Overview of XC2S200-6FGG970C Field Programmable Gate Array
The XC2S200-6FGG970C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, delivering exceptional performance and versatility for complex digital design applications. This advanced Xilinx FPGA combines 200,000 system gates with 5,292 logic cells in a high-density 970-ball fine-pitch BGA package, making it an ideal solution for telecommunications, industrial control, digital signal processing, and embedded system applications.
Built on proven 0.18μm CMOS technology, the XC2S200-6FGG970C operates at 2.5V core voltage and features the fastest -6 speed grade, supporting system performance up to 200 MHz. This Spartan-II FPGA represents a cost-effective alternative to traditional ASICs while offering the flexibility of field programmability and in-system reconfiguration capabilities.
Key Technical Specifications
Core Architecture and Logic Resources
| Specification |
Value |
| Device Family |
Spartan-II (XC2S Series) |
| Logic Cells |
5,292 |
| System Gates |
200,000 (including logic and RAM) |
| CLB Array Configuration |
28 x 42 (Rows x Columns) |
| Total CLBs |
1,176 Configurable Logic Blocks |
| Maximum User I/O |
284 pins |
| Speed Grade |
-6 (Highest Performance) |
| Operating Voltage |
2.5V (VCCINT) |
| Technology Node |
0.18μm CMOS |
| Package Type |
FGG970 (970-ball Fine-pitch BGA) |
| Temperature Range |
Commercial (0°C to +85°C) |
Memory and Storage Capabilities
| Memory Type |
Capacity |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56 Kbits (56,000 bits) |
| Block RAM Blocks |
14 blocks (4K each) |
| Embedded Memory Options |
Dual-port, single-port configurations |
Performance Characteristics
| Performance Metric |
Specification |
| Maximum System Clock Frequency |
200 MHz |
| Internal Clock Speed |
Up to 263 MHz |
| Propagation Delay |
Optimized for -6 speed grade |
| I/O Standards Support |
LVTTL, LVCMOS, PCI, GTL+ |
| Number of DLLs |
4 (Delay-Locked Loops) |
Advanced Features and Functionality
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG970C incorporates 1,176 CLBs arranged in a 28×42 array, providing extensive logic resources for complex digital designs. Each CLB contains:
- Four logic slices with dual 4-input LUTs (Look-Up Tables)
- Fast carry logic for arithmetic operations
- Dedicated multiplexers for data routing
- Storage elements (flip-flops and latches)
- Distributed RAM capability for on-chip memory
Input/Output Architecture
With 284 maximum user I/O pins, this FPGA provides extensive connectivity options for interfacing with external devices and systems. The I/O blocks support multiple voltage standards and include:
- Programmable I/O standards (LVTTL, LVCMOS 3.3V/2.5V/1.8V)
- Input and output registers for synchronous operation
- Tristate buffers for bidirectional communication
- Hot-swappable I/O support
- Individual I/O configuration control
Delay-Locked Loop (DLL) Technology
Four independent DLLs positioned at each corner of the die provide:
- Clock de-skewing and multiplication
- Phase shifting capabilities
- Low-jitter clock distribution
- Improved timing closure
- Enhanced system performance
XC2S200-6FGG970C Package Information
FGG970 Ball Grid Array Package Details
| Package Attribute |
Description |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Total Ball Count |
970 balls |
| Package Form Factor |
Square BGA configuration |
| Ball Pitch |
Fine pitch for high-density mounting |
| Mounting Technology |
Surface mount (SMT) |
| Thermal Performance |
Enhanced heat dissipation |
| RoHS Compliance |
Lead-free option available (G designation) |
The FGG970 package offers superior electrical performance, excellent thermal characteristics, and high I/O density, making it suitable for space-constrained applications requiring maximum connectivity.
Target Applications and Use Cases
Telecommunications and Networking
- Protocol processing and conversion
- Data encryption and security
- Network switching and routing
- Wireless base station equipment
- Telecommunications infrastructure
Industrial Control Systems
- Programmable logic controllers (PLCs)
- Motor control and drive systems
- Industrial automation equipment
- Process control applications
- Factory automation systems
Digital Signal Processing
- Audio and video processing
- Image processing and compression
- Software-defined radio (SDR)
- Digital filtering applications
- Real-time signal analysis
Embedded Systems
- System-on-chip (SoC) prototyping
- Hardware acceleration
- Custom peripheral interfaces
- Embedded controller applications
- Mixed-signal system integration
Design Tools and Development Support
Compatible Software Platforms
The XC2S200-6FGG970C is fully supported by AMD Xilinx development tools:
- ISE Design Suite: Complete FPGA design flow including synthesis, implementation, and simulation
- Vivado Design Suite: Next-generation design environment (with compatibility support)
- ChipScope Pro: Integrated logic analyzer for in-system debugging
- Platform Studio: Embedded processor design tools
Programming and Configuration
Multiple configuration options provide flexibility for system deployment:
- JTAG boundary-scan programming
- Slave serial configuration
- Master serial mode
- SelectMAP parallel configuration
- In-system reconfiguration capability
Performance Advantages of -6 Speed Grade
The -6 speed grade designation indicates the highest performance variant of the XC2S200, offering:
- Fastest propagation delays: Minimized signal delays through logic and routing
- Highest clock frequencies: Support for 200+ MHz system operation
- Optimized timing: Enhanced setup and hold time characteristics
- Commercial temperature range: Exclusively available for 0°C to +85°C operation
- Maximum throughput: Ideal for high-speed data processing applications
Power Management and Consumption
Operating Voltage Requirements
| Power Rail |
Voltage |
Purpose |
| VCCINT |
2.5V ±5% |
Core logic power |
| VCCO |
1.8V – 3.3V |
I/O bank power (configurable) |
| VCCAUX |
2.5V ±5% |
Auxiliary circuits (DLLs) |
Power Optimization Features
- Low static power consumption in standby mode
- Dynamic power scaling based on utilization
- Individually controllable I/O banks
- Efficient clock gating options
- Sleep mode support for power-sensitive applications
Comparison with Other Spartan-II Family Members
XC2S200 vs. Alternative Devices
| Device |
Logic Cells |
System Gates |
CLBs |
Max I/O |
Block RAM |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
| XC2S300E |
6,912 |
300,000 |
1,536 |
329 |
72K |
The XC2S200 offers an optimal balance between logic resources, I/O count, and cost-effectiveness for mid-range FPGA applications.
