Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG972C: High-Performance Spartan-II FPGA Solution for Advanced Digital Design

Product Details

The XC2S200-6FGG972C is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-II family, delivering exceptional performance and flexibility for demanding digital design applications. This commercial-grade FPGA combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal choice for engineers seeking cost-effective, high-density programmable solutions.

Overview of XC2S200-6FGG972C FPGA

The XC2S200-6FGG972C represents a superior alternative to traditional mask-programmed ASICs, eliminating the substantial upfront costs, lengthy development cycles, and inherent risks associated with conventional application-specific integrated circuits. As part of the Xilinx FPGA product line, this device offers unparalleled design flexibility with field-upgradeable functionality that is simply impossible with fixed ASICs.

Key Features and Specifications

The Spartan-II XC2S200 FPGA delivers robust performance through its advanced architecture and comprehensive feature set. Engineers and designers benefit from the device’s optimized balance of logic resources, memory capabilities, and I/O flexibility.

Technical Specifications Table

Specification Value
Device Family Spartan-II
System Gates 200,000 gates
Logic Cells 5,292 cells
Configurable Logic Blocks (CLBs) 1,176 CLBs
CLB Array 28 x 42
Maximum User I/O 284 pins (excluding 4 global clock inputs)
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Speed Grade -6 (fastest commercial grade)
Core Voltage 2.5V
Process Technology 0.18 micron
Maximum Frequency 263 MHz
Package Type FGG972 (972-pin Fine-Pitch Ball Grid Array)
Temperature Range Commercial (0°C to +85°C)

Architecture and Performance Benefits

High-Density Logic Resources

The XC2S200-6FGG972C FPGA features 5,292 logic cells organized in a 28×42 array of Configurable Logic Blocks. This substantial logic capacity enables implementation of complex digital designs, including:

  • Digital signal processing (DSP) algorithms
  • Communication protocol implementations
  • Custom computing architectures
  • Control system logic
  • Data acquisition and processing systems

Memory Architecture

The device incorporates two types of on-chip memory for maximum flexibility:

Distributed RAM: 75,264 bits of distributed RAM integrated within the CLB architecture, ideal for small, distributed memory requirements throughout your design.

Block RAM: 56 Kbits of dedicated block RAM providing efficient storage for larger data structures, FIFOs, and buffer implementations.

Advanced I/O Capabilities

With up to 284 user I/O pins, the XC2S200-6FGG972C supports extensive interface requirements. The I/O blocks feature:

  • Multiple I/O standards support (LVTTL, LVCMOS, PCI, GTL, and more)
  • Programmable drive strength
  • Programmable slew rate control
  • Individual three-state control
  • Schmitt trigger inputs

Package Information: FGG972 Fine-Pitch BGA

Package Feature Specification
Package Type Fine-pitch Ball Grid Array (FBGA)
Total Pins 972 pins
Ball Pitch Fine pitch for high-density applications
Thermal Performance Enhanced heat dissipation characteristics
Lead-Free G-suffix indicates Pb-free/RoHS compliant option
Mounting Surface mount technology (SMT)

Speed Grade -6 Performance Characteristics

The -6 speed grade represents the fastest commercial temperature range option for the XC2S200, offering:

Performance Metric Typical Value
System Clock Frequency Up to 263 MHz
Maximum Toggle Rate 263 MHz
Setup Time Optimized for high-speed designs
Clock-to-Out Minimized for maximum performance
Pin-to-Pin Delay Reduced for time-critical paths

Note: The -6 speed grade is exclusively available in the commercial temperature range (C suffix).

Design Features and Capabilities

Programmable Architecture

The Spartan-II family architecture provides:

  • Configurable Logic Blocks (CLBs): Each CLB contains four logic cells with dedicated fast carry logic and distributed RAM capability
  • Input/Output Blocks (IOBs): Programmable I/O with support for multiple voltage standards
  • Delay-Locked Loops (DLLs): Four DLLs (one at each corner) for precise clock management and de-skewing
  • Routing Resources: Hierarchical, high-performance routing architecture

Clock Management

Advanced clock distribution network featuring:

  • Four dedicated global clock buffers
  • Delay-Locked Loop (DLL) technology for clock synthesis
  • Clock de-skew capabilities
  • Low-skew clock distribution

Application Areas for XC2S200-6FGG972C

Industrial Control Systems

The XC2S200 FPGA excels in industrial automation applications:

  • Motor control systems
  • Process automation
  • Factory automation equipment
  • Industrial networking interfaces
  • Sensor data acquisition and processing

Communications Equipment

Ideal for telecommunications and networking:

  • Protocol converters
  • Network switches and routers
  • Telecommunications infrastructure
  • Wireless base station equipment
  • Data encryption/decryption modules

Consumer Electronics

Widely deployed in consumer products:

  • Set-top boxes
  • Digital display controllers
  • Audio/video processing
  • Gaming systems
  • Home automation devices

Automotive Electronics

Suitable for automotive applications:

  • Dashboard instrumentation
  • Infotainment systems
  • Advanced driver assistance systems (ADAS)
  • Vehicle networking interfaces
  • Engine control modules

Comparison with Other Spartan-II Family Members

Device Logic Cells System Gates CLBs User I/O Distributed RAM Block RAM
XC2S50 1,728 50,000 384 176 24,576 bits 32 Kbits
XC2S100 2,700 100,000 600 176 38,400 bits 40 Kbits
XC2S150 3,888 150,000 864 260 55,296 bits 48 Kbits
XC2S200 5,292 200,000 1,176 284 75,264 bits 56 Kbits

The XC2S200 offers the highest capacity in the mid-range Spartan-II family, providing maximum resources for complex designs while maintaining cost-effectiveness.

