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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XCV600E-6FG680I: High-Performance Virtex-E FPGA for Advanced Digital Applications

Product Details

Overview of XCV600E-6FG680I Field Programmable Gate Array

The XCV600E-6FG680I is a sophisticated Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family, designed to deliver exceptional programmable logic solutions for complex digital systems. This industrial-grade FPGA combines high-capacity logic resources with advanced processing capabilities, making it an ideal choice for telecommunications, industrial automation, medical equipment, and aerospace applications.

As part of the Virtex-E series, this FPGA represents a significant advancement in programmable logic technology, offering designers the flexibility and performance needed for demanding real-time applications. The XCV600E-6FG680I features a 680-pin Fine-Pitch Ball Grid Array (FBGA) package, providing robust connectivity and thermal performance in space-constrained environments.

Key Technical Specifications

Core Architecture Features

Specification Value
Logic Cells 15,552 cells
System Gates 186,624 gates
Configurable Logic Blocks (CLBs) 3,456 CLBs
Total RAM Bits 294,912 bits
Maximum Frequency 357 MHz
Process Technology 0.18 μm CMOS (6-layer metal)
Core Voltage 1.8V
Package Type 680-Pin FBGA (Fine-Pitch Ball Grid Array)
Operating Temperature Industrial Grade (-40°C to +100°C)

Performance Characteristics

Feature Description
Speed Grade -6 (357 MHz maximum performance)
I/O Standards Support 16+ high-performance interface standards
Clock Management 4 Delay-Locked Loops (DLLs)
Configuration SRAM-based in-system configuration
Package Dimensions Fine-pitch BGA with optimal thermal characteristics

Advanced Features and Capabilities

Programmable Logic Architecture

The XCV600E-6FG680I delivers exceptional silicon efficiency through its optimized architecture designed specifically for place-and-route efficiency. Each configurable logic block (CLB) contains dedicated resources for implementing complex digital functions, including:

  • Look-Up Tables (LUTs): High-speed combinational logic implementation
  • Dedicated Carry Logic: Accelerated arithmetic operations for DSP applications
  • Flexible Registers/Latches: Support for clock enable, synchronous/asynchronous set and reset
  • Fast Interconnect Resources: Hierarchical routing architecture for minimal signal delay

Memory Architecture

With nearly 295,000 RAM bits distributed throughout the device, this Xilinx FPGA provides ample embedded memory resources for:

  • Data buffering and FIFO implementations
  • Look-up table storage for complex algorithms
  • Local memory for processor cores
  • High-speed cache applications

Clock Management System

The four integrated Delay-Locked Loops (DLLs) provide:

  • Precise clock distribution and skew elimination
  • Clock multiplication and division capabilities
  • Phase-shifted clock generation
  • Low-jitter performance for high-speed interfaces

Application Areas

Telecommunications Infrastructure

Application Benefits
Base Station Processing High-speed signal processing with low latency
Network Routing Flexible protocol implementation and packet processing
SDR (Software Defined Radio) Reconfigurable RF front-end processing
5G/LTE Systems High-bandwidth data processing capabilities

Industrial Automation

The XCV600E-6FG680I excels in industrial control applications requiring:

  • Real-time motion control systems
  • Machine vision processing
  • PLC (Programmable Logic Controller) implementations
  • Industrial network protocols (PROFINET, EtherCAT)
  • Safety-critical control systems

Medical Equipment

  • Medical imaging processing (ultrasound, CT, MRI)
  • Real-time diagnostic equipment
  • Patient monitoring systems
  • Laboratory instrumentation
  • Surgical robotics control

Aerospace and Defense

  • Radar signal processing
  • Avionics systems
  • Satellite communication
  • Navigation systems
  • Secure communications

Package Information

FG680 Package Details

Parameter Specification
Package Type Fine-Pitch Ball Grid Array (FBGA)
Total Pins 680 pins
Form Factor Compact, space-efficient design
Thermal Performance Enhanced heat dissipation
Mounting Surface mount technology (SMT)
Lead-Free RoHS compliant

Design and Development Tools

Software Requirements

The XCV600E-6FG680I is supported by industry-standard Xilinx development tools:

  • ISE Design Suite: Legacy support for Virtex-E family
  • iMPACT: Device programming and configuration
  • ChipScope Pro: Real-time signal analysis and debugging
  • ModelSim/Xilinx Edition: HDL simulation environment

