Overview of XCV1000E-6FGG680C Field Programmable Gate Array
The XCV1000E-6FGG680C is a powerful field programmable gate array (FPGA) from AMD Xilinx’s acclaimed Virtex-E family. Designed for demanding digital applications, this Xilinx FPGA delivers exceptional performance with 331,776 system gates and 27,648 logic cells in a compact 680-pin fine-pitch ball grid array (FBGA) package. Built on advanced 0.18μm CMOS technology, the XCV1000E-6FGG680C combines high-density programmable logic with low power consumption, making it ideal for telecommunications, industrial control, and digital signal processing applications.
Key Specifications and Features
Technical Specifications Table
| Parameter |
Specification |
| Part Number |
XCV1000E-6FGG680C |
| Manufacturer |
AMD Xilinx (formerly Xilinx Inc.) |
| Product Family |
Virtex-E |
| System Gates |
331,776 (1,000,000 equivalent) |
| Logic Cells |
27,648 |
| Configurable Logic Blocks (CLBs) |
6,144 |
| Maximum Frequency |
357 MHz |
| Process Technology |
0.18μm CMOS |
| Core Voltage |
1.8V |
| Package Type |
680-Pin FBGA (Fine-Pitch Ball Grid Array) |
| Number of I/O Pins |
512 |
| Temperature Grade |
Commercial (0°C to +85°C) |
| RoHS Status |
Non-compliant (Legacy Product) |
Performance Characteristics
| Feature |
Description |
| Speed Grade |
-6 (Standard Performance) |
| Block RAM |
Dedicated memory blocks for data buffering |
| Distributed RAM |
LUT-based flexible memory implementation |
| Clock Management |
Digital Clock Manager (DCM) for precise timing |
| I/O Standards Support |
LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL |
| Configuration |
SRAM-based, supports multiple modes |
XCV1000E-6FGG680C Architecture and Capabilities
Advanced Logic Resources
The XCV1000E-6FGG680C FPGA architecture features a sophisticated array of programmable resources designed for maximum flexibility. Each configurable logic block contains four logic cells, providing fine-grained control over digital circuit implementation. The device supports complex combinatorial and sequential logic functions, enabling engineers to implement custom processors, state machines, and specialized arithmetic units.
Memory and Storage Options
| Memory Type |
Capacity |
Application |
| Block SelectRAM |
Variable |
FIFO buffers, data caching |
| Distributed RAM |
Derived from LUTs |
Small memory arrays, shift registers |
| Configuration Memory |
SRAM-based |
Device programming storage |
Input/Output Capabilities
With 512 user-configurable I/O pins, the XCV1000E-6FGG680C provides extensive connectivity options. The device supports multiple I/O standards simultaneously, allowing seamless integration with various system architectures. Each I/O pin can be individually configured for voltage levels, slew rates, and termination, ensuring signal integrity across diverse applications.
Applications and Use Cases
Primary Application Areas
The XCV1000E-6FGG680C excels in numerous high-performance applications:
- Telecommunications Infrastructure: Digital signal processing, protocol conversion, network packet processing
- Industrial Automation: Motion control systems, machine vision, sensor data acquisition
- Medical Equipment: Diagnostic imaging, signal analysis, patient monitoring systems
- Aerospace and Defense: Radar processing, secure communications, guidance systems
- Test and Measurement: High-speed data acquisition, real-time signal analysis
Design Implementation Benefits
| Benefit |
Description |
| Rapid Prototyping |
Quick design iterations without silicon fabrication |
| Field Upgradability |
In-system reconfiguration for feature updates |
| Cost-Effective Development |
Reduces NRE costs compared to ASIC solutions |
| Design Security |
Bitstream encryption protects intellectual property |
| Time-to-Market |
Accelerates product development cycles |
Package and Pin Configuration
FBGA680 Package Dimensions
The XCV1000E-6FGG680C utilizes a 680-pin fine-pitch ball grid array package optimized for high-density applications. This exposed pad package offers excellent thermal performance and minimal parasitic inductance, crucial for high-frequency operation.
