls
Temperature C Commercial (0°C to +85°C)

Standard Spartan-II XC2S200 packages include FGG456 (456-ball) and FGG256 (256-ball). If you are seeing an FGG1001 (1001-ball) designation, confirm availability and pinout compatibility with your component distributor before placing an order.


Frequently Asked Questions (FAQ)

What is the core voltage of the XC2S200-6FGG1001C?

The XC2S200-6FGG1001C operates at a 2.5V core supply voltage (VCCINT). I/O banks may support 2.5V or other I/O standards depending on the applied VCCO voltage.

What is the maximum clock frequency of the XC2S200-6FGG1001C?

At speed grade -6, the device supports internal clock frequencies typically in the range of 200+ MHz depending on the design and logic path. Refer to the official Xilinx timing specifications for detailed propagation delay values.

Is the XC2S200-6FGG1001C still in production?

The Spartan-II family has reached end-of-life (EOL) status. However, the XC2S200 devices remain widely available through authorized distributors and the secondary electronics market. Always verify authenticity when sourcing from non-authorized channels.

Can the XC2S200-6FGG1001C be used in industrial temperature ranges?

The C suffix indicates a commercial temperature range (0°C to +85°C). For industrial temperature applications (-40°C to +85°C), look for the I suffix variant.

What configuration memory is required for the XC2S200?

The XC2S200 requires 1,335,840 configuration bits. This determines the required PROM size for non-volatile configuration storage.


Summary

The XC2S200-6FGG1001C is the highest-density member of the Xilinx Spartan-II FPGA family, offering 200,000 system gates, 284 user I/Os, 56K bits of block RAM, and a -6 speed grade in a commercial temperature-rated fine-pitch BGA package. It is a proven, cost-effective solution for high-volume digital design applications ranging from industrial control to digital communications. While the Spartan-II family has been superseded by newer Xilinx FPGA generations, the XC2S200 remains a reliable and widely sourced component for legacy and new designs alike.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.