Overview of XCV1600E-7FG860C Field Programmable Gate Array
The XCV1600E-7FG860C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Virtex-E family, designed to deliver exceptional performance for complex digital system designs. This commercial-grade FPGA combines high logic density, extensive I/O capabilities, and robust memory resources in a compact 860-ball fine-pitch BGA package, making it an ideal choice for telecommunications, industrial control, digital signal processing, and embedded systems applications.
As part of the industry-leading Xilinx FPGA portfolio, the XCV1600E-7FG860C offers designers the flexibility and performance needed for demanding applications while maintaining cost-effectiveness and reliability.
Key Features and Benefits of XCV1600E-7FG860C
Advanced Logic Architecture
The XCV1600E-7FG860C integrates cutting-edge programmable logic technology with remarkable capacity and flexibility:
- 34,992 Logic Elements provide extensive resources for complex algorithm implementation
- 7,776 Configurable Logic Blocks (CLBs) enable efficient design partitioning
- 15,552 Adaptive Logic Modules (ALMs) deliver optimal logic utilization
- 2,188,742 equivalent gates support large-scale system integration
- Speed Grade -7 ensures reliable performance up to 250 MHz maximum operating frequency
Comprehensive Memory Resources
Memory architecture is critical for high-performance FPGA applications, and the XCV1600E-7FG860C excels with:
- 589,824 bits Total RAM for data storage and buffering
- 497,664 bits Distributed RAM embedded within logic fabric
- 576 kbit Embedded Block RAM for efficient memory implementation
- Flexible memory configuration supporting various data widths and depths
Robust I/O Capabilities
With 660 user I/O pins, the XCV1600E-7FG860C provides extensive connectivity options for interfacing with external devices, supporting multiple I/O standards and voltage levels to accommodate diverse system requirements.
Technical Specifications Table
Electrical Characteristics
| Specification |
Value |
Description |
| Supply Voltage |
1.8V |
Core voltage (1.71V – 1.89V range) |
| Operating Temperature Range |
0°C to +85°C |
Commercial temperature grade |
| Speed Grade |
-7 |
Performance tier indicator |
| Maximum Operating Frequency |
250 MHz |
System clock frequency |
| Power Consumption |
Optimized |
Low-power CMOS technology |
Logic and Memory Resources
| Resource Type |
Quantity |
Application |
| Logic Elements |
34,992 LE |
Combinatorial and sequential logic |
| Configurable Logic Blocks |
7,776 CLBs |
Fundamental building blocks |
| Adaptive Logic Modules |
15,552 ALMs |
Enhanced logic efficiency |
| Total Gates |
2,188,742 |
Equivalent gate count |
| Embedded Memory |
576 kbit |
On-chip data storage |
| Distributed RAM |
497,664 bits |
Logic-embedded memory |
| Block RAM |
589,824 bits |
Dedicated memory blocks |
Package and Physical Specifications
| Specification |
Details |
| Package Type |
860-FBGA (Fine-pitch Ball Grid Array) |
| Package Dimensions |
42.5mm × 42.5mm |
| Ball Count |
860 balls |
| User I/O Count |
660 I/O |
| Mounting Style |
Surface Mount Technology (SMD/SMT) |
| Package Form |
Exposed Pad BGA |
| Shipping Method |
Tray packaging |
XCV1600E-7FG860C Application Areas
Telecommunications and Networking
The XCV1600E-7FG860C excels in high-speed communication systems:
- Protocol processing and packet switching
- Software-defined radio (SDR) implementations
- Baseband signal processing
- Network interface controllers
- Telecommunication infrastructure equipment
Industrial Control and Automation
Robust performance makes this FPGA ideal for industrial applications:
- Programmable logic controllers (PLCs)
- Motion control systems
- Machine vision processing
- Industrial IoT edge computing
- Real-time monitoring systems
Digital Signal Processing (DSP)
High-speed logic and extensive memory support demanding DSP tasks:
- Video and image processing
- Audio signal processing
- Radar and sonar systems
- Software-defined instruments
- Digital filtering applications
Embedded Systems Design
The XCV1600E-7FG860C serves as the heart of complex embedded solutions:
- Custom computing accelerators
- Hardware security modules
- Automotive electronics
- Aerospace and defense systems
- Medical imaging equipment
Design Advantages and Implementation Benefits
Flexibility and Reconfigurability
Unlike fixed-function ASICs, the XCV1600E-7FG860C offers field-programmable flexibility, allowing design modifications and updates even after deployment. This capability significantly reduces time-to-market and development costs while enabling iterative design improvements.
