Overview of XCV100E-6FG256I FPGA
The XCV100E-6FG256I is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family. This industrial-grade FPGA delivers exceptional performance with 100,000 system gates, making it ideal for complex digital designs in telecommunications, industrial automation, consumer electronics, and aerospace applications. As a member of the Xilinx FPGA portfolio, the XCV100E-6FG256I represents proven technology for mission-critical embedded systems.
Key Features and Specifications
The XCV100E-6FG256I stands out with its robust feature set designed for demanding applications:
- System Gates: 100,000 gates (176,000 maximum gates)
- User I/O Pins: 176 configurable I/O
- Logic Cells: 81,920 logic cells
- Configuration Memory: 2,700 CLB slices
- Package Type: 256-pin FineLine BGA (FBGA)
- Speed Grade: -6 (6ns maximum propagation delay)
- Operating Temperature: Industrial range (-40°C to +100°C)
- Supply Voltage: 1.8V to 3.45V (core: 1.8V, I/O: 3.3V)
- Maximum Frequency: 133.3 MHz
- Part Number: XCV100E-6FG256I
Technical Specifications Table
| Parameter |
Specification |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
Virtex-E FPGA Series |
| System Gates |
100,000 |
| Logic Cells |
81,920 |
| CLB Slices |
2,700 |
| User I/O |
176 pins |
| Package Type |
256-FBGA (FineLine Ball Grid Array) |
| Speed Grade |
-6 (6ns delay) |
| Core Voltage |
1.8V |
| I/O Voltage |
3.3V (2.5V/3.3V compatible) |
| Temperature Range |
-40°C to +100°C (Industrial) |
| Max Operating Frequency |
133.3 MHz |
| Lead Status |
Contains lead / RoHS non-compliant |
| Mounting Type |
Surface Mount (SMT) |
Performance Characteristics
Processing Power and Speed
The XCV100E-6FG256I FPGA excels in high-speed digital processing with its -6 speed grade, ensuring minimal propagation delay of just 6 nanoseconds. This makes it suitable for:
- Real-time signal processing
- High-speed data acquisition systems
- Fast control loop applications
- Time-critical embedded systems
Architecture and Logic Resources
| Resource Type |
Quantity |
Description |
| CLB Slices |
2,700 |
Configurable Logic Blocks for custom logic |
| Total Gates |
176,000 |
Maximum usable gates |
| System Gates |
100,000 |
Typical design capacity |
| I/O Standards |
Multiple |
LVTTL, LVCMOS, PCI, GTL+ support |
| Block RAM |
Yes |
Embedded memory blocks |
| DLLs |
4 |
Digital Locked Loops for clock management |
Pin Configuration and Package Details
256-FBGA Package Information
| Package Feature |
Details |
| Package Type |
FineLine BGA (Ball Grid Array) |
| Pin Count |
256 pins |
| Body Size |
17mm x 17mm |
| Ball Pitch |
1.0mm |
| User I/O Available |
176 pins |
| Power Pins |
Multiple VCC/GND pairs |
| Configuration Pins |
JTAG and SelectMAP interface |
| Mounting |
Surface mount technology (SMT) |
I/O Capabilities
The XCV100E-6FG256I provides 176 user-configurable I/O pins supporting multiple voltage standards:
- 3.3V LVTTL/LVCMOS
- 2.5V LVCMOS
- PCI 33/66 MHz
- GTL, GTL+
- SSTL2, SSTL3
- HSTL Class I, II, III, IV
Applications and Use Cases
Primary Applications
The XCV100E-6FG256I FPGA is deployed across various industries:
- Telecommunications Equipment
- Digital signal processing
- Protocol conversion
- Network interface cards
- Wireless base stations
- Industrial Control Systems
- Motor control units
- Process automation
- PLC implementations
- Factory automation
- Consumer Electronics
- Video processing systems
- Audio equipment
- Digital TV set-top boxes
- Gaming hardware
- Automotive Systems
- Engine control units (ECU)
- Advanced driver assistance (ADAS)
- Infotainment systems
- Vehicle diagnostics
- Medical Devices
- Imaging equipment
