Overview of XC2S200-6FGG940C Field Programmable Gate Array
The XC2S200-6FGG940C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family, delivering exceptional performance and flexibility for complex digital design applications. This advanced FPGA chip combines 200,000 system gates with 5,292 logic cells to provide engineers and designers with a robust platform for implementing sophisticated digital circuits across telecommunications, industrial automation, medical imaging, and consumer electronics applications.
As a cost-effective alternative to traditional ASICs, the XC2S200-6FGG940C eliminates lengthy development cycles and high initial tooling costs while offering field-upgradeable programmability that ensures your designs remain adaptable to changing requirements.
Key Technical Specifications of XC2S200-6FGG940C
Core Performance Features
| Specification |
Value |
Description |
| System Gates |
200,000 |
Total available gates for logic implementation |
| Logic Cells |
5,292 |
Programmable logic elements for digital circuits |
| CLB Array |
28 x 42 (1,176 total) |
Configurable Logic Blocks in row x column format |
| Speed Grade |
-6 |
Highest performance grade (Commercial temperature only) |
| Operating Frequency |
Up to 200 MHz |
Maximum system clock frequency |
| Process Technology |
0.18μm |
Advanced CMOS fabrication process |
Memory Resources
| Memory Type |
Capacity |
Application |
| Distributed RAM |
75,264 bits |
Fast, distributed memory for small data storage |
| Block RAM |
56 Kbits (56,320 bits) |
Dedicated memory blocks for data buffering |
| Total Embedded Memory |
131,584 bits |
Combined memory resources |
Input/Output Capabilities
| I/O Feature |
Specification |
Details |
| Maximum User I/O |
284 pins |
Available user-configurable I/O pins |
| Package Type |
FGG940 (Fine-Pitch BGA) |
940-ball Fine-Pitch Ball Grid Array |
| Core Voltage |
2.5V |
Standard operating voltage |
| I/O Standards Supported |
Multiple |
LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL |
Advanced Architecture and Design Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG940C features a sophisticated 28×42 array of Configurable Logic Blocks, providing 1,176 total CLBs for implementing complex combinational and sequential logic. Each CLB contains multiple Look-Up Tables (LUTs), flip-flops, and multiplexers, enabling efficient implementation of arithmetic functions, state machines, and data path logic.
Delay-Locked Loop (DLL) Technology
Four Delay-Locked Loops positioned at each corner of the die provide precise clock management and distribution. These DLLs eliminate clock skew, enable clock frequency multiplication and division, and ensure reliable synchronous operation across the entire FPGA fabric.
Versatile Routing Architecture
The hierarchical routing architecture of the XC2S200-6FGG940C ensures efficient interconnection between logic blocks, I/O pins, and memory resources. This routing infrastructure supports high-speed signal propagation while maintaining signal integrity across complex designs.
Primary Applications of XC2S200-6FGG940C FPGA
Telecommunications and Networking
The XC2S200-6FGG940C excels in telecommunications applications, including baseband processing for wireless communication systems, protocol conversion, network packet processing, and high-speed data routing. Its 200 MHz performance capability and extensive I/O resources make it ideal for implementing communication protocols and signal processing algorithms.
Industrial Automation and Control
Industrial control systems benefit from the XC2S200-6FGG940C’s reliability and real-time processing capabilities. Applications include motor control systems, process automation, PLC functionality, sensor interface management, and industrial protocol implementation (Modbus, PROFIBUS, EtherCAT).
Medical Electronics and Imaging
Medical device manufacturers utilize the XC2S200-6FGG940C for ultrasound imaging systems, patient monitoring equipment, diagnostic instrumentation, and medical data acquisition systems. The FPGA’s reconfigurability allows for firmware updates and feature enhancements without hardware modifications.
Consumer Electronics and Multimedia
Consumer applications leverage the XC2S200-6FGG940C for video processing, audio codec implementation, display controllers, gaming peripherals, and smart home devices. The device’s gate capacity supports complex multimedia algorithms while maintaining cost-effectiveness.
Technical Advantages of Choosing XC2S200-6FGG940C
Superior Performance-to-Cost Ratio
The Spartan-II family is engineered specifically to deliver maximum functionality at competitive pricing. The XC2S200-6FGG940C provides 200,000 system gates of logic resources at a fraction of the cost of comparable ASIC development, making it ideal for volume production applications.
Field Programmability and Flexibility
Unlike traditional ASICs that require expensive mask sets and lengthy fabrication processes, the XC2S200-6FGG940C can be programmed and reprogrammed in the field. This enables rapid prototyping, iterative design refinement, and post-deployment feature upgrades.
Low Power Consumption
The 0.18-micron CMOS process technology ensures efficient power utilization, making the XC2S200-6FGG940C suitable for battery-powered and thermally-constrained applications. Multiple power management modes help optimize energy consumption based on operational requirements.
Comprehensive Design Tool Support
The XC2S200-6FGG940C is fully supported by AMD Xilinx’s ISE Design Suite, providing integrated synthesis, implementation, simulation, and debugging tools. Engineers can leverage extensive IP cores, reference designs, and application notes to accelerate development cycles.
Package Information and Physical Characteristics
FGG940 Package Specifications
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Ball Count |
940 balls |
| Ball Pitch |
1.0 mm (typical for fine-pitch BGA) |
| Package Dimensions |
Contact manufacturer for exact dimensions |
| Thermal Characteristics |
Enhanced thermal performance for demanding applications |
| Moisture Sensitivity Level |
MSL 3 (typical) |
Temperature Grades and Reliability
The -6 speed grade of the XC2S200-6FGG940C is available exclusively in the Commercial temperature range (0°C to +85°C). This device is manufactured to rigorous quality standards ensuring long-term reliability in production environments.
