Complete Guide to AMD Xilinx XCV50E-6FGG256C Field Programmable Gate Array

The XCV50E-6FGG256C represents a powerful solution in AMD Xilinx’s acclaimed Virtex-E family of Field Programmable Gate Arrays (FPGAs). This advanced programmable logic device delivers exceptional performance for complex digital signal processing, embedded systems, and industrial control applications. Whether you’re maintaining legacy systems or developing custom logic circuits, this FPGA offers the reliability and flexibility modern engineers demand.

Product Overview: XCV50E-6FGG256C Specifications

The XCV50E-6FGG256C combines high-speed processing capabilities with programmable flexibility, making it an ideal choice for demanding applications across telecommunications, aerospace, medical imaging, and industrial automation sectors.

Key Technical Specifications

Architecture and Performance Features

Advanced FPGA Architecture

The XCV50E-6FGG256C leverages Xilinx’s optimized Virtex-E architecture, featuring:

• 20,736K equivalent logic gates for complex digital designs
• Six-layer metal interconnect utilizing advanced 0.18 μm CMOS process
• Configurable Logic Blocks (CLBs) arranged in efficient 16×24 array
• Embedded RAM blocks for high-speed data buffering
• Dedicated routing resources optimized for place-and-route efficiency

High-Speed Digital Signal Processing

Application Areas and Use Cases

Industrial and Commercial Applications

The Xilinx FPGA XCV50E-6FGG256C excels in numerous demanding environments:

1. Telecommunications Infrastructure
   • Base station signal processing
   • Protocol conversion and routing
   • Software-defined radio (SDR) systems
   • High-speed data filtering and encoding
2. Medical Imaging Systems
   • MRI and CT scan image processing
   • Real-time algorithm execution
   • High-speed data acquisition
   • Diagnostic equipment control
3. Aerospace and Defense
   • Navigation system controllers
   • Satellite communication modules
   • Radar signal processing
   • Mission-critical embedded systems
4. Industrial Automation
   • Motion control systems
   • Process monitoring and control
   • Machine vision applications
   • Programmable logic controllers (PLC)

Programming and Development

Design Tools and Software

Development Workflow

1. Design Entry: Create schematics or write HDL code (VHDL/Verilog)
2. Functional Simulation: Verify logic behavior before synthesis
3. Synthesis: Convert HDL to gate-level netlist
4. Implementation: Place-and-route optimization
5. Timing Analysis: Validate performance against specifications
6. Configuration: Program FPGA via JTAG or SelectMAP interface

Package and Pin Configuration

256-Pin FBGA Package Details

Electrical Characteristics

Power and Performance

I/O Standards Compatibility

The XCV50E-6FGG256C supports multiple industry-standard I/O interfaces:

• LVDS (Low Voltage Differential Signaling)
• BLVDS (Bus LVDS)
• LVPECL (Low Voltage Positive Emitter-Coupled Logic)
• SSTL (Stub Series Terminated Logic)
• GTL/GTL+ (Gunning Transceiver Logic)
• LVCMOS (Low Voltage CMOS)
• LVTTL (Low Voltage TTL)

Legacy System Support and Availability

Replacement and Maintenance Solutions

While the XCV50E-6FGG256C is classified as “not recommended for new designs,” it remains valuable for:

• Legacy system maintenance and repairs
• Direct replacement in existing Virtex-E designs
• System upgrades without hardware redesign
• Spare parts inventory for critical applications

Alternative and Compatible Models

Quality and Reliability

Manufacturing Standards

• Original AMD Xilinx manufacture: Authentic silicon from authorized facilities
• Quality assurance: Comprehensive testing and validation
• Traceability: Full component tracking and documentation
• RoHS compliance: Environmentally friendly manufacturing
• Anti-static packaging: ESD-safe shipping and storage

Testing and Validation

Each XCV50E-6FGG256C undergoes rigorous quality control:

1. Functional testing at specified operating conditions
2. Timing verification across commercial temperature range
3. Power consumption validation
4. I/O standards compliance testing
5. Package integrity inspection

Procurement and Availability

Ordering Information

Full Part Number: XCV50E-6FGG256C

Package Marking:

• Manufacturer: AMD/Xilinx logo
• Part number: XCV50E-6FGG256C
• Date code: Manufacturing week/year
• Lot traceability code

Stock and Lead Time

The XCV50E-6FGG256C is available through authorized distributors and specialty FPGA suppliers. Typical availability includes:

• New original stock: Factory-sealed components
• Lead time: 2-12 weeks depending on quantity
• Minimum order: Varies by distributor
• Volume pricing: Available for bulk orders

Technical Support and Resources

Documentation and Design Files

Design Assistance

Technical support available for:

• Pin assignment and I/O planning
• Power supply design and decoupling
• Clock distribution and management
• Signal integrity considerations
• Thermal management solutions

Frequently Asked Questions

What is the difference between XCV50E-6FGG256C and XCV50E-6FG256I?

The primary distinction is temperature range: the “C” suffix denotes commercial temperature operation (0°C to +85°C), while the “I” suffix indicates industrial temperature range (-40°C to +100°C). Both share identical logic resources and electrical specifications.

Can I use modern Vivado tools with XCV50E-6FGG256C?

No, Virtex-E FPGAs require Xilinx ISE Design Suite for development. Vivado supports only 7-series and newer FPGA families. ISE 14.7 is the final version supporting legacy Virtex-E devices.

What configuration modes does XCV50E-6FGG256C support?

The device supports multiple configuration modes including:

• Master Serial mode
• Slave Serial mode
• Master SelectMAP (parallel)
• Slave SelectMAP (parallel)
• JTAG boundary-scan

Is the XCV50E-6FGG256C suitable for new product designs?

AMD Xilinx has designated this device as “not recommended for new designs.” For new projects, consider modern FPGA families like Artix-7, Spartan-7, or Zynq-7000 series that offer superior performance, lower power consumption, and ongoing manufacturer support.

What is the typical power consumption?

Power consumption varies significantly based on design utilization, clock frequency, and I/O activity. Static power is minimal (typically <100mW), while dynamic power can range from hundreds of milliwatts to several watts depending on application complexity and switching activity.

Competitive Advantages

Why Choose XCV50E-6FGG256C?

1. Proven reliability: Decades of field deployment in critical systems
2. Cost-effective: Competitive pricing for legacy replacements
3. Wide availability: Multiple distribution channels
4. Extensive ecosystem: Mature design tools and IP cores
5. Drop-in compatibility: Direct replacement for existing Virtex-E designs
6. Technical heritage: Based on industry-proven FPGA architecture

Conclusion: Reliable FPGA Solution for Critical Applications

The XCV50E-6FGG256C continues to serve as a reliable programmable logic solution for maintaining and upgrading existing systems. While newer FPGA families offer enhanced features and performance, this Virtex-E device provides the stability and compatibility essential for legacy system support.

With 1,728 logic cells, 357 MHz maximum frequency, and comprehensive I/O standard support, the XCV50E-6FGG256C delivers the performance needed for telecommunications, industrial automation, medical equipment, and aerospace applications. Its fine-pitch ball grid array package ensures compact PCB footprint while maintaining robust electrical performance.

For engineers requiring authentic AMD Xilinx components with guaranteed quality and traceability, the XCV50E-6FGG256C remains available through authorized distributors specializing in legacy FPGA devices. Whether for system maintenance, spare parts inventory, or specialized applications requiring Virtex-E architecture, this FPGA provides a dependable programmable logic solution.