The XCV600E-7FG676C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Virtex-E family, designed to deliver exceptional performance for complex digital signal processing, networking, and embedded system applications. This versatile Xilinx FPGA combines high logic density with flexible programmability, making it an ideal solution for engineers and designers seeking reliable, high-capacity programmable logic devices.
Overview of XCV600E-7FG676C FPGA
The XCV600E-7FG676C represents a significant advancement in programmable logic technology, leveraging an aggressive 6-layer metal 0.18μm CMOS process to achieve dramatic improvements in silicon efficiency. With 15,552 logic cells and 444 configurable I/O pins, this FPGA provides the computational power and connectivity required for demanding applications in telecommunications, industrial automation, aerospace, and consumer electronics.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| Part Number |
XCV600E-7FG676C |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
Virtex-E 1.8V FPGAs |
| Logic Elements/Cells |
15,552 |
| Configurable Logic Blocks (CLBs) |
3,456 |
| System Gates |
186,624 equivalent gates |
| Total Gates |
Up to 985,882 |
| Package Type |
676-FBGA (Fine-Pitch Ball Grid Array) |
| Package Dimensions |
27mm x 27mm |
Electrical and Performance Characteristics
| Parameter |
Specification |
| Operating Voltage |
1.8V (1.71V – 1.89V) |
| Speed Grade |
-7 |
| Maximum Clock Frequency |
400 MHz |
| Combinatorial Delay (Max) |
0.42 ns |
| On-Chip RAM |
36 kB |
| Number of I/O Pins |
444 (Input/Output) |
| Total Pin Count |
676 pins |
| Technology Node |
0.18 μm CMOS |
| Metal Layers |
6-layer metal process |
Environmental and Physical Specifications
| Feature |
Details |
| Operating Temperature Range |
0°C to +85°C (Commercial) |
| Mounting Type |
Surface Mount Technology (SMT) |
| Package Body Material |
Plastic/Epoxy |
| Moisture Sensitivity Level |
MSL 3 |
| JESD-30 Code |
S-PBGA-B676 |
| JESD-609 Code |
e0 (Contains Lead) |
| RoHS Compliance |
Contains Lead (legacy component) |
XCV600E-7FG676C Application Areas
Digital Signal Processing (DSP)
The XCV600E-7FG676C excels in DSP applications thanks to its high clock frequency and abundant logic resources. Engineers utilize this FPGA for implementing complex algorithms including FFT processors, digital filters, image processing pipelines, and adaptive signal processing systems.
High-Speed Networking and Communications
With 444 I/O pins and 400MHz operation capability, this Virtex-E FPGA is well-suited for networking equipment, including routers, switches, protocol converters, and telecommunications infrastructure. The device supports high-bandwidth data paths essential for modern network applications.
Industrial Control Systems
Industrial automation systems benefit from the XCV600E-7FG676C’s reliable performance and extensive I/O capabilities. Common applications include motor control, process automation, machine vision systems, and real-time monitoring equipment.
Data Encryption and Security
The reconfigurable nature of this FPGA makes it ideal for implementing custom encryption algorithms, secure communication protocols, and cryptographic processors that require both high performance and flexibility.
Embedded Systems Development
System designers integrate the XCV600E-7FG676C into embedded platforms for applications requiring custom logic, peripheral interfacing, and real-time processing capabilities beyond what standard microcontrollers can provide.
Technical Advantages of Virtex-E Architecture
Enhanced Silicon Efficiency
The Virtex-E family, including the XCV600E-7FG676C, achieves dramatic improvements in silicon efficiency through architectural optimization for place-and-route efficiency. This results in better resource utilization and improved performance compared to earlier FPGA generations.
Flexible Interconnect Resources
Furthermore, the device features a rich hierarchy of fast, flexible interconnect resources that enable efficient signal routing across the chip. This sophisticated interconnect architecture minimizes routing delays and maximizes achievable clock frequencies.
Advanced Process Technology
Built on a 0.18μm CMOS process with 6 metal layers, the XCV600E-7FG676C delivers exceptional performance while maintaining reasonable power consumption. The advanced manufacturing process enables higher integration density and faster switching speeds.
Scalable Logic Resources
With 3,456 CLBs containing 15,552 logic cells, designers have substantial resources for implementing complex digital designs. Each CLB provides configurable logic functions, storage elements, and arithmetic capabilities.