High Performance Architecture
The Virtex-E architecture provides dedicated routing resources and optimized logic structures that deliver:
- Low propagation delays
- High-speed clock distribution
- Efficient resource utilization
- Predictable timing characteristics
- Minimal power consumption per logic function
Comprehensive Development Tool Support
Designers benefit from AMD Xilinx’s industry-standard development tools:
- Vivado Design Suite compatibility (for newer tool versions)
- ISE Design Suite support (legacy tool chain)
- IP core libraries for rapid development
- Simulation and verification tools
- Timing analysis and optimization utilities
Quality and Reliability Standards
Manufacturing Excellence
The XCV1600E-7FG860C is manufactured using advanced semiconductor processes ensuring:
- Consistent electrical performance
- Long-term reliability
- RoHS compliance
- Industry-standard quality certifications
- Rigorous testing and validation
Temperature Grade Specifications
With a commercial temperature range (0°C to +85°C), this FPGA is suitable for:
- Standard industrial environments
- Commercial electronics applications
- Indoor installation locations
- Temperature-controlled enclosures
Comparison with Related Virtex-E Family Members
XCV1600E Variant Options
| Part Number |
Package |
I/O Count |
Speed Grade |
Temperature Range |
| XCV1600E-7FG860C |
860-FBGA |
660 |
-7 |
Commercial (0°C to 85°C) |
| XCV1600E-6FG860C |
860-FBGA |
660 |
-6 |
Commercial (0°C to 85°C) |
| XCV1600E-7FG1156C |
1156-FBGA |
724 |
-7 |
Commercial (0°C to 85°C) |
| XCV1600E-7FG680C |
680-FBGA |
512 |
-7 |
Commercial (0°C to 85°C) |
The -7 speed grade represents a balance between performance and cost, making the XCV1600E-7FG860C an excellent choice for applications requiring reliable 250 MHz operation.
PCB Design Considerations for XCV1600E-7FG860C
Package Layout Requirements
When designing PCBs for the 860-FBGA package:
- Ball Pitch: Fine-pitch BGA requires precise PCB fabrication
- Layer Count: Minimum 6-8 layers recommended for adequate signal routing
- Power Distribution: Dedicated power and ground planes essential
- Decoupling: Multiple decoupling capacitors near power balls
- Thermal Management: Consider heat dissipation in high-utilization designs
Signal Integrity Guidelines
Ensure optimal performance with proper PCB design:
- Controlled impedance routing for high-speed signals
- Differential pair routing for critical interfaces
- Ground plane continuity
- Via placement optimization
- EMI/EMC considerations
Programming and Configuration Options
Configuration Methods
The XCV1600E-7FG860C supports multiple configuration interfaces:
- JTAG boundary scan
- SelectMAP parallel configuration
- Serial configuration modes
- Microprocessor-based configuration
- Flash memory-based boot
Development Workflow
Typical design flow includes:
- HDL design entry (VHDL/Verilog)
- Synthesis and optimization
- Place and route
- Timing analysis and verification
- Bitstream generation
- Device programming
- In-system testing and validation
Supply Chain and Availability
Sourcing Recommendations
The XCV1600E-7FG860C is available through:
- Authorized AMD Xilinx distributors
- Established electronic component suppliers
- Specialized FPGA vendors
- Certified resellers with genuine components
Authentication and Quality Assurance
When procuring the XCV1600E-7FG860C:
- Verify authentic AMD/Xilinx branding
- Request component traceability documentation
- Confirm proper ESD packaging
- Validate date codes and lot numbers
- Source from reputable suppliers only
Environmental and Compliance Standards
Regulatory Compliance
The XCV1600E-7FG860C meets international standards:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation conformity
- Conflict minerals compliance
- Standard electronic component handling procedures
Moisture Sensitivity Level
Proper storage and handling per:
- MSL (Moisture Sensitivity Level) classification
- Baking requirements before reflow
- ESD protection during handling
- Storage in dry, controlled environments
Migration Path and Legacy Support
Technology Evolution
While the Virtex-E family represents mature FPGA technology, it continues to serve applications where:
- Proven reliability is paramount
- Legacy system maintenance required
- Cost-effective solutions needed
- Design heritage must be maintained
Modern Alternatives
For new designs, consider evaluating:
- AMD Xilinx 7 Series FPGAs (Artix-7, Kintex-7, Virtex-7)
- UltraScale and UltraScale+ architectures
- Cost-optimized Spartan families
- Application-specific FPGA variants
Frequently Asked Questions About XCV1600E-7FG860C
What is the difference between speed grades?
Speed grades (-6, -7, -8) indicate performance tiers, with higher numbers representing faster timing characteristics and increased maximum operating frequencies. The -7 grade offers excellent performance for most applications.
Can XCV1600E-7FG860C be used in automotive applications?
The commercial temperature grade (0°C to 85°C) limits automotive applications to passenger compartment electronics. For engine bay or extreme environment automotive use, industrial or extended temperature variants are recommended.
What development tools are required?
The XCV1600E-7FG860C is supported by Xilinx ISE Design Suite (legacy) and may have limited support in newer Vivado versions. Download appropriate tools from AMD Xilinx official sources.
How does XCV1600E-7FG860C compare to modern FPGAs?
While featuring older architecture, the Virtex-E family offers proven reliability, established design flows, and cost advantages for applications not requiring cutting-edge performance or ultra-low power consumption.
What is the expected lifespan?
With proper operating conditions and thermal management, the XCV1600E-7FG860C can operate reliably for 10-20+ years, making it suitable for long-lifecycle industrial and infrastructure applications.
Conclusion: Why Choose XCV1600E-7FG860C
The XCV1600E-7FG860C represents a mature, reliable FPGA solution combining substantial logic resources, comprehensive memory architecture, and extensive I/O capabilities in a professionally-packaged 860-FBGA form factor. Its commercial temperature rating, proven Virtex-E architecture, and 250 MHz performance make it an excellent choice for telecommunications, industrial control, signal processing, and embedded system applications where reliability and cost-effectiveness are priorities.
For designers seeking a well-established FPGA with extensive community support, comprehensive documentation, and proven track record in deployed systems, the XCV1600E-7FG860C delivers exceptional value while maintaining the flexibility and reconfigurability that make FPGAs essential components in modern electronic design.
