The XC2S200-6FGG950C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for complex digital processing applications. This advanced FPGA combines 200,000 system gates with a high-density 950-ball Fine-Pitch Ball Grid Array (FBGA) package, making it an ideal solution for demanding industrial, telecommunications, and embedded systems projects.

Overview of XC2S200-6FGG950C FPGA

The XC2S200-6FGG950C represents a superior alternative to traditional mask-programmed ASICs, offering unprecedented flexibility without the costly development cycles and inherent risks associated with custom silicon. This Xilinx FPGA enables field-upgradeable designs, allowing engineers to modify and optimize their applications even after deployment—a capability impossible with conventional ASICs.

Key Features and Benefits

The XC2S200-6FGG950C FPGA delivers outstanding capabilities that make it a preferred choice for professional electronic design:

• 200,000 System Gates – Extensive logic capacity for implementing complex digital circuits and algorithms
• 5,292 Logic Cells – Robust configurable logic blocks for versatile design implementations
• 950-Ball FGG Package – High pin-count FBGA package providing maximum I/O connectivity
• Speed Grade -6 – Optimized performance tier ensuring reliable high-speed operation
• 2.5V Core Voltage – Low power consumption with standard voltage compatibility
• Commercial Temperature Range – Reliable operation in standard industrial environments

Technical Specifications

Core Architecture Specifications

Package Information

Advanced FPGA Architecture

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG950C features a robust array of 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that enable flexible implementation of complex combinational and sequential logic circuits. This architecture supports sophisticated digital signal processing, control algorithms, and data manipulation tasks.

Memory Resources

Distributed RAM

With 75,264 bits of distributed RAM integrated throughout the CLB array, the XC2S200-6FGG950C provides fast, local memory storage ideal for small buffers, FIFOs, and lookup tables directly within your logic implementation.

Block RAM

The device incorporates 56K bits of dedicated Block RAM organized in dual-port configurations. These memory blocks deliver high-speed data storage capabilities essential for buffering, data processing, and temporary storage in bandwidth-intensive applications.

I/O Capabilities

The FGG950 package provides access to 284 maximum user I/O pins (excluding dedicated clock inputs), offering extensive connectivity options for interfacing with external components, sensors, actuators, and communication interfaces. The programmable I/O blocks support multiple voltage standards and signaling protocols.

Clock Management

Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide precise clock management, phase shifting, and frequency synthesis capabilities. These DLLs enable sophisticated timing control essential for high-speed digital designs and multi-clock domain systems.

Application Areas

Digital Signal Processing (DSP)

The XC2S200-6FGG950C excels in DSP applications including audio processing, image filtering, video codecs, and real-time signal analysis. The combination of logic cells, block RAM, and high-speed I/O makes it suitable for implementing FIR/IIR filters, FFT algorithms, and custom signal processing pipelines.

Communications Systems

This Spartan-II FPGA is widely deployed in telecommunications infrastructure, supporting protocol implementation, packet processing, data encoding/decoding, and channel coding applications. Its high I/O count enables multi-channel communication interfaces and high-bandwidth data transfers.

Industrial Control and Automation

In industrial environments, the XC2S200-6FGG950C facilitates motor control, process automation, machine vision, and real-time monitoring systems. The programmable nature allows rapid prototyping and field updates without hardware replacement.

Embedded Systems

The device serves as an excellent coprocessor or peripheral controller in embedded applications, handling specialized tasks such as custom interfaces, hardware acceleration, sensor fusion, and real-time data acquisition.

Medical Equipment

Medical imaging systems, diagnostic equipment, patient monitoring devices, and laboratory instrumentation benefit from the XC2S200-6FGG950C’s reliability, reconfigurability, and processing power.

Performance Characteristics

Speed Grade Analysis

The -6 speed grade designation on the XC2S200-6FGG950C indicates a balanced performance tier suitable for most commercial applications while maintaining excellent power efficiency characteristics.

Timing Performance

• Maximum Toggle Frequency: 263 MHz typical
• System Performance: Up to 263 MHz clock operation
• Propagation Delays: Optimized for -6 speed grade
• Setup/Hold Times: Specified for reliable synchronous designs

Design Tools and Programming

Development Environment

The XC2S200-6FGG950C is supported by AMD Xilinx’s comprehensive development toolchain:

• ISE Design Suite – Legacy tool for Spartan-II family development
• WebPACK – Free version for smaller devices
• ChipScope Pro – Real-time hardware debugging
• IMPACT – Device programming and configuration

Configuration Options

Reliability and Quality

Manufacturing Standards

Manufactured using advanced 0.18-micron CMOS technology, the XC2S200-6FGG950C undergoes rigorous testing to ensure compliance with AMD Xilinx’s stringent quality standards. Each device is tested for functionality, timing performance, and environmental reliability.

