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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV600E-6FG680C: High-Performance Virtex-E FPGA for Advanced Digital Design

Product Details

Overview of XCV600E-6FG680C Field Programmable Gate Array

The XCV600E-6FG680C is a powerful Virtex-E series Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx), designed to deliver exceptional performance for complex digital logic applications. This advanced FPGA combines high-capacity programmable logic with superior flexibility, making it an ideal choice for telecommunications, industrial automation, digital signal processing, and embedded systems development.

Product Specifications and Technical Details

Core Technical Parameters

Specification Value
Part Number XCV600E-6FG680C
Manufacturer AMD (Xilinx)
Product Family Virtex-E
Package Type 680-LBGA (Low-profile Ball Grid Array) with Exposed Pad
I/O Count 512 User I/O Pins
Logic Cells 15,552 Logic Cells
RAM Bits 294,912 bits (36 kB)
Configurable Logic Blocks (CLBs) 3,456 CLBs
System Gates 186,624 Gates
Maximum Frequency 357 MHz
Process Technology 0.22 μm 5-Layer Metal CMOS
Operating Temperature Industrial Grade
RoHS Status Non-compliant

Package and Pin Configuration

Package Detail Specification
Package Type Fine-Pitch Ball Grid Array (FBGA)
Total Pins 680 pins
Mounting Style Surface Mount Technology (SMT)
Thermal Management Exposed pad for enhanced heat dissipation
Pitch Fine-pitch for high-density applications

Key Features and Benefits of XCV600E-6FG680C FPGA

Advanced Architecture Capabilities

  • High Logic Density: With 15,552 logic cells and 3,456 CLBs, the XCV600E-6FG680C provides extensive resources for implementing complex digital designs
  • Substantial Memory Resources: 294,912 RAM bits offer ample embedded memory for data buffering and storage applications
  • Fast Performance: Operating frequency up to 357 MHz enables high-speed signal processing and real-time applications
  • Flexible I/O Configuration: 512 user I/O pins support diverse interface requirements and connectivity options

Manufacturing Excellence

The XCV600E-6FG680C utilizes AMD’s optimized 0.22 μm CMOS process technology with 5-layer metal interconnect, delivering:

  • Enhanced signal integrity
  • Reduced power consumption
  • Improved place-and-route efficiency
  • Superior silicon efficiency

Applications and Use Cases for XCV600E-6FG680C

Primary Application Domains

Industry Typical Applications
Telecommunications Network routers, base station controllers, protocol converters
Industrial Control Automated control systems, motor controllers, PLC interfaces
Medical Devices Medical imaging equipment, diagnostic systems, patient monitoring
Automotive Electronics Advanced driver assistance systems (ADAS), vehicle networking
Digital Signal Processing Audio/video processing, software-defined radio, data encryption
Networking Equipment Switches, bridges, packet processors, traffic management

Secondary Applications

  • Data encryption and decryption systems
  • High-speed data acquisition systems
  • Custom computing accelerators
  • Prototyping and development platforms
  • Legacy system upgrades and replacements

Technical Advantages of Virtex-E Architecture

Design Flexibility and Reusability

The XCV600E-6FG680C FPGA offers exceptional design flexibility through its programmable architecture:

  • Reconfigurable Logic: Adapt functionality post-deployment without hardware changes
  • Design Reuse: Leverage existing IP cores and design modules
  • Rapid Prototyping: Accelerate time-to-market with fast iteration cycles
  • Scalability: Easy migration within the Virtex-E family for future upgrades

Performance Optimization Features

  • Optimized Routing Architecture: Enhanced interconnect structure for efficient signal routing
  • Distributed RAM: Integrated RAM blocks strategically placed throughout the fabric
  • Dedicated Carry Logic: Fast arithmetic operations and counter implementations
  • Clock Management: Multiple clock domains with advanced distribution networks

XCV600E-6FG680C vs. Alternative FPGA Solutions

Competitive Advantages

Feature XCV600E-6FG680C Standard Mid-Range FPGAs
Logic Cells 15,552 8,000 – 12,000
I/O Pins 512 256 – 384
Operating Frequency Up to 357 MHz 200 – 300 MHz
Embedded RAM 294,912 bits 100,000 – 200,000 bits
Package Options 680-pin FBGA Smaller pin counts

