Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCV300E-7PQ240I: High-Performance Virtex-E FPGA for Industrial Applications

Product Details

Overview of XCV300E-7PQ240I Field Programmable Gate Array

The XCV300E-7PQ240I is a powerful industrial-grade field programmable gate array (FPGA) from the renowned Virtex-E family, originally manufactured by Xilinx (now part of AMD). This advanced programmable logic device delivers exceptional performance with 82,944 system gates and operates reliably across industrial temperature ranges from -40°C to +100°C, making it ideal for demanding embedded applications.

Key Technical Specifications

Core Performance Features

Specification Value
Part Number XCV300E-7PQ240I
Manufacturer Xilinx (AMD)
Product Family Virtex-E 1.8V FPGAs
System Gates 82,944 Gates
Logic Cells 6,912 Cells
Maximum Frequency 400 MHz
Operating Voltage 1.8V

Package and Physical Characteristics

Feature Details
Package Type 240-Pin HSPQFP EP (Heat Sink Plastic Quad Flat Pack with Exposed Pad)
I/O Pins 158 User I/O
Total Pins 240
Technology Node 0.18μm CMOS Process
Metal Layers 6-layer metal interconnect

Temperature and Operating Conditions

Parameter Specification
Temperature Range -40°C to +100°C (Industrial Grade)
Speed Grade -7 (Standard Performance)
RoHS Compliance Check with distributor for specific lot compliance

Understanding the XCV300E-7PQ240I Part Number

The part number XCV300E-7PQ240I provides critical information about this FPGA:

  • XCV = Virtex-E FPGA family designation
  • 300E = 300,000 equivalent system gates
  • -7 = Speed grade indicator (standard performance timing)
  • PQ240 = 240-pin Plastic Quad Flat Pack package
  • I = Industrial temperature range (-40°C to +100°C)

Advanced Architecture and Design Capabilities

Programmable Logic Resources

The XCV300E-7PQ240I leverages Virtex-E architecture, which represents an evolutionary advancement in FPGA technology. Built on an aggressive 0.18-micron, six-layer metal CMOS process, this device offers dramatic improvements in silicon efficiency through optimized place-and-route capabilities.

Configurable Logic Blocks (CLBs): The device contains multiple CLBs that can be programmed to implement complex combinatorial and sequential logic functions, providing maximum design flexibility for custom applications.

Fast Interconnect Hierarchy: The Virtex-E architecture features a rich hierarchy of routing resources that enables high-speed signal propagation throughout the device, crucial for meeting stringent timing requirements in high-performance designs.

Memory and Storage Capabilities

This Xilinx FPGA includes embedded block RAM resources that can be configured as single-port or dual-port memory, FIFO buffers, or other storage elements, providing essential data buffering and processing capabilities for complex digital systems.

Primary Applications and Use Cases

Industrial Control Systems

The industrial temperature rating makes the XCV300E-7PQ240I particularly well-suited for:

  • Motor control and drive systems
  • Factory automation equipment
  • Process control instrumentation
  • Industrial robotics controllers
  • Programmable logic controllers (PLCs)

Communications Infrastructure

With its 400 MHz operating frequency, this FPGA excels in:

  • Network protocol processing
  • Digital signal processing (DSP) applications
  • Telecommunications equipment
  • Data packet routing and switching
  • Serial communication interfaces

Embedded System Development

Engineers frequently deploy this device in:

  • Custom embedded processors
  • Hardware acceleration modules
  • Real-time data acquisition systems
  • Digital control systems
  • Algorithm prototyping platforms

Design and Development Tools

ISE Design Suite Compatibility

The XCV300E-7PQ240I is supported by Xilinx ISE (Integrated Software Environment) Design Suite, which provides comprehensive tools for:

  • FPGA design entry (schematic, HDL)
  • Synthesis and implementation
  • Timing analysis and verification
  • Bitstream generation
  • Device programming

Hardware Description Language Support

This FPGA supports industry-standard HDL programming languages:

  • VHDL (VHSIC Hardware Description Language)
  • Verilog HDL
  • System Verilog (for advanced verification)

Power Consumption and Thermal Management

Voltage Requirements

Power Rail Typical Voltage
Core Voltage (VCCINT) 1.8V
I/O Voltage (VCCIO) Varies by I/O standard (1.8V-3.3V)
Auxiliary Voltage As required by configuration

Thermal Considerations

The 240-pin HSPQFP package with exposed pad provides enhanced thermal performance for industrial environments. The exposed thermal pad facilitates efficient heat dissipation to the PCB, essential for maintaining reliability across the full industrial temperature range.

