Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV300E-6PQ240C: High-Performance Virtex-E FPGA for Advanced Digital Design

Product Details

Overview of the XCV300E-6PQ240C Field Programmable Gate Array

The XCV300E-6PQ240C is a premium field-programmable gate array (FPGA) from AMD Xilinx’s Virtex-E family, engineered to deliver exceptional performance for complex digital system implementations. This advanced FPGA combines high-speed processing capabilities with flexible programmability, making it an ideal solution for engineers and designers working on demanding applications in telecommunications, embedded systems, and digital signal processing.

Originally manufactured by Xilinx (now part of AMD), this FPGA represents cutting-edge programmable logic technology utilizing 0.18μm CMOS process technology with six metal layers, offering a powerful alternative to traditional mask-programmed gate arrays.

Key Technical Specifications

Parameter Specification
Part Number XCV300E-6PQ240C
Manufacturer AMD (formerly Xilinx Inc.)
Product Family Virtex-E 1.8V FPGAs
System Gates 300,000 gates
Logic Cells 6,912 configurable logic cells
Total RAM Bits 131,072 bits
Number of CLBs 1,536 Configurable Logic Blocks
I/O Pins 158 user I/O
Package Type 240-Pin BFQFP (Bump Fine-Pitch Quad Flat Pack)
Operating Voltage 1.71V to 1.89V (1.8V nominal)
Speed Grade -6 (6ns pin-to-pin delay)
Maximum Frequency 357 MHz
Process Technology 0.18μm CMOS, 6-layer metal
Mounting Type Surface Mount
Operating Temperature Commercial or Industrial range
Package Dimensions 240-HSPQFP EP (Heat Spreader Plastic Quad Flat Pack, Exposed Pad)

Advanced Features and Architecture

High-Density Programmable Logic

The XCV300E-6PQ240C FPGA features 82,944K equivalent gates through its 6,912 logic cells, providing substantial resources for implementing sophisticated digital designs. Each configurable logic block (CLB) contains multiple lookup tables (LUTs), flip-flops, and multiplexers that can be programmed to perform complex Boolean functions.

Memory Resources

Memory Type Capacity
Block RAM 131,072 bits total
Distributed RAM Available in CLBs
Configuration Memory SRAM-based

The integrated block RAM provides efficient on-chip memory storage for data buffers, FIFOs, and lookup tables, reducing the need for external memory components in many applications.

High-Speed Interconnect Architecture

The Virtex-E architecture employs a hierarchical routing structure with multiple interconnect levels:

  • Local routing for intra-CLB connections
  • General routing matrix for chip-wide connectivity
  • Dedicated routing for high-fanout signals like clocks and resets
  • Long-line routing for high-speed, cross-chip signal distribution

This advanced interconnect architecture ensures minimal signal delay and maximum routing efficiency, enabling the 357 MHz maximum operating frequency.

Clock Management

The XCV300E-6PQ240C includes sophisticated clock distribution networks:

  • Multiple global clock buffers
  • Digital Clock Managers (DCMs) for clock synthesis and deskewing
  • Low-skew clock distribution trees
  • Support for multiple independent clock domains

Performance Characteristics

Speed Grade Analysis

Speed Grade Pin-to-Pin Delay Maximum Frequency Typical Applications
-6 6 ns 357 MHz High-performance systems
-7 7 ns ~400 MHz Ultra-high-speed designs
-4/-5 Slower Lower Cost-optimized solutions

The -6 speed grade of this particular device offers an excellent balance between performance and power consumption, suitable for most commercial and industrial applications.

Power Consumption Profile

The 1.8V core voltage architecture provides:

  • Lower power consumption compared to older 2.5V/3.3V FPGA families
  • Reduced heat generation for improved system reliability
  • Compatibility with modern low-voltage digital systems
  • Enhanced battery life in portable applications

Package Details: 240-BFQFP

Package Features

Attribute Details
Pin Count 240 pins
Package Type BFQFP (Bump Fine-pitch Quad Flat Pack)
Pitch Fine-pitch for high-density PCB layouts
Exposed Pad Yes (for enhanced thermal dissipation)
Mounting Surface mount technology (SMT)
Lead-Free Status Contains lead (legacy product)
RoHS Compliance RoHS non-compliant (older generation)

Thermal Considerations

The exposed pad on the package bottom facilitates efficient heat transfer to the PCB and heatsink, critical for maintaining optimal operating temperatures in high-performance applications.

Primary Application Areas

Digital Signal Processing (DSP)

The XCV300E-6PQ240C excels in DSP applications requiring:

  • High-speed data processing
  • Real-time filtering and transformation
  • Adaptive algorithms
  • Multi-channel processing
  • Spectrum analysis

Embedded System Design

Ideal for embedded systems featuring:

  • Custom processor implementations
  • Hardware acceleration engines
  • Protocol converters
  • Interface bridging
  • System-on-Chip (SoC) prototyping

Communications Infrastructure

Perfect for telecommunications equipment including:

  • Data packet processing
  • Protocol handling (Ethernet, USB, PCI)
  • Wireless baseband processing
  • Network switching and routing
  • Error correction coding

Industrial Control Systems

Deployed in industrial automation for:

  • Motor control algorithms
  • Real-time monitoring systems
  • Machine vision processing
  • Sensor data acquisition
  • Programmable logic controllers (PLCs)

Design and Development Ecosystem

Compatible Development Tools

Tool Category Software
Design Entry Xilinx ISE Design Suite
Synthesis XST (Xilinx Synthesis Technology)
Simulation ModelSim, ISim
Place & Route Xilinx PAR
Programming iMPACT, ChipScope Pro
Languages VHDL, Verilog, SystemVerilog

Configuration Options

The FPGA supports multiple configuration modes:

  • Master Serial mode
  • Slave Serial mode
  • SelectMAP mode (parallel configuration)
  • JTAG boundary scan mode
  • Master/Slave Serial chaining for multi-FPGA systems

Competitive Advantages

Why Choose the XCV300E-6PQ240C?