- Patient monitoring systems
- Laboratory instruments
- Diagnostic devices
- Aerospace and Defense
- Avionics systems
- Radar signal processing
- Secure communications
- Navigation systems
Design Advantages
| Advantage |
Benefit |
| Reconfigurability |
Field-upgradable designs without hardware changes |
| Low Power Consumption |
1.8V core reduces power consumption |
| High Integration |
100K gates reduce external component count |
| Fast Time-to-Market |
Programmable logic accelerates development |
| Cost-Effective |
Single chip replaces multiple discrete ICs |
| Industrial Temperature |
Reliable operation in harsh environments |
Power Supply Requirements
Voltage Specifications
| Supply Rail |
Voltage |
Tolerance |
Purpose |
| VCCINT |
1.8V |
±5% |
Core logic power |
| VCCO |
3.3V |
±5% |
I/O bank power (configurable) |
| VCCAUX |
3.3V |
±5% |
Auxiliary circuits |
| GND |
0V |
– |
Ground reference |
Power Consumption Estimates
- Typical Active Power: 0.5W – 2.0W (design dependent)
- Standby Power: <100mW
- Power per I/O: ~10mW per active I/O
Configuration and Programming
Configuration Methods
The XCV100E-6FG256I supports multiple configuration modes:
- JTAG Boundary Scan – IEEE 1149.1 compliant
- Master Serial Mode – Uses external PROM
- Slave Serial Mode – Controlled by external processor
- SelectMAP – 8-bit parallel configuration
- Slave Parallel Mode – Fastest configuration method
Development Tools
Compatible with Xilinx design tools:
- Vivado Design Suite (legacy support)
- ISE Design Suite (primary tool)
- ChipScope Pro – On-chip debugging
- ModelSim – HDL simulation
- VHDL/Verilog – HDL language support
Reliability and Quality
Environmental and Mechanical Specifications
| Parameter |
Specification |
| Operating Temperature |
-40°C to +100°C |
| Storage Temperature |
-65°C to +150°C |
| Moisture Sensitivity Level |
MSL 3 |
| ESD Protection |
HBM: 2000V, CDM: 500V |
| MTBF |
>1,000,000 hours |
| Quality Standard |
ISO 9001 certified |
Compliance and Standards
- Industrial Temperature Grade (-I suffix)
- Lead-bearing solder balls (pre-RoHS)
- JEDEC compliant package
- IPC standards for PCB layout
Comparison with Similar FPGAs
XCV100E Series Variants
| Part Number |
Package |
I/O Pins |
Speed Grade |
Temp Range |
| XCV100E-6FG256I |
256-FBGA |
176 |
-6 |
Industrial |
| XCV100E-6FG256C |
256-FBGA |
176 |
-6 |
Commercial |
| XCV100E-7FG256I |
256-FBGA |
176 |
-7 |
Industrial |
| XCV100E-6PQ240I |
240-PQFP |
158 |
-6 |
Industrial |
| XCV100E-6BG352I |
352-BGA |
221 |
-6 |
Industrial |
Performance Comparison
- Faster than -7 speed grade (better performance)
- More I/O than PQ240 package (176 vs 158 pins)
- Smaller footprint than BG352 (17mm vs 27mm)
- Industrial temp range advantage over commercial grades
Procurement and Availability
Where to Buy XCV100E-6FG256I
The XCV100E-6FG256I is available through authorized distributors:
- Digi-Key Electronics – Full stock and documentation
- Mouser Electronics – Global shipping
- Arrow Electronics – Volume pricing
- Avnet – Design support services
- Authorized Xilinx distributors – Guaranteed authenticity
Pricing Information
Pricing varies based on:
- Order quantity (volume discounts available)
- Lead time (stock vs. custom order)
- Distribution channel (direct vs. distributor)
- Package type and speed grade
Contact authorized distributors for current pricing
Design Considerations
PCB Layout Guidelines
When designing with the XCV100E-6FG256I:
- Power Plane Design
- Separate analog and digital grounds
- Multiple decoupling capacitors (0.01µF, 0.1µF, 10µF)
- Low-impedance power distribution
- Signal Integrity
- Controlled impedance traces for high-speed signals
