Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV300E-7PQ240C: High-Performance Virtex-E FPGA for Advanced Digital Design

Product Details

Overview of the XCV300E-7PQ240C FPGA

The XCV300E-7PQ240C is a powerful field-programmable gate array (FPGA) from AMD’s Virtex-E family, designed to deliver exceptional performance for complex digital system applications. This advanced programmable logic device offers 300,000 system gates with a 7ns speed grade in a compact 240-pin PQFP package, making it an ideal solution for telecommunications, data processing, and industrial control applications.

As part of the industry-leading Virtex-E series, the XCV300E-7PQ240C combines high logic density, fast performance, and flexible I/O capabilities to meet the demanding requirements of modern digital designs. Whether you’re developing high-speed communication systems or implementing complex digital signal processing algorithms, this Xilinx FPGA delivers the performance and reliability you need.

Key Features and Specifications

Core Technical Specifications

Specification Value
Part Number XCV300E-7PQ240C
Manufacturer AMD (Xilinx)
Product Family Virtex-E
System Gates 300,000
Logic Cells/Elements 6,912
CLBs (Configurable Logic Blocks) 432
Speed Grade -7 (7ns)
Package Type PQFP (Plastic Quad Flat Pack)
Pin Count 240
Operating Temperature Commercial (0°C to +85°C)
Supply Voltage 1.8V Core, 3.3V I/O

Memory and Processing Capabilities

Feature Specification
Total Block RAM 65,536 bits
Block RAM Blocks 16
Distributed RAM Available through LUTs
Maximum User I/O 166
Differential I/O Pairs Up to 83 pairs

Performance Characteristics

Speed and Timing Performance

The XCV300E-7PQ240C features a -7 speed grade, representing one of the fastest options in the Virtex-E family. This speed grade ensures minimal propagation delays and maximum system clock frequencies, making it suitable for high-speed digital applications including:

  • High-bandwidth data processing systems
  • Fast digital signal processing implementations
  • Time-critical control applications
  • High-speed communication interfaces

Power Consumption Profile

Power Metric Typical Value
Core Voltage 1.8V
I/O Voltage 3.3V (5V tolerant)
Standby Power Low (design-dependent)
Dynamic Power Application-dependent

Architecture and Design Resources

Configurable Logic Block Architecture

The XCV300E-7PQ240C contains 432 CLBs organized in a grid array, with each CLB containing four slices. This architecture provides exceptional flexibility for implementing complex combinational and sequential logic functions. The device supports various design methodologies including:

  • Combinational logic implementation
  • Sequential state machine design
  • Arithmetic functions and DSP operations
  • Memory implementation using distributed RAM
  • Pipeline register insertion for high-speed operation

I/O Capabilities and Standards

I/O Feature Capability
Total I/O Banks 8
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL, SSTL, HSTL
Differential Standards LVDS, LVPECL, BLVDS
I/O Voltage Range 1.5V to 3.3V
Drive Strength Programmable (2mA to 24mA)
Slew Rate Control Fast and Slow options

Package Information: 240-Pin PQFP

Physical Dimensions and Layout

The PQFP package offers several advantages for PCB design and manufacturing:

Package Parameter Specification
Package Type Plastic Quad Flat Pack
Pin Count 240
Body Size 32mm x 32mm (nominal)
Pin Pitch 0.5mm
Height 3.4mm (max)
Mounting Type Surface Mount

Thermal Management Specifications

Thermal Characteristic Value
Junction Temperature (Max) 125°C
Theta JA (Still Air) 35°C/W (typical)
Theta JC (Case) 10°C/W (typical)
Power Dissipation Design and application dependent

Applications and Use Cases

Primary Application Domains

The XCV300E-7PQ240C excels in multiple application areas:

Telecommunications Equipment

  • Protocol conversion and bridging
  • Channel coding and error correction
  • Digital filtering and signal conditioning
  • Network packet processing

Industrial Control Systems

  • Motion control algorithms
  • Real-time monitoring systems
  • Factory automation controllers
  • Process control interfaces

Data Acquisition and Processing

  • High-speed data capture
  • Real-time signal analysis
  • Sensor interface controllers
  • Measurement instrumentation

Embedded Systems

  • Custom processor implementations
  • Hardware accelerators
  • System-on-chip (SoC) prototyping
  • Custom peripheral controllers

Design Development and Tools

Supported Development Tools

Tool Category Compatible Software
Synthesis Vivado Design Suite, ISE Design Suite
Simulation ModelSim, Vivado Simulator, ISIM
Place & Route Vivado Implementation, ISE PAR
Programming Vivado Hardware Manager, iMPACT
Debug ChipScope Pro, Vivado Logic Analyzer

Configuration and Programming

The XCV300E-7PQ240C supports multiple configuration modes:

  • Master Serial configuration
  • Slave Serial configuration
  • Boundary Scan (JTAG) configuration
  • SelectMAP parallel configuration

Configuration file sizes and programming times vary based on design complexity and chosen configuration mode.

