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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
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XCV100E-6PQG240C: Xilinx Virtex-E FPGA – Full Specifications & Buyer’s Guide

Product Details

The XCV100E-6PQG240C is a high-performance Xilinx FPGA from the Virtex-E family, manufactured using advanced 0.18 µm CMOS process technology. Designed for demanding programmable logic applications, this device delivers 32,400 system gates, 2,700 logic cells, and operates at up to 357 MHz — all in a compact 240-pin PQFP (Plastic Quad Flat Pack) package. Whether you are prototyping a new embedded design or sourcing a proven legacy component, the XCV100E-6PQG240C offers the flexibility and performance that engineers rely on.


What Is the XCV100E-6PQG240C?

The XCV100E-6PQG240C belongs to Xilinx’s Virtex-E series — an evolutionary advancement over the original Virtex family. Built on a 6-layer metal, 0.18 µm CMOS process, the Virtex-E line was engineered for superior place-and-route efficiency. The “E” suffix denotes the enhanced generation, while the part number breaks down as follows:

Part Number Segment Meaning
XCV100E Virtex-E family, 100K-gate equivalent
-6 Speed grade 6 (commercial)
PQG Plastic Quad Flat Pack (Green/RoHS compliant)
240 240-pin package
C Commercial temperature range (0°C to +85°C)

XCV100E-6PQG240C Key Specifications

Core Device Specifications

Parameter Value
Manufacturer Xilinx (AMD)
Series Virtex-E
Part Number XCV100E-6PQG240C
Device Type FPGA (Field Programmable Gate Array)
System Gates 32,400
Logic Cells / CLBs 2,700 cells / 600 CLBs
Maximum Frequency 357 MHz
Core Supply Voltage 1.8 V
Process Technology 0.18 µm 6-layer metal CMOS
Configuration Type SRAM-based

Package & Mounting Information

Parameter Value
Package Type PQFP (Plastic Quad Flat Pack)
Package Variant PQG (Green/RoHS)
Pin Count 240
User I/O Pins Up to 166
Mounting Type Surface Mount (SMD)
Pin Pitch 0.5 mm

Memory & Logic Resources

Resource Quantity
Block RAM 10 Kbits
Distributed RAM Available via LUTs
CLBs (Configurable Logic Blocks) 600
Slices ~1,200
DLLs (Delay-Locked Loops) 4

Electrical & Environmental Parameters

Parameter Value
Core Supply Voltage (VCCINT) 1.8 V
I/O Supply Voltage (VCCO) 1.5 V – 3.3 V (multi-standard)
Operating Temperature Range 0°C to +85°C (Commercial)
ESD Protection Built-in
RoHS Compliance Yes (PQG variant)

XCV100E-6PQG240C Architecture Overview

## CLB and Slice Architecture

The XCV100E-6PQG240C features a CLB-based (Configurable Logic Block) architecture that forms the backbone of its programmable logic capability. Each CLB contains four slices, and each slice includes two 4-input look-up tables (LUTs), two flip-flops, and dedicated carry logic. This architecture enables efficient implementation of combinational and sequential logic, arithmetic operations, and small distributed RAM functions.

## SelectRAM and Block RAM

The device supports two forms of on-chip memory. Distributed SelectRAM is embedded within the CLB fabric, allowing flexible memory allocation without consuming block RAM resources. The dedicated 10 Kbits of Block RAM provides synchronous, dual-port memory suitable for FIFOs, buffers, and lookup tables in signal processing applications.

## SelectI/O Technology

All I/O blocks (IOBs) in the XCV100E-6PQG240C support Xilinx SelectI/O technology, enabling compatibility with a wide range of I/O standards. Each IOB can be independently configured for voltage levels between 1.5 V and 3.3 V. Supported standards include:

I/O Standard Description
LVTTL Low-Voltage TTL (3.3 V)
LVCMOS Low-Voltage CMOS (1.5 V – 3.3 V)
GTL / GTL+ Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic (1.5 V)
SSTL2 / SSTL3 Stub-Series Terminated Logic
CTT Center-Tap Terminated Logic
PCI PCI bus compatible

## Delay-Locked Loops (DLL)

Four on-chip DLLs provide clock management capabilities including clock deskewing, frequency synthesis, and phase shifting. These enable the XCV100E-6PQG240C to support zero-hold-time designs and reduce clock distribution skew across the FPGA fabric — critical for high-speed synchronous designs.

## IEEE 1149.1 Boundary Scan (JTAG)

The XCV100E-6PQG240C fully supports IEEE 1149.1 JTAG boundary scan for board-level testing and in-system programming. This simplifies PCB debug and allows configuration via JTAG without additional programming hardware.


XCV100E-6PQG240C Configuration Modes

The Virtex-E FPGA supports multiple configuration modes to suit different system designs:

Configuration Mode Description
Master Serial Uses external serial PROM (most common)
Slave Serial Controlled by external microprocessor
Master Parallel (SelectMAP) Fast parallel configuration
Slave Parallel (SelectMAP) Parallel mode driven by host processor
JTAG / Boundary Scan IEEE 1149.1 TAP controller

Configuration data is stored in external non-volatile memory (such as Xilinx XCF PROM series), and the device loads its bitstream on power-up or on demand via JTAG.