Quality and Reliability Standards
Manufacturing Quality
- Manufactured in ISO 9001 certified facilities
- Full automotive qualification available
- Extended temperature ranges for industrial applications
- Rigorous testing and quality control procedures
- Long-term product availability commitment
Reliability Features
- Built-in JTAG boundary scan for board-level testing
- IEEE 1149.1 compliant test access port
- Configuration memory CRC checking
- Readback and verify capabilities
- Error detection and correction options
Getting Started with XC2S200-6FGG970C
Design Considerations
When implementing designs with the XC2S200-6FGG970C, engineers should consider:
- Adequate power supply decoupling: Multiple ceramic capacitors near each power pin
- Proper PCB stackup: Controlled impedance for high-speed signals
- Thermal management: Heat sink or thermal vias for high-utilization designs
- Clock distribution: Utilize DLLs for optimal clock network performance
- I/O voltage planning: Organize I/O banks by voltage level requirements
Recommended PCB Design Guidelines
- Minimum 6-layer PCB for signal integrity
- Dedicated power and ground planes
- 0.1μF and 10μF decoupling capacitors per power pin
- Via-in-pad technology for BGA mounting
- Proper solder mask definition for 970-ball package
Ordering Information and Part Number Decoding
Part Number Breakdown: XC2S200-6FGG970C
- XC: Xilinx FPGA product identifier
- 2S: Spartan-II family designation
- 200: 200,000 system gates
- -6: Speed grade (highest performance)
- FGG: Fine-pitch Ball Grid Array package style
- 970: 970-ball package configuration
- C: Commercial temperature range (0°C to +85°C)
Available Alternatives
For different performance or package requirements, consider these variants:
- XC2S200-5FGG970C: Standard speed grade (-5)
- XC2S200-6FG456C: Smaller 456-ball package
- XC2S200-6PQ208C: Quad flat pack alternative
Why Choose XC2S200-6FGG970C for Your Design?
Cost-Effective ASIC Alternative
The XC2S200-6FGG970C eliminates the high non-recurring engineering (NRE) costs associated with ASIC development while providing comparable performance for many applications. Benefits include:
- Zero NRE costs
- Rapid prototyping and time-to-market
- Design flexibility and iteration
- Field upgradability
- Reduced financial risk
Proven Spartan-II Architecture
Backed by thousands of successful designs worldwide, the Spartan-II family has established itself as a reliable, well-documented platform with extensive third-party IP core support and community resources.
Future-Proof Design Platform
In-system reconfigurability ensures your hardware can adapt to changing requirements, bug fixes, and feature enhancements without physical replacement—a critical advantage in long product lifecycles.
Technical Support and Resources
Available Documentation
- Complete product datasheet with electrical specifications
- Application notes for common design patterns
- Reference designs and example projects
- PCB layout guidelines and package drawings
- Timing analysis and constraint templates
Community and Support
- Active user forums and discussion groups
- Technical support from AMD Xilinx FAE team
- Training courses and webinars
- Third-party design service partners
- Extensive IP core ecosystem
Frequently Asked Questions
What is the main advantage of the -6 speed grade?
The -6 speed grade provides the fastest performance characteristics in the Spartan-II family, enabling higher clock frequencies and reduced propagation delays for time-critical applications.
Can the XC2S200-6FGG970C be used in automotive applications?
While the standard commercial temperature range suits many applications, automotive-grade versions with extended temperature ranges and AEC-Q100 qualification are available through special order.
What is the typical power consumption?
Power consumption varies based on design utilization, clock frequency, and I/O activity. Typical static power is approximately 150-300mW, with dynamic power scaling based on toggle rates.
Is the device 5V tolerant?
No, the XC2S200 I/Os are not 5V tolerant. External level shifters are required when interfacing with 5V logic systems.
What configuration memory options are supported?
The device can be configured from Platform Flash PROMs, serial EEPROMs, or through JTAG interface for development and production programming.
Conclusion: Maximize Your Design Potential
The XC2S200-6FGG970C represents an exceptional choice for engineers seeking a high-performance, cost-effective FPGA solution. With 200,000 system gates, 284 I/Os, and the fastest -6 speed grade, this device delivers the processing power and flexibility needed for demanding applications across telecommunications, industrial control, and digital signal processing markets.
Whether you’re developing next-generation telecommunications equipment, industrial automation systems, or custom embedded solutions, the XC2S200-6FGG970C provides the perfect combination of resources, performance, and value. Its proven architecture, comprehensive tool support, and field-programmable nature make it an ideal platform for innovation and rapid product development.
Explore the complete range of Xilinx FPGA solutions to find the perfect fit for your next design project.