Quality and Reliability Standards

Manufacturing and Testing

Quality Metric Standard
Grade Commercial
Operating Temperature 0°C to +85°C
Storage Temperature -65°C to +150°C
Moisture Sensitivity Level MSL 3
ESD Protection Human Body Model compliant

Compliance and Certifications

The XCV300E-7PQ240C meets industry standards including:

  • RoHS compliance for environmental safety
  • JEDEC specifications for package standards
  • Military temperature range options available (contact manufacturer)
  • Automotive-grade versions available in select configurations

Ordering Information and Availability

Part Number Nomenclature

Understanding the XCV300E-7PQ240C part number:

  • XC = Xilinx (AMD) product prefix
  • V300E = Virtex-E family, 300K system gates
  • 7 = Speed grade (-7)
  • PQ240 = Package type (PQFP) and pin count (240)
  • C = Commercial temperature grade

Package Marking and Identification

Each device includes permanent markings showing:

  • Full part number
  • Manufacturing date code
  • Lot traceability code
  • Country of origin

Technical Support and Resources

Documentation and Design Resources

Engineers working with the XCV300E-7PQ240C have access to comprehensive technical documentation:

  • Complete datasheet with AC/DC specifications
  • User guide for Virtex-E architecture
  • PCB design guidelines and layout recommendations
  • Application notes for specific use cases
  • Reference designs and example projects

Development Support

Resource Type Availability
Technical Support Available through AMD support channels
Design Services Third-party design houses available
Training Materials Online tutorials and documentation
Community Forums Active user community support

Comparison with Related Products

Virtex-E Family Alternatives

Part Number System Gates Speed Grade Package I/O Pins
XCV200E-7PQ240C 200,000 -7 PQFP-240 166
XCV300E-7PQ240C 300,000 -7 PQFP-240 166
XCV300E-6PQ240C 300,000 -6 PQFP-240 166
XCV400E-7PQ240C 400,000 -7 PQFP-240 166

Getting Started with XCV300E-7PQ240C

Evaluation and Prototyping

For engineers evaluating the XCV300E-7PQ240C:

  1. Development Kits: Consider Virtex-E evaluation boards for rapid prototyping
  2. Design Software: Download AMD Vivado or ISE Design Suite
  3. Reference Designs: Review application notes and example projects
  4. PCB Layout: Follow recommended footprint and routing guidelines

Design Best Practices

Power Supply Design

  • Implement proper decoupling capacitors (0.01μF and 0.1μF ceramic)
  • Use separate power planes for core and I/O voltages
  • Follow recommended power sequencing requirements

PCB Layout Considerations

  • Maintain controlled impedance for high-speed signals
  • Minimize stub lengths on critical nets
  • Provide adequate thermal vias for heat dissipation
  • Follow package-specific land pattern recommendations

Configuration Circuit

  • Include proper pull-up/pull-down resistors on mode pins
  • Provide stable clock source for configuration
  • Design robust configuration data path
  • Include JTAG header for programming and debug

Frequently Asked Questions

Q: What is the difference between speed grades -6 and -7? A: The -7 speed grade offers faster performance with lower propagation delays compared to -6, making it suitable for more demanding high-speed applications.

Q: Can the XCV300E-7PQ240C be used in automotive applications? A: The commercial grade (-C) version is rated for 0°C to 85°C. For automotive applications, consult AMD for industrial or automotive-grade alternatives.

Q: What configuration file format does this FPGA use? A: The XCV300E-7PQ240C uses Xilinx bitstream files generated by AMD’s development tools during the implementation process.

Q: Is this device still in production? A: The Virtex-E family is a mature product line. Check with authorized distributors for current availability and potential newer alternatives.

Conclusion

The XCV300E-7PQ240C represents a proven solution for engineers requiring high-performance FPGA capabilities in a moderate-density package. With 300,000 system gates, versatile I/O options, and fast -7 speed grade performance, this device continues to serve applications in telecommunications, industrial control, and embedded systems.

Its PQFP-240 package provides a balance between I/O count and PCB footprint, while the commercial temperature grade suits a wide range of operating environments. Backed by comprehensive development tools and extensive documentation, the XCV300E-7PQ240C enables efficient design implementation from concept to production.

For detailed specifications, pricing, and availability of the XCV300E-7PQ240C FPGA, consult authorized distributors or visit the AMD (Xilinx) website for the latest technical documentation and support resources.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.