Environmental Compliance

• Lead-Free Options: Available with “G” designation (FGG950G)
• RoHS Compliant: Meets European environmental directives
• Halogen-Free: Options available for environmentally conscious applications

Competitive Advantages

vs. Traditional ASICs

Alternative FPGA Options

For design comparison, consider these related devices:

Implementation Considerations

Power Supply Requirements

Thermal Management

With a commercial temperature range specification, the XC2S200-6FGG950C operates reliably from 0°C to +85°C ambient temperature. Proper thermal design including adequate airflow, heat sinking (if required), and PCB thermal vias ensures optimal performance and longevity.

PCB Design Guidelines

• Ball Grid Array (BGA) Layout: Requires controlled impedance routing and proper via-in-pad techniques
• Power Distribution: Dedicated power planes with adequate decoupling capacitors
• Signal Integrity: Controlled impedance traces for high-speed signals
• Thermal Vias: Connect BGA thermal pad to ground plane for heat dissipation

Programming and Configuration

Configuration Memory

The XC2S200-6FGG950C requires external configuration memory to store the FPGA bitstream. Compatible configuration PROMs include:

• Xilinx Platform Flash PROMs (XCF series)
• Serial SPI Flash memory
• Parallel Flash/PROM devices

Configuration File Size

The configuration bitstream size for the XC2S200 is approximately 2,144,680 bits, requiring adequate storage capacity in your chosen configuration memory device.

Ordering Information

Part Number Breakdown

XC2S200-6FGG950C decoding:

• XC = Xilinx Commercial FPGA
• 2S = Spartan-II family
• 200 = 200,000 system gates
• -6 = Speed grade (-6 commercial)
• FGG = Fine-pitch BGA, Green (lead-free)
• 950 = 950-ball package
• C = Commercial temperature range (0°C to +85°C)

Package Variants

• XC2S200-6FG950C – Standard (leaded) version
• XC2S200-6FGG950C – Lead-free (RoHS) version with “G” designator

Support and Resources

Documentation

• DS001: Spartan-II Family Data Sheet – Complete specifications
• UG002: Spartan-II User Guide – Detailed architectural information
• XAPP: Application notes for specific design techniques
• Answer Records: Searchable knowledge base for design issues

Technical Support

AMD Xilinx provides comprehensive technical support through online resources, application engineers, and authorized distributors. Development kits and evaluation boards may be available to facilitate prototyping and design validation.

Frequently Asked Questions

What makes the XC2S200-6FGG950C suitable for my application?

The XC2S200-6FGG950C offers an excellent balance of logic capacity (200,000 gates), extensive I/O resources (284 pins), and proven reliability in industrial applications. Its high pin-count FGG950 package is ideal for designs requiring numerous external interfaces.

Is this FPGA still in production?

The Spartan-II family is a mature product line. Availability should be confirmed with authorized distributors. For new designs, consider current-generation Spartan families for long-term supply chain security.

What development tools do I need?

ISE Design Suite (version supporting Spartan-II) is required for VHDL/Verilog design entry, synthesis, implementation, and bitstream generation. Free WebPACK versions may support this device with certain limitations.

Can I migrate from smaller Spartan-II devices?

Yes, the Spartan-II family offers pin compatibility across certain package options, facilitating migration between XC2S100, XC2S150, XC2S200, and larger devices within the same package family.

What is the power consumption?

Typical power consumption varies with design utilization, clock frequency, and I/O activity. Refer to AMD Xilinx Power Estimator tools for accurate power analysis based on your specific design implementation.

Conclusion

The XC2S200-6FGG950C Spartan-II FPGA delivers a compelling combination of logic capacity, I/O flexibility, and proven reliability for professional digital design applications. With 200,000 system gates, 5,292 logic cells, and a high-density 950-ball package, this device provides the resources necessary for implementing sophisticated digital systems across industrial, communications, and embedded application domains.

Whether you’re developing signal processing algorithms, communication protocols, industrial control systems, or custom embedded solutions, the XC2S200-6FGG950C offers the programmable flexibility and performance characteristics required for successful implementation. Its cost-effective alternative to ASIC development, combined with field-upgrade capabilities, makes it an intelligent choice for products requiring adaptability and rapid time-to-market.

For sourcing authentic AMD Xilinx FPGAs and comprehensive technical support, contact authorized distributors and explore the extensive documentation available for the Spartan-II family.