Pin Configuration and I/O Standards

Supported I/O Standards

The XCV300E-7PQ240I supports multiple I/O standards, including:

  • LVTTL (Low Voltage TTL)
  • LVCMOS (Low Voltage CMOS) at various voltage levels
  • PCI 33/66
  • GTL and GTL+ (Gunning Transceiver Logic)
  • SSTL (Stub Series Terminated Logic)
  • HSTL (High-Speed Transceiver Logic)

Flexible I/O Banking

The device features multiple I/O banks, allowing designers to implement different voltage standards simultaneously, providing maximum flexibility for interfacing with various system components.

Comparison with Related Virtex-E Devices

Model Gates Logic Cells I/O Pins Package
XCV300E-7PQ240I 82,944 6,912 158 240-PQFP
XCV300E-7FG456I 82,944 6,912 312 456-FBGA
XCV300E-7BG352I 82,944 6,912 260 352-BGA

The 240-pin package offers an optimal balance between I/O capability and PCB footprint for cost-sensitive industrial designs.

Lifecycle Status and Availability

Important Note: The XCV300E-7PQ240I is currently classified as an obsolete/not recommended for new designs (NRND) product. However, it remains widely available through:

  • Electronic component distributors
  • Surplus and excess inventory suppliers
  • Authorized Xilinx/AMD partners
  • Secondary market channels

For new designs, engineers should consult AMD/Xilinx for recommended replacement devices from current product families such as Spartan-7, Artix-7, or newer Virtex generations.

Programming and Configuration

Configuration Modes

The XCV300E-7PQ240I supports multiple configuration methods:

  • Master Serial Mode: FPGA controls configuration from external memory
  • Slave Serial Mode: External controller manages configuration process
  • Boundary Scan (JTAG): IEEE 1149.1 compliant programming interface
  • SelectMAP: High-speed parallel configuration interface

Bitstream Security

The device includes configuration memory with optional security features to protect intellectual property in deployed designs.

Quality and Reliability Standards

Industrial Grade Qualification

The “I” suffix designation indicates this device has been qualified for industrial temperature operation, undergoing rigorous testing including:

  • Extended temperature cycling
  • Thermal shock testing
  • Humidity exposure testing
  • Accelerated life testing

ESD Protection

The device incorporates electrostatic discharge (ESD) protection on all pins, meeting JEDEC standards for component handling and system integration.

Design Considerations and Best Practices

PCB Layout Guidelines

For optimal performance when designing with the XCV300E-7PQ240I:

  1. Power Supply Decoupling: Place decoupling capacitors close to power pins
  2. Thermal Management: Ensure adequate thermal vias beneath exposed pad
  3. Signal Integrity: Follow controlled impedance routing for high-speed signals
  4. Ground Plane: Utilize solid ground plane for noise reduction
  5. Power Distribution: Design robust power delivery network for stable voltage

Clock Distribution

The Virtex-E architecture includes dedicated clock distribution networks. Utilize these resources for:

  • Global clock distribution
  • Regional clocking schemes
  • Clock domain management
  • Reduced clock skew designs

Technical Support and Resources

Documentation

Engineers working with the XCV300E-7PQ240I should reference:

  • Virtex-E Family Data Sheet (DS022)
  • Virtex-E Configuration Guide
  • ISE Design Suite documentation
  • Application notes specific to target applications

Online Resources

  • AMD/Xilinx support forums
  • Xilinx Wiki and answer database
  • Third-party FPGA design communities
  • Academic research publications

Purchasing Considerations

Verification and Authentication

When sourcing the XCV300E-7PQ240I:

  • Verify date codes and markings
  • Request certificate of conformance
  • Confirm packaging integrity
  • Source from reputable distributors
  • Consider inspection services for critical applications

Pricing Factors

Pricing varies based on:

  • Quantity purchased
  • Distributor relationships
  • Stock availability
  • Date code requirements
  • Testing/screening requirements

Environmental Compliance

RoHS and REACH

Compliance with environmental regulations varies by manufacturing date. Consult with suppliers regarding:

  • RoHS (Restriction of Hazardous Substances) compliance
  • REACH (Registration, Evaluation, Authorization of Chemicals) requirements
  • Conflict minerals reporting
  • Country of origin certification

Conclusion: Why Choose XCV300E-7PQ240I

The XCV300E-7PQ240I represents proven FPGA technology for industrial applications requiring reliable operation across extended temperature ranges. While classified as NRND, its widespread availability and established design ecosystem make it a practical choice for:

  • Retrofit and replacement applications
  • Cost-optimized industrial systems
  • Legacy system maintenance
  • Educational and research projects
  • Prototyping and proof-of-concept designs

Engineers appreciate the Virtex-E architecture’s balance of performance, power efficiency, and design flexibility. With 6,912 logic cells and 158 I/O pins in a compact 240-pin package, this FPGA delivers substantial processing capability for a wide range of embedded applications.

For designers seeking a reliable, industrial-grade programmable logic solution with proven track record and extensive community support, the XCV300E-7PQ240I remains a compelling option in the field programmable gate array landscape.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.