The XCV300E-7FG256I is a high-performance, industrial-grade Field Programmable Gate Array (FPGA) from the Xilinx Virtex-E family. Built on an advanced 0.18 µm CMOS process, this device delivers over 411,000 system gates in a compact 256-pin Fine-Pitch Ball Grid Array (FBGA) package — making it an ideal solution for demanding embedded, communications, and DSP applications that require both logic density and reliability across extended temperature ranges.

If you are sourcing or designing with Xilinx FPGA devices, the XCV300E-7FG256I is a well-documented, widely supported option within the Virtex-E product line.

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What Is the XCV300E-7FG256I?

The XCV300E-7FG256I is a member of the Xilinx Virtex-E 1.8 V FPGA family, originally developed by Xilinx (now AMD). The part number breaks down as follows:

This device is classified as IC FPGA 176 I/O 256FBGA and is manufactured by AMD (formerly Xilinx). It belongs to the Virtex®-E series and was fabricated using a 6-layer metal, 0.18 µm CMOS process technology.

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XCV300E-7FG256I Key Specifications

The table below summarizes the most important electrical and logic specifications for the XCV300E-7FG256I.

General Device Specifications

Package and Mechanical Specifications

Memory and Logic Resources

Electrical and Thermal Specifications

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XCV300E-7FG256I Architecture and Core Features

High-Density Configurable Logic Blocks (CLBs)

The XCV300E-7FG256I contains a 32×48 array of Configurable Logic Blocks (CLBs), providing 6,912 logic cells. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This structure enables the implementation of complex logic functions, including any 4-input Boolean function, arithmetic carry chains, and shift-register-based storage.

Each CLB also supports F5-multiplexer outputs, allowing implementation of any 6-input function, an 8:1 multiplexer, or other complex functions without additional resources. The Virtex-E CLB counts as 4.5 logic cells per block when estimating system gate equivalents.

Dual-Port Block SelectRAM™

The device includes 32 Block SelectRAM modules totaling 131,072 bits of on-chip memory. Key characteristics include:

• True dual-port operation with independent clock signals
• Configurable data widths on each port
• Independent read/write control signals per port
• Suitable for FIFOs, buffers, and lookup tables
• Block RAM columns located at CLB columns 0, 12, 24, and 36

SelectI/O+ Technology with Multi-Standard Support

The XCV300E-7FG256I features highly flexible SelectI/O+ technology, supporting a wide range of I/O signaling standards. This makes the device compatible with diverse board-level interfaces without external level-shifting circuitry.

With 176 user I/O pins organized into multiple banks, each bank can be independently powered (VCCO), allowing mixed-voltage designs on a single device.

Distributed RAM and Shift Registers

Beyond Block SelectRAM, the XCV300E-7FG256I provides 98,304 bits of distributed RAM implemented within the CLB LUTs. Each pair of LUTs within a slice can be configured as:

• A 16×2-bit synchronous dual-port RAM
• A 32×1-bit synchronous dual-port RAM
• A shift register for pipelining and delay compensation

Digital Clock Management with DLLs

The XCV300E-7FG256I incorporates Delay-Locked Loop (DLL) blocks for advanced clock management. These DLLs provide:

• Zero-skew internal clock distribution
• External clock de-skewing for board-level synchronization
• Clock multiplication and division for frequency synthesis
• Phase-shifted clock outputs
• Board-level clock mirroring between multiple devices

This makes the device well suited for synchronous design methodologies with tight timing constraints.

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XCV300E-7FG256I Virtex-E Family Comparison

The table below shows where the XCV300E-7FG256I sits within the broader Virtex-E FPGA family.

The XCV300E occupies the mid-range of the Virtex-E family, offering a balance of logic density, on-chip memory, and I/O count suitable for a broad range of embedded and communications designs.

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Package Options for the XCV300E

The XCV300E die is available in multiple package formats. The XCV300E-7FG256I uses the 256-pin FBGA package, which is the smallest footprint available for this device.

The I suffix in XCV300E-7FG256I indicates the Industrial temperature grade (–40°C to +100°C junction temperature), distinguishing it from the commercial C suffix variants rated for 0°C to +85°C.

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Speed Grade Comparison for XCV300E FG256 Package

The -7 speed grade is the highest-performance option available for the XCV300E in the FG256 package.

The -7 suffix in XCV300E-7FG256I therefore represents the best timing performance available for this device/package combination.

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XCV300E-7FG256I Applications

The XCV300E-7FG256I is suitable for a wide range of applications where programmable logic, on-chip memory, and multi-standard I/O are required together in a single device.

Communications and Networking

The device’s high gate count and differential I/O support make it well suited for line cards, protocol bridges, and packet processing engines. Its PCI 33/66 MHz compliant I/O enables direct connection to legacy PCI buses without external glue logic.

Digital Signal Processing (DSP)

With 98,304 bits of distributed RAM and 131,072 bits of block RAM, the XCV300E-7FG256I can implement FIR filters, FFT pipelines, and correlators directly in programmable fabric. The DLL-based clock management supports the tight synchronization required by high-throughput DSP chains.

Industrial and Defense Systems

The industrial temperature grade (–40°C to +100°C Tj) makes the XCV300E-7FG256I appropriate for outdoor, automotive-adjacent, and military-grade systems. The device can operate reliably across the full industrial temperature range without derating.

Embedded Control and Co-Processing

The CLB array supports soft processor implementations such as PicoBlaze, enabling embedded control logic alongside custom hardware accelerators — all within the same programmable fabric.

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Design Tools and Development Support

The XCV300E-7FG256I is supported by Xilinx’s legacy ISE Design Suite, which provides:

• Synthesis and implementation tools (XST, Map, PAR)
• Timing analysis and constraint management
• FPGA Editor for post-route inspection
• iMPACT for configuration and programming

Note that Xilinx’s current Vivado Design Suite does not support Virtex-E devices, as Vivado is targeted at newer 7-Series and UltraScale architectures. For XCV300E-7FG256I design work, ISE 14.x (the final ISE release) is the recommended toolchain.

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Ordering Information and Product Status

Important Note: The XCV300E-7FG256I has been designated Obsolete by AMD/Xilinx and is not recommended for new designs. For new projects requiring similar logic density and I/O, consider migrating to a Spartan-7 or Artix-7 device, which offer improved performance, lower power, and active production status.