- Proper termination for I/O signals
- Minimize crosstalk between adjacent pins
- Thermal Management
- Adequate copper pour for heat dissipation
- Thermal vias under package if needed
- Monitor junction temperature in design
- Configuration Interface
- JTAG connector for programming/debug
- Configuration mode selection circuitry
- External PROM if using Master mode
Common Design Challenges
| Challenge |
Solution |
| Power Supply Noise |
Multiple decoupling caps, power planes |
| Clock Distribution |
Use DLLs, minimize skew |
| I/O Timing |
Proper constraints in UCF file |
| Configuration Errors |
Check bitstream and connections |
| Thermal Issues |
Add heatsink or improve airflow |
Support and Resources
Documentation
- Product Data Sheet – Complete electrical specifications
- User Guide – Virtex-E architecture and features
- Application Notes – Design best practices
- Package Drawings – Mechanical dimensions
- Configuration Guide – Programming instructions
Technical Support
For technical assistance with the XCV100E-6FG256I:
- AMD Xilinx Support Portal – Online resources
- Community Forums – Peer-to-peer help
- Field Application Engineers – Direct support
- Authorized Distributors – Local assistance
Frequently Asked Questions (FAQ)
Q1: Is the XCV100E-6FG256I recommended for new designs?
While the Virtex-E series is mature and proven, AMD Xilinx now offers newer families (7-Series, UltraScale) with better performance and lower power. However, the XCV100E remains suitable for cost-sensitive applications and design continuity.
Q2: What is the difference between -6 and -7 speed grades?
The -6 speed grade is faster than -7, with lower propagation delays. The -6 grade provides better timing performance for high-speed applications but may consume slightly more power.
Q3: Can I use 2.5V I/O with this FPGA?
Yes, the XCV100E-6FG256I supports multiple I/O voltage standards including 2.5V LVCMOS when configured appropriately in the design software.
Q4: What programming cable do I need?
Standard Xilinx programming cables work, including:
- Platform Cable USB II
- Platform Cable USB
- Compatible JTAG programmers (3.3V LVTTL levels)
Q5: Is this part RoHS compliant?
No, the XCV100E-6FG256I contains lead and is not RoHS compliant. For RoHS applications, consider newer Xilinx FPGA families or request lead-free alternatives if available.
Q6: What development software should I use?
Use ISE Design Suite (version 14.7 or compatible) for Virtex-E FPGAs. Vivado does not support this older device family.
Q7: How many logic resources do I actually get?
While the device has 176,000 maximum gates, the typical usable system gates are 100,000. Actual utilization depends on your design complexity and architecture.
Conclusion
The XCV100E-6FG256I remains a reliable choice for industrial embedded applications requiring proven FPGA technology. With 100,000 system gates, 176 I/O pins, and industrial temperature ratings, this Xilinx FPGA delivers the performance and reliability needed for demanding environments.
Key Takeaways
✓ High-performance FPGA with 100K system gates
✓ 176 configurable I/O in compact 256-FBGA package
✓ Industrial temperature range (-40°C to +100°C)
✓ 6ns propagation delay for time-critical applications
✓ Proven Virtex-E architecture with extensive design support
✓ Multiple configuration modes for flexible deployment
✓ Wide application range from telecom to aerospace
Whether you’re designing industrial control systems, telecommunications equipment, or embedded processing solutions, the XCV100E-6FG256I offers the perfect balance of performance, integration, and reliability.
