Overview of XC2S200-6FGG946C Field Programmable Gate Array
The XC2S200-6FGG946C is a premium field programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, offering exceptional performance and versatility in a robust 946-pin fine-pitch ball grid array package. This advanced FPGA solution delivers 200,000 system gates and 5,292 logic cells, making it an ideal choice for complex digital design applications requiring high-density programmable logic and superior I/O capabilities.
As part of the industry-leading Spartan-II series, the XC2S200-6FGG946C represents the perfect balance between cost-effectiveness and performance, providing engineers with a powerful platform for implementing sophisticated digital circuits across telecommunications, industrial automation, medical devices, and embedded systems.
Key Specifications and Technical Features
Core Performance Specifications
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array Configuration |
28 x 42 (1,176 total CLBs) |
| Maximum Operating Frequency |
263 MHz |
| Speed Grade |
-6 (Commercial) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Temperature Range |
Commercial (0°C to +85°C) |
Memory Architecture and Resources
| Memory Type |
Capacity |
| Total Block RAM |
56 Kbits (7 KB) |
| Distributed RAM |
75,264 bits |
| RAM Blocks |
14 blocks |
| Block RAM Configuration |
Dual-port, synchronous |
Package and Pin Configuration
| Package Feature |
Specification |
| Package Type |
FGG946 (Fine-Pitch Ball Grid Array) |
| Total Pin Count |
946 pins |
| Maximum User I/O |
284 pins |
| Ball Pitch |
Fine-pitch for high-density designs |
| Package Designation |
Pb-free (indicated by “G” in FGG946) |
| Footprint Compatibility |
Optimized for high I/O applications |
Advanced FPGA Architecture and Design Capabilities
Configurable Logic Block (CLB) Structure
The XC2S200-6FGG946C features a sophisticated CLB architecture organized in a 28 x 42 matrix, providing 1,176 configurable logic blocks. Each CLB contains:
- Four logic slices with lookup tables (LUTs)
- Fast carry logic for arithmetic operations
- Distributed RAM capability for embedded memory
- Dedicated multiplexers for efficient routing
- Flexible interconnect resources
This architecture enables designers to implement complex Boolean functions, arithmetic circuits, state machines, and custom logic with exceptional efficiency.
Input/Output Block (IOB) Capabilities
With 284 maximum user I/O pins, the FGG946 package variant offers the highest I/O density in the XC2S200 family. Key I/O features include:
- Support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+)
- Programmable drive strength and slew rate control
- Individual pin configuration for input, output, or bidirectional operation
- On-chip termination options
- Hot-swappable I/O support
Memory Subsystem Design
The dual-column block RAM architecture provides 56 Kbits of high-speed embedded memory, ideal for:
- Data buffering and FIFO implementations
- Look-up table storage
- Microprocessor code storage
- Video frame buffers
- Communication protocol packet buffering
Performance Advantages of Speed Grade -6
The -6 speed grade designation indicates this device’s optimized performance characteristics:
- Faster propagation delays through logic elements
- Reduced setup and hold times for sequential circuits
- Higher maximum operating frequencies up to 263 MHz
- Enhanced timing margins for critical path designs
- Improved system-level performance in demanding applications
This speed grade makes the XC2S200-6FGG946C particularly suitable for high-speed digital signal processing, real-time control systems, and communication protocols requiring tight timing constraints.
Target Applications and Use Cases
Telecommunications and Networking Equipment
The XC2S200-6FGG946C excels in telecommunications applications, including:
- Protocol converters and bridges
- Network routers and switches
- Base station signal processing
- SDH/SONET equipment
- VoIP gateways
Industrial Automation and Control Systems
Industrial applications benefit from the device’s reliability and flexibility:
- Programmable logic controllers (PLCs)
- Motor control and drive systems
- Factory automation interfaces
- Process control instrumentation
- Robotic control systems
Medical and Healthcare Electronics
Healthcare applications leverage the FPGA’s precision and reconfigurability:
- Medical imaging systems (ultrasound, X-ray processing)
- Patient monitoring equipment
- Diagnostic instrumentation
- Laboratory analysis devices
- Portable medical devices
Automotive and Transportation Systems
Automotive designers utilize this FPGA for:
- Advanced driver assistance systems (ADAS)
- Infotainment system controllers
- Engine control units (ECU) interfaces
- Dashboard display processors
- Vehicle communication networks
Consumer Electronics and Multimedia
Consumer applications include:
- High-definition video processing
- Audio DSP systems
- Gaming console peripherals
- Set-top box controllers
- Digital camera image processors
Development Tools and Design Support
Xilinx ISE Design Suite Compatibility
The XC2S200-6FGG946C is fully supported by Xilinx ISE (Integrated Software Environment), providing:
- Comprehensive HDL synthesis tools (VHDL, Verilog)
- Advanced place-and-route optimization
- Timing analysis and constraint management
- Power estimation utilities
- In-system debugging capabilities
Programming and Configuration Options
Multiple configuration methods ensure design flexibility:
- JTAG boundary-scan programming
- Master/Slave serial configuration
- SelectMAP parallel configuration
- MultiBoot capability for design updates
- Configuration memory options (PROM, Flash)
Comparison with Other Package Variants
XC2S200 Package Options Comparison
| Package |
Pin Count |
User I/O |
Best For |
| PQ208 |
208 |
140 |
Space-constrained designs |
| FG256 |
256 |
176 |
General-purpose applications |
| FGG946 |
946 |
284 |
Maximum I/O requirements |
The FGG946 package provides the highest pin count and I/O availability, making it the premium choice for applications requiring extensive external connectivity, multiple communication interfaces, or complex sensor arrays.
