Product Overview: AMD Xilinx XCV100E-6BG352C FPGA
The XCV100E-6BG352C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s renowned Virtex-E family. This sophisticated Xilinx FPGA delivers exceptional performance for demanding embedded applications, featuring 196 I/O pins in a compact 352-pin metal BGA package. Designed for engineers and developers seeking reliable, high-capacity programmable logic solutions, this FPGA combines advanced 0.18μm CMOS technology with versatile architecture to accelerate digital design projects.
Key Features and Specifications
Technical Specifications at a Glance
| Specification |
Details |
| Part Number |
XCV100E-6BG352C |
| Manufacturer |
AMD (formerly Xilinx Inc.) |
| Product Family |
Virtex-E Series |
| Logic Elements |
2,700 cells |
| Total Gates |
32,400 equivalent gates |
| System Gates |
128,236 gates |
| I/O Pins |
196 user I/O |
| Operating Voltage |
1.8V (1.71V – 1.89V) |
| Package Type |
352-LBGA (Ball Grid Array) |
| Package Dimensions |
Metal BGA with Exposed Pad |
| Pitch |
1.27mm |
| Technology |
0.18μm CMOS, 6-layer metal |
| Operating Temperature |
0°C to 85°C (Commercial) |
Advanced Architecture Components
| Component |
Specification |
| CLBs (Configurable Logic Blocks) |
600 CLBs |
| LABs/CLBs |
600 Logic Array Blocks |
| RAM Capacity |
10kB (81,920 RAM bits) |
| Maximum Frequency |
357 MHz |
| Mounting Type |
Surface Mount Technology (SMT) |
| Status |
Legacy/Obsolete (alternatives available) |
Why Choose the XCV100E-6BG352C FPGA?
Outstanding Performance Characteristics
The XCV100E-6BG352C Xilinx FPGA stands out in the embedded systems market due to its exceptional balance of performance and versatility. With 2,700 logic elements and 128,236 system gates, this device provides ample resources for complex digital designs, signal processing applications, and custom computing architectures.
Energy-Efficient Design
Operating at a nominal 1.8V supply voltage, the XCV100E-6BG352C delivers impressive power efficiency. The low-voltage operation makes it ideal for battery-powered applications and heat-sensitive environments where thermal management is critical.
Robust I/O Capabilities
With 196 dedicated I/O pins, this FPGA offers extensive connectivity options for interfacing with various peripherals, sensors, communication protocols, and memory devices. The generous I/O count enables complex multi-interface designs without external expansion.
Application Areas and Use Cases
Industrial Applications
| Application |
Benefits |
| Motor Control |
Real-time processing with 357 MHz operation |
| Industrial Automation |
Reliable performance in 0°C to 85°C range |
| Machine Vision |
High-speed data processing capabilities |
| PLC Systems |
Flexible logic implementation |
Communications and Networking
- Protocol Bridging: Implement custom communication protocols
- Data Acquisition Systems: High-speed sampling and processing
- Network Interface Cards: Flexible packet processing
- Signal Processing: DSP functions with dedicated hardware
Embedded Computing
- Custom Processors: Soft-core CPU implementations
- Hardware Acceleration: Offload intensive computations
- Real-Time Systems: Deterministic timing performance
- Prototyping Platforms: ASIC verification and testing
Technical Deep Dive: Virtex-E Architecture
Configurable Logic Block (CLB) Structure
The XCV100E-6BG352C features 600 CLBs that form the fundamental building blocks of the FPGA. Each CLB contains multiple logic cells optimized for both combinational and sequential logic implementation, providing maximum design flexibility.