Development Tools and Design Flow

Compatible Software

The XC2S200-6FGG972C is supported by industry-standard Xilinx development tools:

  • Xilinx ISE Design Suite: Complete integrated design environment
  • Vivado Design Suite: Advanced design and implementation
  • IP Cores: Extensive library of pre-verified IP blocks
  • Simulation Tools: ModelSim, ISim, and third-party simulators

Programming Options

Multiple configuration methods:

  • JTAG boundary scan
  • Master Serial mode
  • Slave Serial mode
  • Master Parallel mode
  • Slave Parallel mode

Power Consumption Characteristics

Power Parameter Typical Value
Core Voltage (VCCINT) 2.5V ±5%
I/O Voltage (VCCO) 1.5V to 3.3V (programmable)
Static Power Low quiescent current
Dynamic Power Design and frequency dependent
Standby Current Minimal when idle

Quality and Reliability

Manufacturing Standards

  • Advanced 0.18-micron CMOS process technology
  • Comprehensive production testing
  • Industry-standard reliability qualifications
  • JEDEC compliance

Environmental Compliance

  • RoHS compliant (Pb-free option with G suffix)
  • REACH regulation compliance
  • Conflict mineral-free
  • Halogen-free options available

Design Considerations and Best Practices

Thermal Management

For optimal performance and reliability:

  • Ensure adequate PCB thermal design
  • Consider heat sink requirements for high-utilization designs
  • Monitor junction temperature during operation
  • Use thermal vias for improved heat dissipation

Power Supply Design

Critical power supply requirements:

  • Use clean, well-regulated 2.5V core supply
  • Implement proper decoupling capacitors
  • Separate analog and digital grounds
  • Follow recommended power sequencing

Signal Integrity

Maintain signal integrity through:

  • Controlled impedance routing
  • Proper termination of high-speed signals
  • Minimize crosstalk with appropriate spacing
  • Use ground planes for return paths

Ordering Information Breakdown

Part Number Format: XC2S200-6FGG972C

  • XC2S200: Device type (Spartan-II, 200K gates)
  • 6: Speed grade (fastest commercial)
  • FGG972: Package type (972-pin Fine-Pitch BGA)
  • C: Temperature range (Commercial: 0°C to +85°C)

Alternative Package Options

While the FGG972 package offers maximum I/O density, the XC2S200 is also available in:

  • PQ208 (208-pin Plastic Quad Flat Pack)
  • FG256 (256-pin Fine-Pitch BGA)
  • FG456 (456-pin Fine-Pitch BGA)

Competitive Advantages

Versus Traditional ASICs

  1. No NRE Costs: Eliminate expensive mask sets and tooling
  2. Faster Time-to-Market: Begin production immediately after design completion
  3. Design Flexibility: Modify functionality post-deployment
  4. Lower Risk: Prototype and validate before committing to volume
  5. Reduced Inventory: Single device supports multiple product variants

Versus CPLDs

  1. Higher Density: 200K gates vs. typical CPLD capacity
  2. More Memory: Integrated block RAM unavailable in most CPLDs
  3. Better Performance: Higher maximum clock frequencies
  4. Advanced Features: DLLs and sophisticated clock management

Frequently Asked Questions

What is the maximum operating frequency?

The XC2S200-6FGG972C supports system clock frequencies up to 263 MHz, depending on design complexity and routing.

Can I reconfigure the FPGA in-system?

Yes, the Spartan-II family supports multiple in-system configuration methods including JTAG, making field updates straightforward.

What temperature range is supported?

The C suffix indicates commercial temperature range (0°C to +85°C). Industrial temperature options may be available in other package variants.

Is this device still in production?

While the Spartan-II family is a mature product line, availability should be verified with authorized distributors. Xilinx/AMD offers newer families like Spartan-7 for new designs.

What development board options exist?

Various third-party development boards and evaluation kits support the XC2S200, though availability varies. Check with educational suppliers and FPGA development board manufacturers.

Summary: Why Choose XC2S200-6FGG972C?

The XC2S200-6FGG972C Spartan-II FPGA delivers an optimal combination of performance, capacity, and value for mid-range digital design applications. With 200,000 system gates, 5,292 logic cells, and up to 284 user I/O pins in a high-density FGG972 package, this device provides the resources needed for complex designs while maintaining cost-effectiveness.

The -6 speed grade ensures maximum performance for time-critical applications, supporting clock frequencies up to 263 MHz. Combined with 56 Kbits of block RAM, 75,264 bits of distributed RAM, and four DLLs for advanced clock management, the XC2S200-6FGG972C stands as a proven solution for industrial control, communications, automotive, and consumer electronics applications.

Whether upgrading from smaller FPGAs or seeking an alternative to expensive ASICs, the XC2S200-6FGG972C from the Xilinx FPGA family offers the programmability, performance, and flexibility required for today’s advanced digital designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.