Design and Development Considerations
Software Tools Compatibility
The XCV600E-7FG676C is supported by Xilinx ISE (Integrated Software Environment) design tools, which provide comprehensive capabilities for design entry, synthesis, implementation, and verification. Although newer devices use Vivado Design Suite, ISE remains the appropriate toolchain for Virtex-E FPGAs.
Power Management
Operating at 1.8V, this FPGA requires careful power supply design to ensure stable operation across its voltage range of 1.71V to 1.89V. Designers should implement proper decoupling capacitors and power distribution networks to minimize noise and voltage fluctuations.
Thermal Management
With an operating temperature range of 0°C to 85°C, thermal management becomes important in high-utilization designs. Adequate heatsinking or airflow may be necessary depending on the application’s power consumption and ambient temperature conditions.
PCB Layout Considerations
The 676-pin FBGA package requires careful PCB design with appropriate via structures, impedance-controlled routing for high-speed signals, and proper ground plane implementation. The 27mm x 27mm package size demands precise manufacturing tolerances.
Comparison with Alternative Speed Grades
| Speed Grade |
Maximum Frequency |
CLB Delay |
Application Focus |
| -7 (XCV600E-7FG676C) |
400 MHz |
0.42 ns |
Balanced performance |
| -6 |
357 MHz |
0.48 ns |
Cost-optimized solutions |
| -8 |
450 MHz |
0.38 ns |
High-performance applications |
The -7 speed grade strikes an excellent balance between performance and cost, making the XCV600E-7FG676C suitable for a wide range of applications without the premium pricing of the fastest speed grades.
Package and Pin Configuration Details
676-FBGA Package Benefits
The Fine-Pitch Ball Grid Array package offers several advantages:
- High I/O Density: 444 user I/O pins in a compact 27mm x 27mm footprint
- Excellent Thermal Performance: Direct thermal path to the PCB
- Reduced Package Parasitics: Shorter bond wires improve signal integrity
- Space Efficiency: Smaller board area compared to equivalent QFP packages
Pin Assignment Flexibility
The XCV600E-7FG676C provides extensive pin assignment flexibility, allowing designers to optimize their PCB layouts based on specific routing requirements and signal groupings.
Reliability and Quality Standards
Manufacturing Quality
AMD Xilinx maintains rigorous quality control standards throughout the manufacturing process. Each XCV600E-7FG676C undergoes comprehensive testing to ensure compliance with published specifications.
Moisture Sensitivity
Rated as MSL 3 (Moisture Sensitivity Level 3), this FPGA requires proper handling and storage in moisture-barrier bags with desiccant. Following industry-standard baking procedures before reflow soldering is essential for preventing moisture-related defects.
Product Lifecycle Status
While the Virtex-E family is considered a mature product line, the XCV600E-7FG676C remains available through authorized distributors and specialized component suppliers, making it suitable for legacy system support and cost-sensitive applications.
Procurement and Availability
Sourcing Considerations
When procuring the XCV600E-7FG676C, engineers should:
- Verify Authenticity: Purchase from authorized distributors to ensure genuine components
- Check Date Codes: Newer manufacturing lots typically offer better reliability
- Confirm Lead Time: Availability may vary; plan accordingly for production schedules
- Request Certifications: Obtain manufacturer certificates of conformance when required
Packaging Options
The XCV600E-7FG676C is typically available in:
- Bulk Packaging: For high-volume manufacturing
- Tray Packaging: Standard industrial packaging with anti-static protection
- Tape and Reel: Available upon request for automated assembly processes
Design Migration and Compatibility
Pin-Compatible Alternatives
Designers seeking enhanced performance or additional features can consider migrating to newer FPGA families while evaluating pin compatibility and voltage requirements. However, such migrations typically require design verification and requalification.
Legacy System Support
For existing designs utilizing the XCV600E-7FG676C, maintaining component availability becomes crucial for long-term product support. Establishing relationships with reliable suppliers and considering lifetime buy strategies may be prudent.
Conclusion: Why Choose XCV600E-7FG676C
The XCV600E-7FG676C represents a proven, reliable FPGA solution that continues to serve numerous applications requiring high-performance programmable logic. Its combination of 15,552 logic cells, 444 I/O pins, 400MHz operation, and mature development tools makes it an excellent choice for engineers working on DSP, networking, industrial control, and embedded systems projects.
Moreover, the extensive documentation, proven reliability, and widespread industry adoption of the Virtex-E family provide additional confidence for both new designs and legacy system support. Whether you’re developing cutting-edge applications or maintaining existing products, this Xilinx FPGA delivers the performance, flexibility, and reliability your project demands.
