Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG982C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

Overview of XC2S200-6FGG982C FPGA

The XC2S200-6FGG982C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This high-performance programmable logic device delivers exceptional flexibility and processing capabilities with 200,000 system gates, making it an ideal solution for complex digital designs, embedded systems, and industrial applications. The XC2S200-6FGG982C combines cost-effectiveness with robust performance, offering engineers and developers a superior alternative to traditional ASICs.

Key Specifications of XC2S200-6FGG982C

Technical Specifications Table

Specification Value
Device Family Spartan-II
Part Number XC2S200-6FGG982C
System Gates 200,000
Logic Cells 5,292
Configurable Logic Blocks (CLBs) 1,176 (28 x 42 array)
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
Maximum User I/O 284 pins
Speed Grade -6 (highest performance)
Operating Voltage 2.5V core voltage
Technology Node 0.18µm CMOS process
Package Type FGG982 (982-ball Fine-Pitch BGA)
Temperature Range Commercial (0°C to +85°C)

XC2S200-6FGG982C Architecture and Features

Configurable Logic Block Architecture

The XC2S200-6FGG982C features a regular, flexible architecture centered around Configurable Logic Blocks (CLBs). With a 28 x 42 CLB array providing 1,176 total CLBs, this FPGA delivers extensive logic resources for implementing complex digital functions. Each CLB contains multiple logic slices with look-up tables (LUTs), flip-flops, and multiplexers, enabling efficient implementation of combinational and sequential logic.

Memory Resources

Memory Type Capacity Key Features
Block RAM 56,000 bits Dual-port structure, configurable width
Distributed RAM 75,264 bits Integrated within CLBs for fast local storage
Total Memory 131,264 bits Flexible memory configuration options

Input/Output Capabilities

The XC2S200-6FGG982C provides up to 284 user I/O pins through its FGG982 package, supporting a wide range of digital interfacing requirements. The programmable I/O blocks (IOBs) surround the CLB array in a perimeter configuration, offering:

  • Multiple I/O standards support (LVTTL, LVCMOS, SSTL, HSTL, GTL)
  • Programmable drive strength and slew rate control
  • Individual I/O configuration for maximum flexibility
  • Differential signaling capabilities
  • Built-in termination options

Performance Characteristics of Spartan-II XC2S200-6FGG982C

Speed Grade and Timing

The -6 speed grade represents the highest performance tier available for commercial temperature range Spartan-II devices. This designation ensures:

  • Maximum operating frequency up to 263 MHz for system-level designs
  • Optimized signal propagation delays
  • Superior timing performance for high-speed applications
  • Reduced setup and hold times for critical path optimization

Processing Technology

Built on advanced 0.18µm CMOS technology, the XC2S200-6FGG982C delivers:

  • Low power consumption for energy-efficient designs
  • High integration density
  • Improved signal integrity
  • Enhanced reliability and durability

XC2S200-6FGG982C Applications

Industrial Control and Automation

The XC2S200-6FGG982C excels in industrial environments where programmability and reliability are critical:

  • Motor control systems
  • Process automation controllers
  • Industrial robotics interface
  • Machine vision processing
  • Sensor data acquisition systems

Communication Systems

With its high-speed capabilities and extensive I/O resources, this FPGA is ideal for:

  • Network routing and switching
  • Protocol conversion and implementation
  • Data encryption and security processing
  • Telecommunications infrastructure
  • Wireless communication interfaces

Digital Signal Processing

Application Area Implementation Benefits
Audio Processing Real-time filtering and effects processing
Image Processing Video format conversion, enhancement algorithms
Software-Defined Radio Modulation/demodulation, frequency synthesis
Measurement Instruments High-speed data acquisition and analysis

Embedded System Development

The XC2S200-6FGG982C serves as an excellent coprocessor or standalone controller for:

  • Custom peripheral interfaces
  • System-on-Chip (SoC) prototyping
  • Hardware acceleration for specific algorithms
  • ASIC emulation and verification
  • Rapid prototyping platforms

Advantages of XC2S200-6FGG982C Over ASICs

Cost-Effectiveness

Unlike traditional Application-Specific Integrated Circuits (ASICs), the XC2S200-6FGG982C eliminates:

  • High initial NRE (Non-Recurring Engineering) costs
  • Expensive mask sets and fabrication runs
  • Long lead times for production
  • Financial risk of design errors

Design Flexibility and Upgradability

The programmable nature of the XC2S200-6FGG982C provides unique advantages:

  • In-field reprogrammability: Update designs without hardware replacement
  • Iterative development: Rapid design modifications and testing
  • Version control: Deploy different configurations for varying applications
  • Future-proofing: Adapt to changing requirements and standards

Time-to-Market Benefits

Development Phase FPGA Advantage
Initial Design Immediate implementation without fabrication wait
Prototyping Hardware testing with actual silicon
Debug and Verification Real-time design modifications
Production Flexible volume manufacturing
Updates Remote or on-site reconfiguration capability

XC2S200-6FGG982C Package Information

FGG982 Package Details

The FGG982 package is a Fine-Pitch Ball Grid Array offering:

  • 982-ball configuration for maximum I/O density
  • Compact footprint for space-constrained applications
  • Excellent thermal performance characteristics
  • Industry-standard BGA mounting compatibility
  • Lead-free (RoHS compliant) option available with “G” designation

Thermal and Power Considerations

Effective thermal management is crucial for optimal XC2S200-6FGG982C performance:

