Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG971C: High-Performance Xilinx Spartan-II FPGA Solution

Product Details

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XC2S200-6FGG971C: High-Performance Xilinx Spartan-II FPGA Solution

The XC2S200-6FGG971C is a premium field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family, engineered to deliver exceptional performance for complex digital design applications. This advanced FPGA combines 200,000 system gates with industry-leading programmability, making it the ideal choice for telecommunications, industrial automation, and embedded systems.

Overview of XC2S200-6FGG971C FPGA Technology

The XC2S200-6FGG971C represents cutting-edge programmable logic technology from AMD Xilinx. As part of the Spartan-II series, this FPGA offers a superior alternative to traditional mask-programmed ASICs, eliminating costly upfront investments and lengthy development cycles while providing unprecedented design flexibility.

Key Technical Specifications

Parameter Specification
Part Number XC2S200-6FGG971C
Device Family Xilinx Spartan-II
System Gates 200,000 gates
Logic Cells 5,292 cells
CLB Array 28 x 42 (1,176 total CLBs)
Speed Grade -6 (highest performance)
Package Type FGG971 (971-pin Fine-Pitch BGA)
Temperature Range Commercial (0°C to +85°C)
Core Voltage 2.5V
Technology Node 0.18μm process

XC2S200-6FGG971C Architecture and Features

Configurable Logic Block Architecture

The XC2S200-6FGG971C features a robust 28 x 42 CLB array configuration, providing 1,176 configurable logic blocks for maximum design flexibility. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers, enabling complex digital circuit implementations.

Memory Resources

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Total On-Chip Memory 131,328 bits

Input/Output Capabilities

The FGG971 package configuration provides extensive I/O capabilities essential for complex system integration. The XC2S200-6FGG971C supports multiple I/O standards and features:

  • High-speed differential I/O support
  • LVTTL, LVCMOS, and PCI compatibility
  • Programmable drive strength
  • Hot-swappable capabilities

Performance Characteristics of XC2S200-6FGG971C

Speed Grade -6 Performance

The -6 speed grade represents the fastest commercial temperature range option for the XC2S200 family, delivering:

  • Maximum operating frequency: 200+ MHz
  • Low propagation delays
  • Optimized timing for high-speed applications
  • Enhanced signal integrity

Applications for XC2S200-6FGG971C FPGA

Industrial Automation Systems

The XC2S200-6FGG971C excels in industrial control applications, offering:

  • Real-time process control
  • Motor drive controllers
  • PLC replacement solutions
  • Sensor interface management

Telecommunications Infrastructure

Deploy the XC2S200-6FGG971C in:

  • Base station controllers
  • Protocol converters
  • Data routing systems
  • Signal processing units

Embedded System Development

Application Area Key Benefits
Digital Signal Processing High-speed parallel processing, efficient algorithm implementation
Data Acquisition Multiple simultaneous input channels, real-time processing
Control Systems Deterministic response, programmable logic customization
Communication Protocols Flexible interface implementation, protocol conversion

Design Tools and Development Support

ISE Design Suite Compatibility

The XC2S200-6FGG971C is fully supported by Xilinx FPGA development tools, including:

  • ISE Foundation
  • ChipScope Pro analyzer
  • EDK embedded development kit
  • Timing analysis tools

Programming and Configuration

Configuration Options:

Method Description
JTAG Industry-standard boundary scan
Slave Serial Compact configuration interface
Master Serial Autonomous configuration from PROM
SelectMAP High-speed parallel configuration

Technical Advantages of Spartan-II XC2S200-6FGG971C

Cost-Effective ASIC Alternative

Replace expensive custom ASICs with the XC2S200-6FGG971C to achieve:

  • Zero NRE (Non-Recurring Engineering) costs
  • Rapid prototyping capabilities
  • Field upgradability
  • Reduced time-to-market

Design Flexibility and Scalability

The XC2S200-6FGG971C programmability enables:

  • In-system reconfiguration
  • Design iteration without hardware changes
  • Product lifetime updates
  • Bug fixes via firmware updates

Power Management Features

Efficient Power Consumption

Power Parameter Value
Core Voltage (VCCINT) 2.5V ±5%
I/O Voltage (VCCO) 1.5V to 3.3V
Typical Static Power Low standby current
Dynamic Power Design-dependent

Quality and Reliability Standards

The XC2S200-6FGG971C meets stringent quality requirements:

  • Commercial temperature range certification
  • RoHS compliance options (G-suffix packages)
  • Extended lifecycle support
  • Comprehensive testing protocols

Package Information: FGG971

Physical Characteristics

The FGG971 Fine-Pitch Ball Grid Array package offers:

  • 971-pin configuration
  • Compact footprint
  • Superior thermal performance
  • Enhanced signal integrity
  • Robust mechanical stability

Ordering Information for XC2S200-6FGG971C

Part Number Breakdown

XC2S200-6FGG971C

  • XC2S200: Device type (Spartan-II, 200K gates)
  • 6: Speed grade (fastest commercial grade)
  • FGG: Fine-pitch ball grid array package
  • 971: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Getting Started with XC2S200-6FGG971C

Development Resources

  1. Download Xilinx ISE Design Suite
  2. Access datasheet and user guides
  3. Review reference designs
  4. Join Xilinx developer community
  5. Explore application notes

Evaluation and Prototyping

Consider these development approaches:

  • Custom PCB design with FGG971 footprint
  • Signal integrity simulation
  • Power distribution planning
  • Thermal management design

Competitive Advantages

Why Choose XC2S200-6FGG971C?

Comparison with Alternatives:

Feature XC2S200-6FGG971C Typical ASIC
Development Cost Low (tools only) High (masks, NRE)
Time to Market Days to weeks Months to years
Design Changes Immediate Impossible
Volume Flexibility Any quantity High MOQ
Risk Minimal Significant

Frequently Asked Questions

What makes the -6 speed grade special?

The -6 speed grade represents the highest performance tier for commercial temperature Spartan-II FPGAs, optimized for applications requiring maximum clock frequencies and minimal propagation delays.

Is the XC2S200-6FGG971C suitable for new designs?

While the Spartan-II family is a mature product line, it remains viable for many applications. Consider evaluating newer Xilinx families for cutting-edge performance requirements.

What development tools are required?

The Xilinx ISE Design Suite provides comprehensive development support, including synthesis, implementation, and debugging tools specifically optimized for Spartan-II FPGAs.

Conclusion

The XC2S200-6FGG971C delivers exceptional value for engineers seeking a reliable, high-performance FPGA solution. With 200,000 system gates, 5,292 logic cells, and the versatile FGG971 package, this Xilinx Spartan-II device provides the perfect balance of capability, cost-effectiveness, and design flexibility for demanding applications across industrial, telecommunications, and embedded system markets.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.