Ordering Information & Part Number Variants

The XCV100E is available in multiple speed grades and packages. The table below shows the most common variants:

Part Number Speed Grade Package Pins Temp Range
XCV100E-6PQG240C -6 (357 MHz) PQFP Green 240 Commercial (0°C–85°C)
XCV100E-7PQG240C -7 (400 MHz) PQFP Green 240 Commercial
XCV100E-8PQG240C -8 (416 MHz) PQFP Green 240 Commercial
XCV100E-6FG256C -6 (357 MHz) Fine-Pitch BGA 256 Commercial
XCV100E-6PQG240I -6 PQFP Green 240 Industrial (-40°C–100°C)

Note: The XCV100E-6PQG240C is Not Recommended for New Designs (NRND). Xilinx has designated this part as a legacy product. Engineers starting new projects are encouraged to evaluate modern Xilinx families such as Artix-7, Spartan-7, or Kintex-7 for new development.


Applications of the XCV100E-6PQG240C

The XCV100E-6PQG240C has been widely deployed across a broad range of industries and applications, thanks to its combination of speed, I/O flexibility, and compact form factor:

Application Area Use Case
Telecommunications Line card logic, protocol bridging, multiplexing
Industrial Control Motor control interfaces, sensor data acquisition
Test & Measurement Pattern generation, data capture, protocol analysis
Embedded Computing Custom processor extensions, bus interfaces
Networking Packet processing, switching logic
Medical Devices Signal conditioning, data processing pipelines
Defense & Aerospace Legacy system maintenance and repair
Consumer Electronics Video processing, display controllers

Design Tools & Software Support

## Xilinx ISE Design Suite

The XCV100E-6PQG240C is supported by the Xilinx ISE Design Suite, specifically the legacy ISE version. ISE provides:

  • HDL synthesis (VHDL and Verilog)
  • Place and route implementation
  • Timing analysis and constraint management
  • Bitstream generation and download

The XCV100E is not supported in Xilinx Vivado Design Suite, which targets 7-Series and newer devices. Users must use ISE for design implementation.

## Simulation and Verification

Standard third-party simulators including ModelSim, Active-HDL, and Synopsys VCS are compatible with Xilinx Virtex-E simulation models. EDIF (Electronic Design Interchange Format) netlist support allows seamless integration with most EDA toolchains.


PCB Design Considerations for the XCV100E-6PQG240C

## Decoupling and Power Supply

Proper power supply decoupling is essential for reliable FPGA operation. The 1.8 V VCCINT rail requires low-ESR capacitors placed as close to the power pins as possible. A typical decoupling strategy includes:

  • 100 nF ceramic capacitors at each VCC pin
  • 10 µF bulk capacitors per power domain
  • Dedicated power planes for VCCINT and VCCO

## Signal Integrity at High Speeds

At the maximum 357 MHz operating frequency, signal integrity becomes a key design concern. Engineers should apply controlled impedance routing (typically 50 Ω for single-ended), minimize stub lengths, and use series termination resistors on high-speed outputs where appropriate.

## Thermal Management

The XCV100E-6PQG240C in the PQFP package operates within the commercial temperature range (0°C to +85°C junction temperature). In high-power dissipation scenarios, a small heatsink or adequate PCB copper pour beneath the package can help maintain safe operating temperatures.


Frequently Asked Questions

## Is the XCV100E-6PQG240C still in production?

The XCV100E-6PQG240C is designated Not Recommended for New Designs (NRND) by AMD/Xilinx. While it may still be available through authorized distributors and the secondary market, production quantities are limited. It remains a viable option for legacy system repair and replacement.

## What is the difference between XCV100E-6PQG240C and XCV100E-6PQ240C?

The PQG variant indicates a Green/RoHS-compliant package using halogen-free materials and lead-free solder finish. The standard PQ variant uses a conventional tin-lead finish. The electrical and functional performance is identical between both.

## Can the XCV100E-6PQG240C be programmed in-circuit?

Yes. The device supports in-system configuration via JTAG (IEEE 1149.1) or through external serial/parallel PROM. JTAG programming is the most convenient method for development and field updates.

## What replaces the XCV100E-6PQG240C for new designs?

For new designs requiring similar logic capacity, Xilinx (AMD) recommends considering the Spartan-7 (XC7S15/XC7S25) or Artix-7 (XC7A12T/XC7A25T) families. These newer devices offer significantly more resources, higher performance, lower power consumption, and full Vivado tool support.


Summary: XCV100E-6PQG240C at a Glance

Feature Detail
Part Number XCV100E-6PQG240C
Family Xilinx Virtex-E
Gates 32,400 system gates
Speed 357 MHz
Package 240-pin PQFP (Green)
Supply Voltage 1.8 V core
Temperature 0°C to +85°C (Commercial)
Mounting Surface Mount
Status NRND (Legacy / Maintenance)
Supported Tool Xilinx ISE

The XCV100E-6PQG240C remains a trusted component for engineers maintaining legacy embedded systems, telecommunications equipment, and industrial platforms. Its robust Virtex-E architecture, multi-standard I/O support, and mature design ecosystem make it a reliable choice for sourcing replacement parts or sustaining existing production designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.