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XCV200E-7FG456C: Xilinx Virtex-E FPGA – Full Specifications & Product Guide

Product Details

The XCV200E-7FG456C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-E family, designed for engineers and system architects who demand speed, flexibility, and silicon efficiency. Built on a 0.18 µm CMOS process with a 456-pin Fine-Pitch Ball Grid Array (FBGA) package, this device delivers 63,504 equivalent system gates and operates at up to 400 MHz — making it a proven solution for demanding digital design applications.

Whether you are working on telecom infrastructure, embedded processing, digital signal processing (DSP), or high-speed data acquisition, the XCV200E-7FG456C provides the programmable logic capacity and I/O bandwidth your design requires.


What Is the XCV200E-7FG456C?

The XCV200E-7FG456C is a member of the Xilinx Virtex-E 1.8V FPGA family — an evolutionary advancement over the original Virtex architecture. Combining a rich hierarchy of fast, flexible interconnect resources with advanced 6-layer metal process technology, the Virtex-E family was designed as a high-density, high-speed alternative to mask-programmed gate arrays, dramatically reducing time-to-market without sacrificing performance.

The part number encodes the device’s key attributes:

Segment Meaning
XCV200E Virtex-E family, 200K logic capacity
-7 Speed grade 7 (fastest in the Virtex-E lineup)
FG456 456-pin Fine-Pitch Ball Grid Array (FBGA) package
C Commercial temperature range (0°C to +85°C TJ)

XCV200E-7FG456C Key Technical Specifications

The table below summarizes the core electrical and physical parameters of the XCV200E-7FG456C:

Parameter Value
Manufacturer Xilinx (now AMD)
Series / Family Virtex-E
Part Number XCV200E-7FG456C
Logic Gates (Equivalent) 63,504
Logic Cells 5,292
CLBs (Configurable Logic Blocks) 1,176
I/O Pins 284
Maximum Operating Frequency 400 MHz
Core Supply Voltage (VCCINT) 1.8V (1.71V – 1.89V)
Process Technology 0.18 µm 6-layer metal CMOS
Package 456-Pin FBGA (FG456)
Mounting Type Surface Mount
On-chip SRAM (Block RAM) 114,688 bits (≈ 14 kB)
Commercial Temp Range 0°C to +85°C TJ
RoHS Compliance No (legacy part)
Life Cycle Status Obsolete (legacy/last-time-buy)

XCV200E-7FG456C Package & Pinout Overview

The XCV200E-7FG456C uses a 456-pin Fine-Pitch Ball Grid Array (FBGA) package — also referred to as BBGA or FBGA-456. This compact, surface-mount package offers high pin density and excellent electrical performance, making it suitable for high-speed PCB designs.

Package Details

Attribute Detail
Package Code FG456 / FBGA-456
Total Pin Count 456
User I/O Count 284
Mounting Surface Mount (SMD)
Packaging / Shipping Tray

The 284 user-configurable I/O pins support multiple single-ended and differential I/O standards, giving designers maximum flexibility in interfacing with external devices, memory, and communication buses.


Virtex-E Architecture: What Makes It Powerful

The Virtex-E family architecture is built around a modular array of Configurable Logic Blocks (CLBs), Block RAM, dedicated multipliers, and a hierarchy of routing resources. The XCV200E-7FG456C benefits from all these architectural features.

Configurable Logic Blocks (CLBs)

Each CLB in the Virtex-E family contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), storage elements (flip-flops), and carry logic for fast arithmetic. With 1,176 CLBs and 5,292 logic cells, the XCV200E-7FG456C provides ample resources for moderate to complex logic designs.

Block RAM (BRAM)

On-chip Block RAM in the XCV200E-7FG456C totals 114,688 bits (~14 kB), configurable as single-port or true dual-port memory. This enables fast, synchronous storage of lookup tables, FIFOs, accumulators, and data buffers without consuming CLB resources.