  • Core voltage: 2.5V (VCCINT)
  • I/O voltage: Configurable per bank (VCCO)
  • Auxiliary voltage: 2.5V (VCCAUX)
  • Power estimation tools available through Xilinx design software
  • Thermal resistance specifications for package thermal analysis

Design Tools and Development Support

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG982C is fully supported by Xilinx ISE (Integrated Software Environment):

  • Comprehensive design entry (schematic, HDL, IP cores)
  • Advanced synthesis and implementation tools
  • Timing analysis and optimization
  • BitStream generation and configuration management
  • In-system debugging capabilities

Programming and Configuration

Multiple configuration methods are supported:

  • JTAG programming interface for development
  • Serial and parallel configuration modes
  • Master and slave configuration options
  • Configuration PROM support
  • Boundary-scan testing (IEEE 1149.1 compliant)

Comparing XC2S200-6FGG982C with Alternative Xilinx FPGA Solutions

Spartan-II Family Comparison

Device System Gates Logic Cells Block RAM Max User I/O
XC2S50 50,000 1,728 32K bits 176
XC2S100 100,000 2,700 40K bits 176
XC2S200 200,000 5,292 56K bits 284
XC2S150 150,000 3,888 48K bits 260

The XC2S200-6FGG982C represents the optimal balance between resources and cost within the mid-range Spartan-II family, offering substantial logic capacity and memory resources for demanding applications.

Migration Paths and Alternatives

For different project requirements, consider these alternatives:

For higher capacity needs:

  • XC2S300E/400E/600E (Spartan-IIE family with enhanced features)
  • Spartan-3 family for newer architecture and lower voltage operation

For lower cost/smaller designs:

  • XC2S50/100 for simpler applications with reduced resource requirements
  • Spartan-3A/3E for cost-optimized modern implementations

Quality and Reliability Features

Commercial Temperature Range

The “C” designation indicates commercial temperature range operation (0°C to +85°C), suitable for:

  • Indoor industrial equipment
  • Commercial electronics
  • Consumer products
  • Office and laboratory instrumentation

Manufacturing Quality Standards

AMD Xilinx maintains stringent quality standards:

  • ISO 9001 certified manufacturing processes
  • Comprehensive testing and screening
  • Long-term reliability verification
  • Automotive and industrial grade options available (contact for specifications)

Procurement and Availability

Ordering Information

When ordering the XC2S200-6FGG982C, ensure the complete part number is specified:

  • XC2S200: Device type (200K system gates)
  • -6: Speed grade (highest performance)
  • FGG982: Package type (982-ball Fine-Pitch BGA)
  • C: Commercial temperature range

For lead-free RoHS compliant packages, specify XC2S200-6FGGG982C (note the extra “G”).

Supply Chain Considerations

Consideration Recommendation
Lead Time Verify current availability with authorized distributors
Minimum Order Quantity May vary by distributor; bulk pricing available
Package Options Confirm FGG982 package availability
Documentation Request latest datasheet and errata information

Frequently Asked Questions About XC2S200-6FGG982C

What is the main difference between speed grades?

The -6 speed grade offers the fastest timing performance among Spartan-II commercial temperature devices, with lower propagation delays and higher maximum frequencies compared to -5 or -4 speed grades. This enables more aggressive timing constraints and higher system performance.

Can the XC2S200-6FGG982C be reprogrammed?

Yes, the XC2S200-6FGG982C uses SRAM-based configuration technology, allowing unlimited reprogramming cycles. Configuration data can be loaded from external memory (PROM, Flash) or through JTAG interface for development and field updates.

What development tools are required?

Xilinx ISE WebPACK (free version) or ISE Foundation/Advanced editions support the XC2S200-6FGG982C. Additional third-party synthesis tools (Synplify, Precision) are compatible. A JTAG programming cable (Platform Cable USB or compatible) is needed for device configuration.

Is the XC2S200-6FGG982C suitable for new designs?

While the Spartan-II family is considered mature technology, the XC2S200 remains viable for:

  • Cost-sensitive applications with proven designs
  • Replacements and legacy system maintenance
  • Educational and prototyping purposes
  • Applications where newer devices offer no significant advantage

For new high-volume production designs, consider newer Spartan-7 or Artix-7 families for improved features, lower power, and long-term availability.

What support resources are available?

AMD Xilinx provides comprehensive documentation:

  • Complete datasheet (DS001) with electrical specifications
  • User guides for CLB, IOB, and Block RAM architecture
  • Application notes for design best practices
  • Reference designs and IP cores
  • Active technical support through AMD support portal

Conclusion: Why Choose XC2S200-6FGG982C

The XC2S200-6FGG982C represents a proven, reliable FPGA solution for engineers and developers requiring substantial logic resources, flexible I/O capabilities, and high-performance operation. With 200,000 system gates, 5,292 logic cells, and comprehensive memory resources, this Spartan-II device delivers exceptional value for:

  • Industrial control applications demanding reliability and reconfigurability
  • Communication systems requiring high-speed data processing
  • Digital signal processing implementations with real-time constraints
  • Embedded system development needing custom peripheral interfaces

The combination of cost-effectiveness, design flexibility, and mature development tool support makes the XC2S200-6FGG982C an excellent choice for projects where proven technology, availability, and FPGA programmability advantages align with project requirements.

Whether you’re developing new products, maintaining existing designs, or prototyping innovative solutions, the XC2S200-6FGG982C provides the resources and performance needed to bring your digital designs to life. Its superiority over traditional ASIC approaches—eliminating high initial costs, lengthy development cycles, and design risk—combined with field-upgradability, positions this FPGA as a smart choice for modern digital system implementation.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.