Power Consumption and Thermal Management
Power Supply Requirements
| Supply Rail |
Voltage |
Function |
| VCCINT |
2.5V ± 5% |
Core logic power |
| VCCO |
1.5V – 3.3V |
I/O bank power (programmable) |
| VCCAUX |
2.5V ± 5% |
DLL and auxiliary circuits |
Power Optimization Features
The XC2S200-6FGG946C includes several power management capabilities:
- Clock gating for unused logic blocks
- I/O buffer power-down modes
- Programmable slew rate control to reduce current spikes
- Low-power CMOS process technology
- Optional unused pin termination
Quality and Reliability Standards
Manufacturing and Compliance
- RoHS Compliance: The “G” designation indicates lead-free, RoHS-compliant packaging
- Process Node: Advanced 0.18μm CMOS technology
- Quality Standards: Automotive and industrial-grade quality control
- Temperature Testing: Comprehensive thermal characterization
- ESD Protection: Built-in electrostatic discharge protection on all I/O pins
Long-Term Availability
As part of the established Spartan-II family, the XC2S200-6FGG946C benefits from:
- Stable production and supply chain
- Extensive application notes and reference designs
- Mature development tools and IP cores
- Strong community support and knowledge base
Design Considerations and Best Practices
PCB Layout Recommendations
When designing with the FGG946 package:
- Use minimum 6-layer PCBs for proper power distribution
- Implement dedicated power and ground planes
- Follow Xilinx PCB design guidelines for signal integrity
- Consider ball grid array escape routing strategies
- Provide adequate thermal vias for heat dissipation
Signal Integrity Guidelines
- Match impedance for high-speed signals
- Minimize trace lengths for critical paths
- Use differential signaling for noise immunity
- Implement proper termination for transmission lines
- Consider crosstalk between adjacent I/O pins
Purchasing and Ordering Information
Part Number Breakdown
XC2S200-6FGG946C
- XC2S200: Device family and gate count (200K gates)
- -6: Speed grade (highest commercial performance)
- FGG946: Package type and pin count
- C: Commercial temperature range (0°C to +85°C)
Where to Buy Authentic Xilinx FPGA
For authentic XC2S200-6FGG946C devices and other Xilinx FPGA solutions, work with authorized distributors to ensure genuine components, proper handling, and manufacturer warranty coverage. Bulk pricing and volume discounts are typically available for production quantities.
Frequently Asked Questions (FAQ)
Q: What makes the FGG946 package different from other XC2S200 variants?
The FGG946 package offers the maximum pin count (946 pins) and highest user I/O availability (284 pins) in the XC2S200 family, making it ideal for applications requiring extensive external connectivity and complex interfacing requirements.
Q: Can the XC2S200-6FGG946C be reconfigured in the field?
Yes, one of the key advantages of FPGA technology is field programmability. The device can be reconfigured multiple times without hardware replacement, enabling design updates, bug fixes, and feature enhancements throughout the product lifecycle.
Q: What development tools are required?
The primary development tool is Xilinx ISE Design Suite, which includes synthesis, implementation, and programming utilities. Additional tools like ModelSim or Xilinx ISim can be used for HDL simulation and verification.
Q: Is this device suitable for new designs?
While the Spartan-II family is a mature product line, it remains a cost-effective solution for many applications. For new high-performance designs, consider evaluating newer Xilinx FPGA families (Spartan-6, Spartan-7, or Artix-7) that offer enhanced features and performance.
Q: What is the typical lead time for ordering?
Lead times vary by distributor and order quantity. Standard commercial availability typically ranges from immediate stock to 8-12 weeks for large volume orders. Contact authorized distributors for current availability.
Conclusion: Why Choose XC2S200-6FGG946C
The XC2S200-6FGG946C represents a mature, reliable, and cost-effective FPGA solution for applications demanding high I/O density, robust performance, and flexible programmability. With its 946-pin BGA package, 284 user I/O pins, 200,000 system gates, and -6 speed grade performance, this device delivers exceptional value for telecommunications, industrial control, medical instrumentation, and embedded computing applications.
Whether you’re designing network infrastructure equipment, industrial automation systems, or sophisticated embedded platforms, the XC2S200-6FGG946C provides the logic resources, memory capacity, and connectivity options needed to bring your digital designs to life. Its proven track record, comprehensive development tool support, and availability from authorized distributors make it a dependable choice for both prototype development and volume production.
For engineers seeking maximum I/O flexibility within the Spartan-II family, the XC2S200-6FGG946C stands as the premium package option, delivering unmatched pin count and connectivity in a robust, industry-standard ball grid array format.