Programming Languages

  • VHDL: IEEE-standard hardware description language
  • Verilog: Industry-standard HDL
  • Schematic Entry: Visual design capture
  • IP Core Integration: Pre-verified functional blocks

Performance Advantages

Speed Grade Analysis

Speed Grade Max Frequency Typical Applications
-6 Grade 357 MHz High-speed digital processing, telecommunications
Performance Class Mid-to-high range Balanced performance and cost
Timing Margin Robust Reliable operation across temperature ranges

Power Efficiency

The 1.8V core voltage provides significant advantages:

  • Reduced power consumption compared to 2.5V devices
  • Lower heat generation for improved reliability
  • Extended battery life in portable applications
  • Improved power integrity for complex designs

Comparison with Related Models

Virtex-E Family Comparison

Model Logic Cells System Gates Package Speed Grade
XCV600E-6FG680I 15,552 186,624 680-FBGA -6 (Industrial)
XCV600E-6FG676I 15,552 186,624 676-FBGA -6 (Industrial)
XCV600E-7FG680C 15,552 186,624 680-FBGA -7 (Commercial)
XCV600E-6BG560I 15,552 186,624 560-BGA -6 (Industrial)

Quality and Reliability

Manufacturing Standards

  • Process Technology: Advanced 0.18 μm CMOS with 6-layer metal interconnect
  • Quality Assurance: Rigorous testing and validation procedures
  • Reliability Testing: Extended temperature cycling, thermal shock, and HTOL testing
  • Compliance: RoHS, REACH, and industry-specific certifications

Lifecycle Information

The XCV600E-6FG680I represents mature technology with:

  • Proven reliability in deployed systems
  • Extensive documentation and application notes
  • Strong technical support ecosystem
  • Available from authorized distributors with verified authenticity

Design Considerations

Power Supply Requirements

Supply Rail Voltage Purpose
VCCINT 1.8V Core logic power
VCCO Variable (1.5V-3.3V) I/O bank power (standard-dependent)
VCCAUX 2.5V or 3.3V Auxiliary circuits (DLLs, configuration)

Thermal Management

Proper thermal design is essential for optimal performance:

  • Heat sink recommendations based on power dissipation
  • Adequate airflow for convection cooling
  • Thermal vias in PCB design for heat spreading
  • Junction temperature monitoring for reliability

Ordering Information

Part Number Breakdown

XCV600E-6FG680I

  • XCV600E: Device family and density (Virtex-E, 600K equivalent gates)
  • -6: Speed grade (357 MHz maximum)
  • FG680: Package type (Fine-Pitch BGA, 680 pins)
  • I: Industrial temperature range (-40°C to +100°C)

Availability

The XCV600E-6FG680I is available through authorized Xilinx distributors worldwide. When sourcing this component, ensure verification of authenticity through:

  • Authorized distribution channels
  • Original factory packaging
  • Valid datecodes and country of origin markings
  • Proper anti-static handling and storage

Technical Support Resources

Documentation

  • Complete datasheet with electrical specifications
  • User guides for Virtex-E family
  • Application notes for specific design scenarios
  • Reference designs and example projects
  • Packaging and PCB layout guidelines

Development Support

  • Online technical forums and communities
  • Application engineering assistance
  • Design consulting services
  • Training materials and webinars
  • IP core libraries and reference designs

Conclusion

The XCV600E-6FG680I stands as a robust, high-performance FPGA solution for applications demanding reliable programmable logic with industrial-grade specifications. Its combination of 15,552 logic cells, 357 MHz performance, and comprehensive I/O support makes it suitable for diverse applications ranging from telecommunications infrastructure to medical devices and industrial control systems.

With its proven 0.18 μm CMOS technology, extensive memory resources, and flexible architecture, this Virtex-E FPGA continues to serve as a dependable choice for designs requiring long-term availability, mature development tools, and well-documented performance characteristics. Whether you’re developing telecommunications equipment, industrial automation systems, or embedded computing platforms, the XCV600E-6FG680I provides the programmable logic capabilities needed for success.

For procurement inquiries, technical support, or design consultation regarding the XCV600E-6FG680I, contact authorized Xilinx distributors or visit the official AMD Xilinx support portal for the most current information and resources.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.