  1. Proven Architecture: Mature Virtex-E platform with extensive design resources and application notes
  2. Optimal Resource Density: 300K gates provide substantial logic without excessive power consumption
  3. High Performance: 357 MHz operation suitable for most real-time applications
  4. Flexible I/O: 158 configurable I/O pins support various interface standards
  5. Cost-Effective: Competitive pricing for the performance level delivered
  6. Industry Standard: Wide acceptance in legacy and maintenance applications

Comparison with Alternative Devices

XCV300E-6PQ240C vs. Related Xilinx FPGAs

Part Number System Gates Logic Cells I/O Pins Package Key Difference
XCV300E-6PQ240C 300K 6,912 158 240-BFQFP Baseline model
XCV300E-6FG456C 300K 6,912 312 456-FBGA More I/O pins
XCV300E-6BG352C 300K 6,912 260 352-BGA Larger BGA package
XCV300E-6FG256C 300K 6,912 176 256-FBGA Smaller footprint

Programming and Configuration

Configuration Process

The SRAM-based configuration architecture requires:

  1. External configuration memory (PROM, Flash, or microcontroller)
  2. Power-up configuration on every system boot
  3. Bitstream loading via selected configuration mode
  4. Verification through readback capabilities

Bitstream Security

  • Optional bitstream encryption
  • Readback protection features
  • IP protection mechanisms
  • Design security options

Quality and Reliability

Manufacturing Standards

Quality Metric Specification
Process Node 0.18μm CMOS
Metal Layers 6 layers
ESD Protection Built-in protection circuitry
MTBF High reliability for industrial use
Quality Grade Commercial/Industrial

Environmental Compliance

Note: As a legacy product, the XCV300E-6PQ240C:

  • Contains lead in solder balls/connections
  • Is RoHS non-compliant
  • May require exemptions for certain applications
  • Suitable for industrial/legacy system maintenance

PCB Design Considerations

Layout Guidelines

When designing with the XCV300E-6PQ240C:

  • Power plane integrity: Separate analog and digital power planes
  • Decoupling capacitors: Place close to power pins (100nF + 10μF recommended)
  • Signal routing: Use controlled impedance for high-speed signals
  • Thermal management: Ensure adequate thermal vias under exposed pad
  • Clock routing: Minimize skew and use differential pairs where appropriate

Power Supply Requirements

Power Rail Voltage Purpose
VCCINT 1.8V ±5% Core logic power
VCCIO 1.8V to 3.3V I/O bank power (configurable)
GND 0V Ground reference

Purchasing and Availability

Current Product Status

Note: The XCV300E-6PQ240C is classified as an obsolete/not recommended for new designs product by AMD Xilinx. However, it remains available through:

  • Authorized distributors (limited stock)
  • Electronic component brokers
  • Surplus and excess inventory channels
  • Aftermarket suppliers

Finding Reliable Suppliers

When sourcing the XCV300E-6PQ240C:

  1. Verify authenticity through authorized channels
  2. Check date codes to ensure fresh stock
  3. Request certificates of conformance
  4. Confirm ESD handling procedures
  5. Validate storage conditions

Migration and Replacement Options

Modern Alternatives

For new designs, consider these current-generation replacements:

  • Artix-7 FPGAs: Similar logic density with lower power
  • Spartan-7 FPGAs: Cost-optimized alternatives
  • Zynq-7000 SoCs: FPGA + ARM processor combinations

Xilinx FPGA Product Families

Explore the complete range of Xilinx FPGA solutions for modern designs, including the latest 7-series, UltraScale, and UltraScale+ architectures that offer significantly enhanced performance, lower power consumption, and advanced features compared to legacy Virtex-E devices.

Technical Support Resources

Documentation

  • Datasheet: Detailed electrical and timing specifications
  • User Guide: Architecture and configuration details
  • Application Notes: Design implementation examples
  • Errata: Known issues and workarounds
  • PCN Notifications: Product change notices

Design Support

Access comprehensive support through:

  • AMD Xilinx technical forums
  • Application engineering support
  • Third-party FPGA design consultants
  • University FPGA research groups
  • Online FPGA communities

Conclusion

The XCV300E-6PQ240C represents a mature, well-understood FPGA solution ideal for maintaining existing designs and legacy system support. With 300,000 system gates, 158 I/O pins, and 357 MHz performance in a compact 240-pin BFQFP package, this Virtex-E device continues to serve applications where proven reliability and established design flows are paramount.

While classified as not recommended for new designs, the XCV300E-6PQ240C remains a viable choice for:

  • Product lifecycle extension of existing platforms
  • Repair and maintenance of fielded systems
  • Cost-sensitive upgrades where redesign is impractical
  • Prototype development with readily available tools

For cutting-edge applications demanding the latest technology, evaluate modern Xilinx FPGA families that provide superior performance, power efficiency, and integration capabilities while maintaining compatibility with contemporary design tools and methodologies.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.