Overview of XCV300E-6FG256C0773 FPGA
The XCV300E-6FG256C0773 is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Virtex-E family. This high-performance programmable logic device offers exceptional flexibility and performance for demanding embedded applications, digital signal processing, and complex logic implementations. As part of the legacy Xilinx FPGA product line, now under AMD ownership, this component continues to serve critical roles in industrial, telecommunications, and aerospace applications.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| Part Number |
XCV300E-6FG256C0773 |
| Manufacturer |
AMD Xilinx (Originally Xilinx Inc.) |
| Product Family |
Virtex-E 1.8V FPGAs |
| Logic Cells |
6,912 cells |
| System Gates |
300,000 gates (82.944K equivalent) |
| Configurable Logic Blocks (CLBs) |
1,536 CLBs |
| Package Type |
256-pin Fine-Pitch BGA (FBGA) |
| Package Code |
FG256 |
| Speed Grade |
-6 (Standard Performance) |
| Operating Voltage |
1.8V Core |
I/O and Interface Capabilities
| Feature |
Specification |
| User I/O Pins |
176 I/O pins |
| Maximum I/O Standards |
Multiple voltage standards supported |
| Package Dimensions |
256-ball Fine Grid Array |
| Technology Node |
0.18μm CMOS process |
| Operating Frequency |
Up to 357MHz system performance |
Advanced Features and Benefits
Programmable Logic Excellence
The XCV300E-6FG256C0773 delivers exceptional programmable logic capabilities that make it ideal for applications requiring:
- High-density logic implementation with 1,536 configurable logic blocks
- Flexible routing architecture using advanced 6-layer metal interconnect
- Optimized place-and-route efficiency for maximum silicon utilization
- Fast time-to-market through reconfigurable hardware implementation
Design Flexibility
This Virtex-E FPGA provides engineers with extensive design flexibility through:
- Reconfigurable hardware architecture allowing field updates and modifications
- Multiple I/O standards support for interfacing with various system components
- Rich hierarchy of interconnect resources ensuring optimal signal routing
- Comprehensive development tool support via Xilinx ISE and Vivado compatibility
Performance Characteristics
Speed and Timing
| Performance Metric |
Specification |
| Speed Grade |
-6 (Commercial) |
| System Clock Rate |
Up to 357MHz |
| Internal Clock Management |
Integrated DLLs (Delay-Locked Loops) |
| Signal Propagation |
Low-skew global clock distribution |
Power and Thermal Management
| Parameter |
Details |
| Core Voltage |
1.8V typical |
| Power Consumption |
Dependent on utilization and frequency |
| Operating Temperature Range |
Commercial grade (0°C to +85°C) |
| Thermal Package |
Enhanced heat dissipation through BGA package |
Application Areas
Primary Use Cases
The XCV300E-6FG256C0773 excels in multiple application domains:
Telecommunications Infrastructure
- High-speed data processing and protocol conversion
- Network switching and routing applications
- Wireless baseband processing
- Signal processing for communication systems
Industrial Automation
- Real-time control systems
- Motor control and motion systems
- Machine vision processing
- Industrial protocol interfaces
Embedded Computing
- Custom processing architectures
- Hardware acceleration engines
- Interface bridging applications
- Embedded co-processing solutions
Aerospace and Defense
- Avionics systems
- Radar signal processing
- Secure communications
- Mission-critical control systems
Package and Physical Specifications
BGA Package Details
| Physical Attribute |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pins |
256 balls |
| Ball Pitch |
1.0mm typical |
| Package Footprint |
Compact surface-mount design |
| Mounting Type |
Surface Mount Technology (SMT) |
| Moisture Sensitivity Level |
MSL 3 typical |
Quality and Reliability
- RoHS Compliance: Legacy product (check specific lot compliance)
- Manufacturing Quality: Built using advanced 0.18μm semiconductor process
- Lifecycle Status: Mature product with established reliability
- Alternative Sources: Available through authorized distributors and Rochester Electronics
Development and Programming
Software Tool Support
The XCV300E-6FG256C0773 is compatible with industry-standard FPGA development tools:
- Xilinx ISE Design Suite: Traditional development environment
- Vivado Design Suite: Modern synthesis and implementation tool (with legacy support)
- Third-party synthesis tools: Synplify Pro and other compatible solutions
- Programming interfaces: JTAG boundary scan for configuration and debugging
Design Resources
Engineers working with this FPGA have access to:
- Comprehensive datasheets and reference manuals
- Application notes for common implementations
- IP cores and reference designs
- Technical support through AMD Xilinx channels
- Community forums and knowledge bases
Competitive Advantages
Why Choose XCV300E-6FG256C0773?
