Overview of XCV200E-6BG352I Field Programmable Gate Array
The XCV200E-6BG352I is a high-performance field-programmable gate array (FPGA) from AMD Xilinx’s renowned Virtex-E family, designed to deliver exceptional programmable logic solutions for demanding industrial applications. This industrial-grade FPGA combines advanced 0.18µm CMOS technology with a powerful architecture to provide design flexibility while accelerating time-to-market for complex digital designs.
Manufactured using cutting-edge 6-layer metal 0.18µm CMOS process technology, the XCV200E-6BG352I represents an evolutionary advancement in programmable logic design, offering superior performance characteristics that make it an ideal alternative to traditional mask-programmed gate arrays.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| Logic Cells |
5,292 configurable logic cells |
| System Gates |
63,504 gates (200,000 typical gates) |
| Configurable Logic Blocks (CLBs) |
1,176 CLBs |
| Maximum Operating Frequency |
357 MHz |
| Block RAM |
4,608 kilobits |
| I/O Pins |
260 user I/O pins |
| Package Type |
352-pin Metal BGA (Ball Grid Array) |
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage |
1.8V |
| I/O Voltage Range |
1.8V to 3.3V |
| Speed Grade |
-6 (industrial grade) |
| Technology Node |
0.18 μm CMOS |
| Metal Layers |
6-layer metal process |
Package Information
| Feature |
Details |
| Package Code |
BG352 |
| Package Type |
PBGA352 (Plastic Ball Grid Array) |
| Total Pin Count |
352 pins |
| Package Description |
Metal BGA-352 |
| Mounting Type |
Surface Mount Technology (SMT) |
Advanced Performance Capabilities
Programmable Logic Architecture
The XCV200E-6BG352I delivers exceptional silicon efficiency through its optimized architecture, specifically engineered for superior place-and-route efficiency. The device features a rich hierarchy of fast, flexible interconnect resources that enable complex digital designs with minimal timing constraints.
High-Speed Processing Features
With a maximum clock frequency of 357 MHz and built-in hardware multipliers and dividers, this Xilinx FPGA excels in applications requiring rapid arithmetic operations. The architecture supports parallel processing capabilities essential for high-performance digital signal processing (DSP) implementations.
Memory Resources
The integrated 4,608 kilobits of block RAM provides ample on-chip memory for data buffering, look-up tables, and temporary storage applications. This dual-port RAM structure enables simultaneous read/write operations, enhancing overall system throughput.
Industrial Applications and Use Cases
Telecommunications Infrastructure
The XCV200E-6BG352I is extensively deployed in telecommunications equipment for:
- Base station signal processing
- Protocol conversion and switching
- Network packet processing
- High-speed data routing
Aerospace and Defense Systems
Military and aerospace applications leverage this FPGA for:
- Radar signal processing
- Avionics control systems
- Secure communications equipment
- Flight control algorithms
Industrial Automation
Manufacturing and industrial control systems utilize the XCV200E-6BG352I for:
- Motor control and drive systems
- Real-time process monitoring
- Machine vision processing
- Programmable logic controllers (PLC)
Medical Device Electronics
Healthcare equipment manufacturers integrate this FPGA in:
- Medical imaging systems
- Patient monitoring devices
- Diagnostic equipment
- Laboratory instrumentation
Data Center Computing
Enterprise-level data processing applications include:
- High-speed data acquisition systems
- Scientific computing platforms
- Parallel processing accelerators
- Custom computing architectures
Supported Interface Protocols
The XCV200E-6BG352I provides comprehensive support for industry-standard communication interfaces:
| Interface Type |
Application |
| PCI/PCI-X |
System bus connectivity |
| SPI |
Serial peripheral communication |
| Ethernet |
Network connectivity (10/100/1000 Mbps) |
| USB |
Universal serial bus interface |
| LVDS |
High-speed differential signaling |
| Custom Protocols |
User-defined communication standards |
Design Tools and Development Environment
Xilinx ISE Design Suite
The XCV200E-6BG352I is fully supported by Xilinx ISE (Integrated Software Environment) Design Suite, providing comprehensive tools for:
- FPGA synthesis and implementation
- Timing analysis and verification
- Place-and-route optimization
- Simulation and debugging
Hardware Description Language Support
Engineers can develop designs using:
- VHDL (VHSIC Hardware Description Language)