Interconnect Hierarchy

The Virtex-E routing architecture features a multi-tiered interconnect system including local, long-line, and global routing resources. This results in highly predictable, repeatable timing closure — an essential attribute for high-frequency digital designs.

Dedicated DLL and Global Clock Networks

The device includes Delay-Locked Loops (DLLs) for clock deskewing, phase shifting, and frequency synthesis, along with dedicated global clock buffers to distribute low-skew clocks across the entire device.


Speed Grade -7: Performance Characteristics

The -7 speed grade is the highest-performance variant in the Virtex-E family. Key performance benefits include:

Performance Metric Specification
Max System Clock 400 MHz
Speed Grade -7 (fastest)
Register-to-Register Delay Optimized for -7 grade
Logic Propagation Minimized via architecture
I/O Setup/Hold Tight constraints for -7 grade

Designers using the -7 speed grade can achieve the highest logic frequencies among XCV200E variants, making this part ideal for applications requiring maximum throughput.


XCV200E-7FG456C vs. Other XCV200E Variants

The XCV200E is available in multiple speed grades and package combinations. Understanding the differences helps ensure you select the right variant for your system requirements.

Part Number Speed Grade Package Temp Range I/O Pins
XCV200E-6FG456C -6 (moderate) 456 FBGA Commercial 284
XCV200E-7FG456C (this part) -7 (fastest) 456 FBGA Commercial 284
XCV200E-7FG456I -7 (fastest) 456 FBGA Industrial 284
XCV200E-8FG256C -8 256 FBGA Commercial Lower
XCV200E-7PQ240C -7 240 PQFP Commercial Lower

The FG456 package provides the highest I/O count (284 pins) in the XCV200E family, while the C suffix confirms commercial temperature operation (0°C – 85°C TJ). For industrial applications requiring operation down to -40°C, the XCV200E-7FG456I should be selected instead.


Supported I/O Standards

The XCV200E-7FG456C supports a wide variety of I/O signaling standards, enabling seamless integration with diverse system components:

I/O Standard Category Examples
Single-Ended CMOS LVCMOS 3.3V, 2.5V, 1.8V
Single-Ended TTL LVTTL
Low-Voltage Differential LVDS, LVPECL, GTL, GTL+
Bus Standards PCI (3.3V), AGP, HSTL
High-Speed I/O SSTL2, SSTL3

This extensive I/O standard support allows the XCV200E-7FG456C to interface with DDR memory, high-speed buses, and mixed-voltage systems without external level-shifting circuitry.


Typical Applications for the XCV200E-7FG456C

As a versatile Xilinx FPGA, the XCV200E-7FG456C has been deployed across a broad range of industries and system types, including:

Application Area Use Case Examples
Telecommunications Line cards, framing/mapping, signal routing
Data Centers & Enterprise Network switching, high-speed data buffering
Automotive (ADAS) Sensor data fusion, image processing pipelines
Defense & Aerospace Signal processing, radar front-ends
Industrial Automation Real-time control, machine vision interfaces
Consumer Electronics Home theater processing, display controllers
Embedded Systems Custom soft-core processor implementations
Test & Measurement Pattern generation, data capture, logic analysis

Design Tools and Software Support

The XCV200E-7FG456C is supported by Xilinx’s legacy ISE Design Suite (not Vivado, which targets newer 7-Series and UltraScale devices). Key software tools for this device include:

  • Xilinx ISE – Synthesis, implementation, and bitstream generation
  • XST (Xilinx Synthesis Technology) – HDL synthesis engine within ISE
  • ChipScope Pro – On-chip logic analysis and debugging
  • CORE Generator – IP core generation for common logic functions
  • iMPACT – JTAG-based device programming and boundary scan

Since the XCV200E-7FG456C is an obsolete part, Xilinx/AMD no longer provides active software updates for it. Engineers should use the last supported ISE version (14.7) for new or legacy design maintenance.