Development and Programming Resources
Programming Options
The XC2S200-6FGG940C supports multiple programming methods including JTAG boundary-scan programming, slave serial configuration, master serial configuration, and slave parallel configuration modes. This flexibility allows integration into various system architectures.
Design Flow and Tools
Engineers developing with the XC2S200-6FGG940C can utilize:
- ISE Design Suite: Complete FPGA design environment with synthesis and implementation tools
- VHDL/Verilog Support: Industry-standard HDL languages for design entry
- IP Core Library: Pre-verified intellectual property for common functions
- Simulation Tools: ModelSim integration for functional verification
- ChipScope: Integrated logic analyzer for in-system debugging
Comparison with Related Xilinx FPGA Models
XC2S200 Family Variants
| Part Number |
Package |
Speed Grade |
I/O Pins |
Key Difference |
| XC2S200-6FGG940C |
FGG940 |
-6 |
284 |
Maximum I/O count, highest pin-count package |
| XC2S200-6FG456C |
FG456 |
-6 |
284 |
Standard 456-ball package |
| XC2S200-6FG256C |
FG256 |
-6 |
176 |
Smaller footprint, reduced I/O |
| XC2S200-5FG456C |
FG456 |
-5 |
284 |
Lower speed grade option |
Performance Positioning
Within the Spartan-II family, the XC2S200 represents the largest device, offering maximum logic density and I/O capability. Smaller family members (XC2S150, XC2S100, XC2S50, XC2S30, XC2S15) provide scaled-down resources for less demanding applications.
Quality, Compliance, and Environmental Considerations
Manufacturing Standards
The XC2S200-6FGG940C is manufactured in AMD Xilinx’s certified fabrication facilities following ISO 9001 quality management standards. Each device undergoes comprehensive testing including functional verification, speed grading, and burn-in testing to ensure reliability.
RoHS and Environmental Compliance
Lead-free package options (denoted by the “G” character in the ordering code) are available for RoHS compliance. The XC2S200-6FGG940C meets international environmental standards for electronic components.
Ordering Information and Availability
Part Number Decoding
XC2S200-6FGG940C breaks down as follows:
- XC2S200: Spartan-II family, 200,000 system gates
- -6: Speed grade (highest performance, commercial temperature)
- FGG: Fine-pitch Ball Grid Array with lead-free option
- 940: 940-ball package configuration
- C: Commercial temperature range (0°C to +85°C)
Procurement Considerations
When sourcing the XC2S200-6FGG940C, work with authorized Xilinx FPGA distributors to ensure authentic components with full manufacturer warranty and technical support. Volume pricing is typically available for production quantities.
Getting Started with XC2S200-6FGG940C Development
Evaluation and Development Boards
While specific development boards for the FGG940 package may vary, engineers can begin development using:
- Spartan-II starter kits with similar XC2S200 variants
- Custom PCB development with reference designs
- Breadboard adapters for prototyping (availability varies by package)
Design Considerations
When designing with the XC2S200-6FGG940C, consider:
- Power Supply Design: Provide stable 2.5V core voltage and appropriate I/O voltages
- Decoupling: Implement proper power supply decoupling near each power pin
- PCB Layout: Follow Xilinx PCB design guidelines for high-speed signals
- Thermal Management: Ensure adequate cooling for high-utilization designs
- Configuration: Select appropriate configuration mode for your application
Frequently Asked Questions About XC2S200-6FGG940C
What makes the -6 speed grade significant?
The -6 speed grade represents the fastest available performance option in the Spartan-II XC2S200 family, supporting system clock frequencies up to 200 MHz. This speed grade is optimized for applications requiring maximum performance.
Can the XC2S200-6FGG940C replace an ASIC in production?
Yes, the XC2S200-6FGG940C serves as an excellent ASIC alternative for many applications, particularly in low to medium volume production. It eliminates NRE costs, reduces time-to-market, and provides field-upgrade capability that ASICs cannot match.
What is the typical power consumption?
Power consumption varies based on design utilization, clock frequency, and I/O activity. Typical static power consumption is relatively low, while dynamic power scales with design complexity. Use Xilinx XPower tools for accurate power estimation for your specific design.
Is the XC2S200-6FGG940C suitable for automotive applications?
The commercial temperature grade (-C suffix) is designed for 0°C to +85°C operation. For automotive applications requiring extended temperature ranges, consult AMD Xilinx for industrial or automotive-grade variants.
Conclusion: Why Choose XC2S200-6FGG940C for Your Next Design
The XC2S200-6FGG940C represents an optimal balance of performance, flexibility, and cost-effectiveness for demanding FPGA applications. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities, this Spartan-II device delivers the resources needed for complex digital designs without the financial and temporal overhead of ASIC development.
Whether you’re implementing telecommunications infrastructure, industrial control systems, medical devices, or consumer electronics, the XC2S200-6FGG940C provides a proven, reliable platform backed by comprehensive development tools and extensive technical documentation.
For engineers seeking a high-performance FPGA solution with exceptional value and proven reliability, the XC2S200-6FGG940C from AMD Xilinx’s Spartan-II family stands as a compelling choice for both prototyping and production deployment.