| Package Parameter |
Specification |
| Package Type |
680-LBGA (Low-Profile BGA) |
| Ball Pitch |
1.0mm |
| Package Body |
27mm x 27mm (nominal) |
| Thermal Pad |
Yes (exposed) |
| Total Balls |
680 |
| Mounting |
Surface mount technology (SMT) |
Power Requirements and Thermal Management
Operating Voltage Specifications
| Power Rail |
Voltage |
Purpose |
| VCCINT |
1.8V ± 5% |
Core logic supply |
| VCCIO |
1.5V to 3.3V |
I/O banking voltage |
| VCCO |
Varies by bank |
Output driver supply |
Power Consumption Guidelines
The XCV1000E-6FGG680C demonstrates efficient power utilization through advanced clock management and selective logic activation. Typical power consumption varies based on design complexity, operating frequency, and I/O activity. Engineers should implement proper power distribution networks with adequate decoupling capacitors to ensure stable operation.
Design Tools and Development Support
Compatible Development Environments
Designing with the XCV1000E-6FGG680C requires Xilinx ISE (Integrated Software Environment) or compatible FPGA design tools. The workflow includes:
- HDL Design Entry: Verilog or VHDL coding
- Synthesis: Logic optimization and mapping
- Place and Route: Physical implementation
- Timing Analysis: Performance verification
- Bitstream Generation: Configuration file creation
Programming and Configuration Options
| Configuration Mode |
Interface |
Description |
| Master Serial |
PROM |
Autonomous boot from external memory |
| Slave Serial |
Host processor |
System-controlled configuration |
| JTAG |
Boundary scan |
Development and debugging |
| SelectMAP |
Parallel |
High-speed configuration interface |
Comparison with Related Virtex-E Devices
Speed Grade Variants
| Part Number |
Speed Grade |
Max Frequency |
Application Focus |
| XCV1000E-6FGG680C |
-6 |
357 MHz |
Standard performance |
| XCV1000E-7FGG680C |
-7 |
400 MHz |
High-performance applications |
| XCV1000E-8FGG680C |
-8 |
450 MHz |
Maximum speed requirements |
Product Status and Availability
Lifecycle Information
Important Note: The XCV1000E-6FGG680C is currently classified as an obsolete/legacy product by AMD Xilinx. While the device is no longer recommended for new designs, it remains available through authorized distributors and specialty component suppliers for replacement, repair, and legacy system maintenance purposes.
Procurement Considerations
| Consideration |
Details |
| Product Status |
Obsolete (Not recommended for new designs) |
| Availability |
Limited stock through distributors |
| Lead Time |
Extended, subject to availability |
| Packaging |
Tray packaging standard |
| Minimum Order |
Varies by supplier |
Quality and Reliability
Manufacturing Standards
The XCV1000E-6FGG680C is manufactured under strict quality control protocols ensuring consistent performance across production lots. While this device predates current RoHS compliance requirements, it meets the reliability standards established during its production era.
Testing and Validation
Each device undergoes comprehensive testing including:
- Functional verification at speed
- DC parametric testing
- Thermal cycling qualification
- I/O buffer characterization
- Configuration memory integrity checks
Integration Guidelines for System Designers
PCB Layout Recommendations
Successful implementation of the XCV1000E-6FGG680C requires careful attention to board design:
Critical Design Considerations:
- Power Distribution: Dedicated power planes with multiple bypass capacitors
- Signal Integrity: Controlled impedance routing for high-speed signals
- Thermal Management: Adequate copper pour for heat dissipation
- Decoupling: Multiple capacitor values (0.1μF, 0.01μF, 1μF) near FPGA
- Ground Planes: Continuous ground reference for signal return paths
Configuration Circuit Design
| Component |
Specification |
Purpose |
| Configuration PROM |
XCF series |
Stores bitstream data |
| Pull-up Resistors |
4.7kΩ typical |
Mode pin configuration |
| Decoupling Caps |
0.1μF ceramic |
Transient suppression |
| JTAG Interface |
14-pin header |
Programming and debug access |
Software Development and IP Cores
Supported HDL Languages
The XCV1000E-6FGG680C supports industry-standard hardware description languages including VHDL, Verilog, and SystemVerilog for design entry. Engineers can also utilize schematic capture tools for simpler logic implementations.
