The XC2S200-6FGG1001C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, commercial-grade applications, this device delivers 200,000 system gates in a fine-pitch BGA package, making it a popular choice for embedded systems, digital signal processing, and rapid prototyping. Whether you are an electronics engineer sourcing components or a designer evaluating programmable logic devices, this guide covers everything you need to know about the XC2S200-6FGG1001C.
What Is the XC2S200-6FGG1001C?
The XC2S200-6FGG1001C is part of the Xilinx Spartan-II 2.5V FPGA family. It is the largest device in the Spartan-II lineup, offering the highest logic density, maximum user I/O, and the largest memory capacity in the series. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II device with 200,000 system gates |
| -6 |
Speed grade 6 (fastest available in commercial range) |
| FGG |
Fine Pitch Ball Grid Array (BGA) package, Pb-free |
| 1001 |
1,001-ball package (note: standard package is FGG456; verify sourcing) |
| C |
Commercial temperature range (0°C to +85°C) |
Note: The standard Spartan-II XC2S200 was offered in FGG456 packages. If you are sourcing the “FGG1001” variant, always verify with your distributor that this is the correct and compatible footprint for your PCB design.
XC2S200-6FGG1001C Key Features
The XC2S200-6FGG1001C offers a robust set of features tailored for commercial FPGA applications:
- 200,000 system gates (logic and RAM combined)
- 5,292 logic cells organized in a 28 × 42 CLB array
- 1,176 total Configurable Logic Blocks (CLBs)
- 284 maximum user I/O pins
- 75,264 bits of distributed RAM
- 56K bits of block RAM (two dedicated block RAM columns)
- Four Delay-Locked Loops (DLLs) for clock management
- 2.5V core voltage operation
- Speed grade -6 – the fastest commercial speed grade in the Spartan-II family
- Commercial temperature range: 0°C to +85°C
- Supports JTAG boundary scan (IEEE 1149.1)
- Multiple configuration modes: Master Serial, Slave Serial, Slave Parallel, Boundary-Scan
- Compatible with Xilinx ISE design tools
XC2S200-6FGG1001C Full Technical Specifications
Core Logic Specifications
| Parameter |
XC2S200 Value |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56,384 (56K) |
| Delay-Locked Loops (DLLs) |
4 |
Package & Ordering Specifications
| Parameter |
Details |
| Package Type |
FGG – Fine Pitch Ball Grid Array (Pb-free) |
| Speed Grade |
-6 (fastest commercial grade) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Core Voltage |
2.5V |
| I/O Voltage |
2.5V (with multi-voltage I/O support) |
| Configuration Bits |
1,335,840 |
Configuration Modes
| Configuration Mode |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
Output |
1-bit |
Yes |
| Slave Serial |
Input |
1-bit |
Yes |
| Slave Parallel |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
No |
Spartan-II Family Comparison: Where Does XC2S200 Stand?
The XC2S200 is the flagship device of the Spartan-II family. The table below shows how it compares to other family members:
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 bits |
56K |
The XC2S200 offers roughly 12× the logic capacity of the smallest Spartan-II device, making it ideal for applications that demand higher gate counts and more on-chip memory.
XC2S200-6FGG1001C Applications
The XC2S200-6FGG1001C is well-suited for a wide range of embedded and digital design applications, including:
- Industrial control systems – real-time logic processing with deterministic timing
- Telecommunications equipment – high-speed serial and parallel data interfaces
- Digital signal processing (DSP) – FIR filters, FFTs, and data path acceleration
- Motor control – PWM generation and encoder feedback processing
- Data acquisition systems – interface bridging and protocol conversion
- Rapid prototyping – ASIC replacement and pre-production validation
- Communications buses – PCI, SPI, I²C, UART, and other interface implementations
XC2S200-6FGG1001C Architecture Overview
Configurable Logic Blocks (CLBs)
The Spartan-II CLB is the fundamental building block of the XC2S200. Each CLB contains two slices, and each slice includes two function generators (LUTs), two storage elements (flip-flops or latches), carry logic, and arithmetic logic. The 28×42 array provides 1,176 CLBs capable of implementing complex combinational and sequential logic.