- Verilog HDL
- System Verilog
- Schematic capture for legacy designs
Programming and Configuration
Multiple configuration methods are supported:
- JTAG boundary scan programming
- Serial configuration via SPI flash
- Parallel configuration interface
- Remote system upgrade capabilities
Quality and Reliability Standards
Manufacturing Quality
| Quality Metric |
Status |
| RoHS Compliance |
Not RoHS compliant (legacy product) |
| Lead-Free Status |
No (contains lead) |
| Product Lifecycle |
Obsolete/Legacy (not recommended for new designs) |
| Radiation Hardening |
No |
Reliability Features
The XCV200E-6BG352I incorporates robust design features including:
- Industrial temperature range operation
- ESD protection on all I/O pins
- Power-on reset circuitry
- Built-in configuration memory protection
Equivalent Parts and Cross-References
When considering alternatives or replacements for the XCV200E-6BG352I, compatible devices include:
| Part Number |
Key Difference |
| XCV200E-6FG456I |
456-pin FBGA package (more I/O) |
| XCV200E-6FG456C |
Commercial grade, 456-pin package |
| XCV200E-7FG456C |
Faster speed grade (-7) |
| XCV200E-6BG352C |
Commercial temperature grade version |
| XCV200E-6PQG240C |
Smaller 240-pin PQFP package |
Procurement and Availability
Global Distribution Network
The XCV200E-6BG352I is available through authorized distributors worldwide, including:
- DigiKey Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Regional component distributors
Packaging and Shipping
Products are shipped with:
- Anti-static protection (ESD bags)
- Moisture sensitivity level (MSL) packaging
- Traceability documentation
- Quality certifications
Design Considerations and Best Practices
Power Supply Design
When implementing the XCV200E-6BG352I in your design:
- Provide clean, regulated 1.8V core voltage with adequate current capacity
- Implement proper decoupling capacitors near power pins
- Use separate power planes for core and I/O supplies
- Consider voltage sequencing requirements
Thermal Management
For reliable operation:
- Calculate expected power dissipation based on design utilization
- Ensure adequate airflow for convection cooling
- Consider heat sink attachment for high-power applications
- Monitor junction temperature during operation
Signal Integrity
Maintain signal quality by:
- Following recommended PCB layout guidelines
- Using controlled impedance traces for high-speed signals
- Implementing proper termination for LVDS pairs
- Minimizing stub lengths on critical signals
Migration Path for New Designs
Important Note: The XCV200E-6BG352I is classified as obsolete and is not recommended for new designs. Engineers developing new products should consider migrating to current-generation Xilinx FPGA families:
Modern Alternatives
- Spartan-7 Family – Cost-effective solution for volume applications
- Artix-7 Family – Low-power, high-performance mainstream FPGAs
- Kintex-7 Family – Mid-range performance with advanced features
- Virtex-7 Family – High-end performance for demanding applications
- UltraScale/UltraScale+ Families – Latest generation with 16nm/20nm technology
Frequently Asked Questions
What is the operating temperature range?
The XCV200E-6BG352I is available in industrial temperature grade, typically operating from -40°C to +100°C junction temperature.
Can this FPGA be used in automotive applications?
While the device can operate in industrial environments, it is not AEC-Q100 qualified for automotive use. Consider automotive-grade FPGAs for vehicle applications.
What development boards are compatible?
Several third-party development boards support the Virtex-E family, though availability may be limited due to the legacy status of this device.
Is technical support available?
AMD Xilinx provides limited support for legacy Virtex-E devices. Community forums and archived documentation remain accessible for reference.
Conclusion
The XCV200E-6BG352I represents a proven FPGA solution from Xilinx’s Virtex-E family, offering robust performance for industrial, telecommunications, and aerospace applications. While classified as a legacy product, existing designs continue to benefit from its reliable architecture and comprehensive feature set.
For engineers maintaining existing systems, understanding the technical specifications, application considerations, and procurement options ensures continued product support. New design projects should evaluate current-generation FPGA families that offer enhanced performance, lower power consumption, and extended product lifecycle support.