IP Core Integration
Xilinx provides extensive IP core libraries compatible with Virtex-E devices:
- DSP Functions: FIR filters, FFT processors, digital modulators
- Communication Protocols: Ethernet MAC, PCI interface, USB controllers
- Memory Controllers: DDR SDRAM, SRAM, Flash interfaces
- Arithmetic Units: Multipliers, dividers, CORDIC algorithms
Migration and Alternative Solutions
Recommended Migration Paths
For new designs, AMD Xilinx recommends migrating to current-generation FPGA families offering enhanced performance, lower power consumption, and advanced features:
- Artix-7 Family: Cost-optimized, lower power consumption
- Kintex-7 Family: Balanced performance and power efficiency
- Virtex-7 Family: Maximum performance and capability
- UltraScale+ Architecture: Latest technology with AI acceleration
Cross-Reference Guide
| Legacy Device |
Recommended Alternative |
Key Improvements |
| XCV1000E-6FGG680C |
XC7A100T |
50% lower power, DDR3 support |
| Virtex-E family |
Kintex-7 |
28nm process, better performance/watt |
Technical Support and Documentation
Available Resources
Comprehensive technical documentation supports XCV1000E-6FGG680C implementation:
- Data Sheet: Electrical specifications and AC/DC parameters
- User Guide: Architectural overview and design guidelines
- Application Notes: Best practices for specific implementations
- Reference Designs: Example projects and tested configurations
Community and Vendor Support
Despite obsolete status, technical resources remain available through Xilinx legacy product archives. Online communities and forums provide peer support for engineers maintaining existing systems using this device.
Frequently Asked Questions
Is the XCV1000E-6FGG680C suitable for new designs?
No, AMD Xilinx has discontinued this product line and does not recommend it for new designs. Current-generation FPGAs offer superior performance, features, and long-term availability.
What development tools support this FPGA?
The XCV1000E-6FGG680C is supported by Xilinx ISE versions 9.x through 14.x. Newer Vivado tools do not support Virtex-E devices.
Can I upgrade firmware in deployed systems?
Yes, the SRAM-based configuration architecture allows field updates through various programming interfaces including JTAG, Serial, and SelectMAP modes.
What is the expected product lifetime?
As an obsolete product, remaining inventory availability is limited and unpredictable. Organizations relying on this device should consider migration planning for long-term sustainability.
Are there drop-in replacement options?
Direct pin-compatible replacements are not available. Migration to newer devices requires redesign, though IP cores and HDL code may be portable with modifications.
Conclusion
The XCV1000E-6FGG680C represents a mature FPGA solution from AMD Xilinx’s proven Virtex-E architecture. While no longer recommended for new designs due to obsolescence, it continues to serve critical roles in legacy systems across telecommunications, industrial, and aerospace applications. Organizations maintaining equipment utilizing this device can still source components through specialized distributors, though long-term planning should include migration strategies to current-generation FPGA families.
For engineers supporting existing systems, the XCV1000E-6FGG680C delivers reliable performance backed by extensive documentation and proven field history. Its 331,776 system gates, 512 I/O pins, and robust 680-pin FBGA package continue to meet the requirements of many established applications.
When planning new projects or system upgrades, consider exploring modern Xilinx FPGA alternatives offering enhanced capabilities, improved power efficiency, and assured long-term availability. The evolution from Virtex-E to current UltraScale+ architectures represents significant advancement in programmable logic technology, providing opportunities for performance enhancement and feature expansion in your next-generation designs.