Design Considerations and Best Practices

Implementation Guidelines

When working with the XCV600E-6FG680C, engineers should consider:

  1. Power Supply Design: Ensure stable, low-noise power delivery with appropriate decoupling
  2. Thermal Management: Utilize the exposed pad for effective heat transfer; design adequate cooling solutions
  3. Signal Integrity: Follow proper PCB layout practices for high-speed signals
  4. Configuration: Plan for FPGA configuration method (JTAG, serial, parallel)
  5. I/O Standards: Select appropriate I/O voltage standards for interfacing requirements

Critical Operating Parameters

Parameter Specification Notes
Supply Voltage Multiple rails Refer to datasheet for specific voltages
Operating Temperature Industrial range Specify during ordering
Power Consumption Design-dependent Use power estimation tools
Configuration Time Milliseconds Varies by configuration method

Xilinx FPGA Development and Programming

For those working with the XCV600E-6FG680C and other Xilinx FPGA devices, AMD provides comprehensive development tools and support:

  • Vivado Design Suite: Industry-leading FPGA design software
  • IP Core Libraries: Pre-verified functional blocks to accelerate development
  • Simulation Tools: Verify designs before hardware implementation
  • Programming Utilities: Flash configuration and debugging tools

Procurement and Availability Information

Current Market Status

Status Details
Lifecycle Obsolete (last updated 10 months ago)
Availability Available through authorized distributors
Lead Time Variable; check with suppliers
Alternative Sources Multiple authorized distributors worldwide

Quality and Authenticity

When purchasing the XCV600E-6FG680C, ensure:

  • Products sourced from authorized AMD/Xilinx distributors
  • Proper handling and storage conditions maintained
  • Original packaging and documentation included
  • Traceability for quality assurance

Storage and Handling Requirements

Proper Component Management

  • Storage Conditions: Keep in anti-static, moisture-controlled environment
  • ESD Protection: Use proper electrostatic discharge protection during handling
  • Temperature Range: Store within manufacturer-specified temperature limits
  • Humidity Control: Maintain appropriate humidity levels to prevent moisture damage
  • Shelf Life: Follow JEDEC moisture sensitivity level (MSL) guidelines

Support and Technical Resources

Documentation and Resources

  • Datasheet: Complete electrical and mechanical specifications
  • User Guides: Detailed implementation and design guidelines
  • Application Notes: Specific use-case implementations
  • Reference Designs: Example projects and starting templates
  • Technical Support: Access to AMD/Xilinx engineering support

Frequently Asked Questions About XCV600E-6FG680C

Common Technical Queries

Q: What development tools are compatible with XCV600E-6FG680C? A: The XCV600E-6FG680C is supported by Xilinx ISE Design Suite and can be programmed using various Xilinx tools and third-party solutions.

Q: Can I upgrade from older Virtex FPGAs to XCV600E-6FG680C? A: Migration is possible, but requires design review and potential pin mapping adjustments due to architectural differences.

Q: What are the power requirements for XCV600E-6FG680C? A: Multiple voltage rails are required; consult the detailed datasheet for specific voltage and current requirements.

Q: Is XCV600E-6FG680C suitable for harsh environment applications? A: The device is available in industrial temperature grades, but specific environmental requirements should be evaluated against the datasheet specifications.

Q: What configuration methods are supported? A: The XCV600E-6FG680C supports multiple configuration modes including JTAG, serial configuration, and parallel configuration interfaces.

Conclusion: Why Choose XCV600E-6FG680C for Your Design

The XCV600E-6FG680C represents a proven solution for high-performance programmable logic applications. With its robust architecture, extensive I/O capabilities, and substantial logic resources, this Virtex-E FPGA continues to serve critical applications across multiple industries. Whether you’re developing telecommunications equipment, industrial control systems, or advanced signal processing platforms, the XCV600E-6FG680C provides the performance, flexibility, and reliability needed for demanding applications.

For designers seeking a balance between logic capacity, performance, and cost-effectiveness, the XCV600E-6FG680C offers a compelling solution backed by AMD/Xilinx’s reputation for quality and comprehensive development ecosystem support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.