Ordering Information & Supply Chain Notes

Attribute Detail
Manufacturer Xilinx, Inc. (now AMD)
Full Part Number XCV200E-7FG456C
ECCN Code 3A991.D
RoHS Non-compliant (legacy)
Life Cycle Obsolete
Recommended Alternatives Xilinx Spartan-6, Artix-7, or Kintex-7 families

Because the XCV200E-7FG456C is an obsolete component, it is no longer manufactured in production quantities. Stock is primarily available through independent distributors, franchise distributors managing end-of-life inventory, and authorized excess stock channels. When sourcing this component, buyers should verify:

  • Authenticity and traceability (request COC / test reports)
  • Date codes and original reel/tray packaging
  • ESD-compliant handling and shipping
  • Supplier certifications (ISO, AS9120 for defense/aerospace)

XCV200E-7FG456C Absolute Maximum Ratings

Operating the XCV200E-7FG456C beyond its absolute maximum ratings can cause permanent damage. The following are the critical limits to observe:

Parameter Rating
Supply Voltage (VCCINT) –0.5V to +2.5V
Supply Voltage (VCCO) –0.5V to +4.0V
Input Voltage (VI) –0.5V to VCCO + 0.5V
Storage Temperature –65°C to +150°C
Junction Temperature (TJ) – Commercial 0°C to +85°C
ESD Protection Per JEDEC/JESD22

Always operate within recommended conditions — not at absolute maximum ratings — to ensure full functionality, timing compliance, and long-term device reliability.


Frequently Asked Questions (FAQ)

What is the XCV200E-7FG456C used for?

The XCV200E-7FG456C is a Xilinx Virtex-E FPGA used in high-speed digital design applications such as telecommunications, embedded systems, industrial automation, automotive ADAS, and data center equipment. Its 400 MHz operating frequency and 284 I/O pins make it suitable for bandwidth-intensive designs.

What does the “-7” speed grade mean in XCV200E-7FG456C?

The “-7” indicates the fastest speed grade available in the XCV200E family. A higher speed grade number correlates with faster internal propagation delays and allows the device to operate at higher clock frequencies — up to 400 MHz in this case.

Is the XCV200E-7FG456C still in production?

No. The XCV200E-7FG456C is classified as Obsolete by Xilinx/AMD. It is no longer in active production. Availability is limited to existing inventory held by distributors, and designers starting new projects should evaluate pin-compatible or functionally equivalent replacements from the Xilinx Spartan-6 or Artix-7 families.

What package does the XCV200E-7FG456C use?

It uses a 456-pin Fine-Pitch Ball Grid Array (FBGA-456) package, also denoted FG456. This is a surface-mount package with a total of 456 solder balls, of which 284 are user-accessible I/O pins.

What is the core voltage for the XCV200E-7FG456C?

The core supply voltage (VCCINT) is 1.8V, with a recommended operating range of 1.71V to 1.89V. I/O voltages (VCCO) vary depending on the selected I/O standard, ranging from 1.5V to 3.3V.

What software tools are used to program the XCV200E-7FG456C?

The XCV200E-7FG456C is supported by the Xilinx ISE Design Suite (version 14.7 is the final release). Vivado does not support Virtex-E devices. Programming is performed via JTAG using iMPACT, and on-chip debugging can be done with ChipScope Pro.


Summary

The XCV200E-7FG456C remains a powerful and capable FPGA for engineers maintaining legacy systems or working with architectures originally designed around the Virtex-E family. Its combination of 63,504 equivalent gates, 284 I/O pins, 400 MHz performance, and 1.8V core voltage in a compact 456-pin FBGA package made it a benchmark device in its era — and continues to serve engineers in maintenance, repair, and legacy production scenarios.

For new designs, exploring modern Xilinx/AMD FPGA families will offer improved density, lower power consumption, and better toolchain support, while the XCV200E-7FG456C will continue to serve its role in sustaining existing deployed systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.