- Proven Architecture: Based on the successful Virtex-E platform with years of field deployment
- Cost-Effective Solution: Mature technology offering excellent price-performance ratio
- Wide Availability: Supported by multiple distributors and aftermarket suppliers
- Extensive Ecosystem: Large library of compatible IP cores and reference designs
- Long-term Support: Continued availability through authorized channels including Rochester Electronics
Procurement and Availability
Sourcing Information
| Attribute |
Information |
| Primary Manufacturer |
AMD Xilinx |
| Secondary Sources |
Rochester Electronics (authorized continuation) |
| Typical Lead Time |
Stock dependent – 1 to 12 weeks |
| Minimum Order Quantity |
Varies by distributor |
| Package Quantity |
Typically shipped in trays or tubes |
Quality Assurance
When purchasing XCV300E-6FG256C0773, ensure:
- Verification of authentic AMD Xilinx parts
- Proper ESD (Electrostatic Discharge) handling and packaging
- Date code verification for shelf-life assurance
- Traceability documentation from authorized sources
- Moisture sensitivity level compliance
Design Considerations
PCB Layout Guidelines
For optimal performance when implementing XCV300E-6FG256C0773:
Power Distribution
- Provide adequate decoupling capacitors near power pins
- Use proper power plane design for 1.8V core and I/O voltages
- Implement low-inductance grounding techniques
- Consider power sequencing requirements
Signal Integrity
- Maintain controlled impedance for high-speed signals
- Use appropriate trace spacing for BGA fanout
- Implement proper termination for I/O standards
- Consider crosstalk mitigation techniques
Thermal Management
- Ensure adequate airflow or heatsinking for high-utilization designs
- Monitor junction temperature during operation
- Consider thermal vias in BGA pad layout
- Plan for worst-case power dissipation scenarios
Migration and Upgrade Paths
Future-Proofing Your Design
While the XCV300E-6FG256C0773 remains available, designers should consider:
- Pin-compatible alternatives from newer Xilinx families
- Performance migration to Spartan-6 or Artix-7 for higher performance
- Design portability using HDL for easier future migration
- IP core reusability to minimize redesign effort
Replacement Considerations
When planning for long-term production:
- Consult with Rochester Electronics for long-term availability
- Evaluate newer FPGA families for new designs
- Maintain source code and design files for migration flexibility
- Consider second-sourcing strategies for critical applications
Technical Support and Resources
Getting Help
AMD Xilinx and authorized partners provide comprehensive support:
- Technical documentation: Datasheets, user guides, and application notes
- Design tools: Free WebPACK or full ISE/Vivado licenses
- Community support: Online forums and knowledge bases
- Field application engineers: Available through distributors
- Training resources: Webinars, tutorials, and certification programs
Conclusion
The XCV300E-6FG256C0773 represents a mature, reliable FPGA solution from AMD Xilinx’s proven Virtex-E family. With 300,000 system gates, 176 I/O pins, and robust performance characteristics, this device continues to serve critical applications across telecommunications, industrial, and embedded computing markets. Its combination of proven architecture, wide availability, and extensive development tool support makes it an excellent choice for applications requiring reliable, high-performance programmable logic.
Whether you’re maintaining legacy systems, developing cost-sensitive embedded solutions, or implementing moderate-complexity digital designs, the XCV300E-6FG256C0773 offers the performance, flexibility, and reliability needed for success.