Memory Resources
The integrated 10kB RAM (81,920 bits) can be configured as:
- Distributed RAM for small, fast storage
- Block RAM for larger data buffers
- FIFO implementations
- Lookup tables for complex functions
Clock and Timing Performance
Operating at speeds up to 357 MHz, this FPGA supports:
- Multiple clock domains
- Global and regional clock distribution
- Dedicated clock management resources
- Low-skew clock networks
Package and Physical Characteristics
352-LBGA Package Details
| Feature |
Specification |
| Package Style |
Low-Profile Ball Grid Array |
| Total Pins |
352 balls |
| Ball Pitch |
1.27mm |
| Package Material |
Metal with exposed thermal pad |
| Mounting |
Surface Mount (Reflow soldering) |
| Height |
1.7mm (Low-profile design) |
Thermal Considerations
The metal BGA package with exposed pad provides excellent thermal performance:
- Enhanced heat dissipation to PCB
- Lower junction temperatures
- Improved reliability in demanding environments
- Reduced need for active cooling in many applications
Design Tools and Development Support
Compatible Development Environments
Engineers working with the XCV100E-6BG352C FPGA can leverage:
- Xilinx ISE Design Suite: Legacy toolchain optimized for Virtex-E devices
- Vivado Design Suite: Modern development environment (check compatibility)
- Third-party Tools: Support for various HDL simulation and synthesis tools
Programming Languages Supported
- VHDL: Industry-standard hardware description language
- Verilog: Popular alternative HDL
- SystemVerilog: Advanced verification capabilities
- Schematic Entry: Visual design approach
Ordering and Availability Information
Part Number Breakdown
XCV100E-6BG352C decodes as:
- XC: Xilinx commercial grade
- V100E: Virtex-E, 100,000 system gates
- -6: Speed grade (performance level)
- BG352: Ball Grid Array, 352 pins
- C: Commercial temperature range (0°C to 85°C)
Procurement Considerations
| Factor |
Information |
| Product Status |
Legacy/Obsolete product |
| Availability |
Available through distributors and aftermarket suppliers |
| Lead Time |
Typically 9-24 weeks (varies by supplier) |
| Minimum Order |
Contact supplier for current MOQ |
| Package Quantity |
Typically tray packaging |
Alternatives and Successor Products
While the XCV100E-6BG352C is a legacy product, AMD Xilinx offers modern alternatives with enhanced performance:
Recommended Modern Equivalents
- Spartan-7 Series: Cost-effective, low-power alternatives
- Artix-7 Series: High-performance, cost-optimized FPGAs
- Kintex-7 Series: Mid-range performance and capacity
Quality and Reliability Standards
Manufacturing Quality
The XCV100E-6BG352C Xilinx FPGA is manufactured to stringent quality standards:
- ISO 9001 certified production
- Automotive-grade processes available
- Extended temperature range variants
- RoHS compliant options
Testing and Validation
Each device undergoes comprehensive testing:
- 100% functional testing
- Parametric characterization
- Burn-in testing (for critical applications)
- Quality lot sampling
Integration Guidelines for Engineers
PCB Design Recommendations
| Design Aspect |
Recommendation |
| Power Supply |
Dedicated 1.8V rail with low-noise regulation |
| Decoupling |
Multiple bypass capacitors (0.1μF, 0.01μF) per power pin |
| Ground Plane |
Solid ground plane for signal integrity |
| Thermal Management |
Thermal vias under exposed pad |
| Signal Routing |
Controlled impedance for high-speed signals |
Configuration and Programming
The FPGA supports multiple configuration modes:
- JTAG boundary scan
- Master/Slave serial configuration
- SelectMAP parallel configuration
- Configuration from external PROM
Performance Optimization Tips
Maximizing System Performance
- Clock Domain Management: Use proper clock crossing techniques
- Resource Utilization: Balance logic, RAM, and I/O resources
- Pipeline Design: Implement multi-stage pipelines for high throughput
- Constraint Definition: Apply accurate timing constraints
Power Optimization Strategies
- Enable clock gating for unused modules
- Use block RAM instead of distributed RAM where appropriate
- Optimize I/O standards for power efficiency
- Implement dynamic power management
Compliance and Environmental Standards
Regulatory Compliance
| Standard |
Status |
| RoHS |
Compliant versions available |
| REACH |
Compliant |
| CE |
Meets requirements |
| FCC |
Class B emission levels |
Frequently Asked Questions
Is the XCV100E-6BG352C still in production?
The XCV100E-6BG352C is considered an obsolete/legacy product. However, it remains available through authorized distributors and specialty suppliers who maintain inventory for long-lifecycle applications.
What is the difference between speed grades?
The “-6” speed grade indicates the device’s performance level. Higher numbers (e.g., -7, -8) represent faster devices with better timing characteristics, while lower numbers indicate standard performance.
Can this FPGA be used in automotive applications?
The commercial-grade version operates from 0°C to 85°C. For automotive applications requiring extended temperature ranges (-40°C to 125°C), consult AMD Xilinx for appropriate alternatives.
What development boards support this FPGA?
While dedicated development boards for the XCV100E-6BG352C may be limited due to its legacy status, custom evaluation boards can be designed, or users can explore compatible Virtex-E family development platforms.
Summary: XCV100E-6BG352C FPGA Excellence
The XCV100E-6BG352C represents proven Xilinx FPGA technology, offering 196 I/O pins, 2,700 logic cells, and robust performance in a compact 352-pin BGA package. While classified as a legacy product, it continues to serve critical applications where its specific characteristics—1.8V operation, 357 MHz performance, and 10kB RAM—provide the ideal solution.
For engineers maintaining existing designs or requiring this specific device architecture, the XCV100E-6BG352C delivers reliable field-programmable gate array functionality backed by decades of proven Virtex-E technology. Those beginning new projects should consult the latest Xilinx FPGA offerings to leverage modern features and enhanced performance capabilities.
Technical Support and Resources
Engineers requiring additional technical documentation, application notes, or design support for the XCV100E-6BG352C can access:
- Official AMD Xilinx documentation archives
- Community forums and user groups
- Third-party technical consultants specializing in legacy FPGA designs
- Authorized distribution partners with technical expertise