Input/Output Blocks (IOBs)
The 284 programmable IOBs support a variety of I/O standards, including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. Each IOB has programmable drive strength, slew rate control, and optional input delay for setup time improvement.
Block RAM
Two columns of dedicated block RAM are embedded between the CLB array and the IOB columns. Each 4K-bit block RAM is fully synchronous and supports simple dual-port and true dual-port operation, providing 56K bits of embedded storage for the XC2S200.
Delay-Locked Loops (DLLs)
Four DLLs — one at each corner of the die — provide zero-propagation-delay clock distribution, clock frequency synthesis, and phase shifting. This is critical for high-speed synchronous design and for eliminating clock skew across the device.
Why Choose the XC2S200-6FGG1001C?
Proven Reliability in Commercial Designs
The Spartan-II FPGA family has been used in production designs across multiple industries for over two decades. The -6 speed grade of the XC2S200 is exclusively available in the commercial temperature range, offering the fastest timing performance within the device family.
Cost-Effective Alternative to ASICs
Xilinx designed the Spartan-II family as a cost-effective alternative to mask-programmed ASICs. The XC2S200-6FGG1001C offers the full reconfigurability of an FPGA with enough gate capacity to implement real-world ASIC functionality, shortening development cycles and eliminating NRE costs.
Design Tool Compatibility
The XC2S200-6FGG1001C is fully supported by Xilinx ISE Design Suite, including the Foundation and WebPACK editions. Designers can use VHDL, Verilog, or schematic entry methods for design implementation.
For more information about Xilinx programmable logic devices and to compare alternative FPGA families, visit Xilinx FPGA.
Ordering Information & Part Number Decoder
Understanding the Xilinx part numbering system helps ensure you order the correct device:
| Position |
Code |
Meaning |
| Device |
XC2S200 |
Spartan-II, 200K gates |
| Speed Grade |
-6 |
Fastest (commercial only) |
| Package |
FGG |
Fine Pitch BGA, Pb-free |
| Pin Count |
1001 |
Number of BGA balls |
| Temperature |
C |
Commercial (0°C to +85°C) |
Standard Spartan-II XC2S200 packages include FGG456 (456-ball) and FGG256 (256-ball). If you are seeing an FGG1001 (1001-ball) designation, confirm availability and pinout compatibility with your component distributor before placing an order.
Frequently Asked Questions (FAQ)
What is the core voltage of the XC2S200-6FGG1001C?
The XC2S200-6FGG1001C operates at a 2.5V core supply voltage (VCCINT). I/O banks may support 2.5V or other I/O standards depending on the applied VCCO voltage.
What is the maximum clock frequency of the XC2S200-6FGG1001C?
At speed grade -6, the device supports internal clock frequencies typically in the range of 200+ MHz depending on the design and logic path. Refer to the official Xilinx timing specifications for detailed propagation delay values.
Is the XC2S200-6FGG1001C still in production?
The Spartan-II family has reached end-of-life (EOL) status. However, the XC2S200 devices remain widely available through authorized distributors and the secondary electronics market. Always verify authenticity when sourcing from non-authorized channels.
Can the XC2S200-6FGG1001C be used in industrial temperature ranges?
The C suffix indicates a commercial temperature range (0°C to +85°C). For industrial temperature applications (-40°C to +85°C), look for the I suffix variant.
What configuration memory is required for the XC2S200?
The XC2S200 requires 1,335,840 configuration bits. This determines the required PROM size for non-volatile configuration storage.
Summary
The XC2S200-6FGG1001C is the highest-density member of the Xilinx Spartan-II FPGA family, offering 200,000 system gates, 284 user I/Os, 56K bits of block RAM, and a -6 speed grade in a commercial temperature-rated fine-pitch BGA package. It is a proven, cost-effective solution for high-volume digital design applications ranging from industrial control to digital communications. While the Spartan-II family has been superseded by newer Xilinx FPGA generations, the XC2S200 remains a reliable and widely sourced component for legacy and new designs alike.