Overview of XC2S200-6FGG945C Field Programmable Gate Array

The XC2S200-6FGG945C represents a premium configuration within the Spartan-II FPGA family, delivering exceptional programmable logic capabilities for demanding embedded system applications. This advanced field programmable gate array combines robust performance with extensive I/O resources in a high-density 945-ball fine-pitch BGA package, making it an ideal choice for complex digital design implementations.

As part of the proven Spartan-II series, the XC2S200-6FGG945C offers designers a cost-effective alternative to traditional ASICs while maintaining the flexibility of in-field reconfiguration. This Xilinx FPGA solution eliminates lengthy development cycles and high initial costs associated with mask-programmed devices.

Key Specifications and Technical Features

Core Performance Characteristics

Advanced Architecture Components

The XC2S200-6FGG945C incorporates sophisticated design elements that set it apart in the programmable logic marketplace:

Configurable Logic Blocks (CLBs): The device features 1,176 CLBs arranged in a 28×42 matrix, providing extensive logic resources for implementing complex Boolean functions, arithmetic operations, and data storage functions.

Delay-Locked Loops (DLLs): Four precision DLLs positioned at each corner of the die enable advanced clock management, including clock de-skewing, frequency multiplication, and phase shifting capabilities.

Flexible I/O Architecture: With 284 maximum available user I/O pins, the XC2S200-6FGG945C supports up to 16 selectable I/O standards, ensuring compatibility with various voltage levels and signaling protocols.

Package Configuration and Pinout Details

FGG945 Package Advantages

The 945-ball FGG package provides:

• Maximum I/O accessibility for complex routing requirements
• Enhanced thermal dissipation characteristics
• Improved signal integrity through optimized ball placement
• Compact footprint despite high pin count

Memory Architecture and Resources

Dual Memory System

The XC2S200-6FGG945C implements a versatile dual-memory architecture optimizing both performance and flexibility:

Distributed RAM Configuration:

• Total capacity: 75,264 bits
• Integrated within CLB structure
• Ideal for small, fast-access memory requirements
• Supports synchronous and asynchronous operations

Block RAM Configuration:

• Total capacity: 56 Kbits
• Organized in dedicated columns
• True dual-port capability
• Optimized for larger data buffers and FIFO implementations

Performance Specifications

Speed Grade -6 Characteristics

The -6 speed grade represents the highest performance tier within the Spartan-II family, ensuring:

• Minimum propagation delays
• Maximum operating frequencies
• Optimized timing closure
• Consistent performance across design iterations

Application Areas and Use Cases

Industrial and Commercial Applications

The XC2S200-6FGG945C excels in numerous application domains:

Digital Signal Processing: High-speed data filtering, image processing, and signal conditioning applications benefit from the substantial logic resources and dedicated memory blocks.

Communications Systems: Protocol implementation, data encryption/decryption, and baseband processing leverage the flexible I/O standards and high-speed performance.

Control Systems: Industrial automation, motor control, and process monitoring applications utilize the robust architecture and reliable operation.

Instrumentation: Test equipment, measurement devices, and data acquisition systems take advantage of the precise timing control and extensive I/O capabilities.

Embedded Computing: Custom processor implementations, co-processing acceleration, and peripheral interface controllers capitalize on the programmable fabric.

Design Development and Tool Support

Development Environment

Implementation Workflow

The XC2S200-6FGG945C supports a streamlined design flow:

• HDL entry (VHDL/Verilog)
• Behavioral simulation
• Synthesis optimization
• Place and route
• Timing verification
• Bitstream generation

Power Management Features

Optimized Power Consumption

The device implements several power-saving mechanisms:

• Core voltage operation at 2.5V
• Selective I/O standard usage
• Clock gating capabilities
• DLL power-down modes
• Unused logic power reduction

Reliability and Quality Standards

Manufacturing Excellence

Ordering Information and Part Number Breakdown

Part Number Decoding: XC2S200-6FGG945C

• XC2S200: Device family and gate count
• 6: Speed grade (highest performance)
• FGG: Fine-pitch Grid array package
• 945: Ball count (945 pins)
• C: Commercial temperature range

Comparison with Alternative Configurations

XC2S200 Family Variants

Migration and Upgrade Path

Designers working with the XC2S200-6FGG945C can consider these migration options:

Within Spartan-II Family: Scale to XC2S150 (reduced resources) or maintain XC2S200 density with different package options.

To Newer Families: Spartan-3, Spartan-6, or current Spartan-7 families offer enhanced performance and additional features while maintaining similar development methodologies.

Technical Support and Resources

Available Documentation

Engineers implementing the XC2S200-6FGG945C have access to comprehensive technical resources including detailed datasheets, application notes, reference designs, and design constraint files. The extensive documentation ecosystem ensures successful project completion.

Conclusion

The XC2S200-6FGG945C stands as a powerful FPGA solution combining substantial logic resources, high-speed performance, and extensive I/O capabilities. With 5,292 logic cells, 200,000 system gates, and 945-ball packaging, this device addresses demanding applications requiring maximum programmable logic density. The -6 speed grade ensures premium performance, while the Spartan-II architecture provides proven reliability for industrial and commercial deployment scenarios.