Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV50E-6FG256C: High-Performance Virtex-E FPGA for Advanced Digital Design Applications

Product Details

Overview of XCV50E-6FG256C FPGA Chip

The XCV50E-6FG256C is a professional-grade Field Programmable Gate Array (FPGA) from AMD’s Virtex-E family, designed to deliver exceptional performance for complex digital logic applications. This 256-pin FBGA package combines high-density programmable logic with advanced processing capabilities, making it an ideal solution for telecommunications, industrial control systems, and embedded computing applications.

Manufactured using advanced 0.18 μm CMOS process technology, the XCV50E-6FG256C offers engineers a powerful platform for implementing custom digital circuits with remarkable flexibility and speed. As part of the renowned Xilinx FPGA product line, this device represents a proven solution for mission-critical applications requiring reliable, high-performance programmable logic.

Key Technical Specifications and Features

Core Performance Parameters

Specification Value
System Gates 71,693 gates
Logic Cells 1,728 cells
CLB Array Configuration 16 x 24
Maximum Clock Frequency 357 MHz
Core Voltage 1.8V
Process Technology 0.18 μm CMOS
Package Type 256-Pin FBGA (Fine Pitch Ball Grid Array)
I/O Pins 176 user I/O
Speed Grade -6 (commercial temperature range)

Advanced Memory Architecture

The XCV50E-6FG256C integrates sophisticated memory resources that enable efficient data storage and manipulation within your FPGA design.

Memory Type Capacity Features
Distributed RAM Up to 1 Mb Flexible, distributed throughout CLBs
Block RAM 832 Kb Dedicated memory blocks for high-density storage
Total RAM Resources Combined architecture Optimized for both small and large data structures

Technical Architecture and Design Capabilities

Configurable Logic Blocks (CLBs)

The XCV50E-6FG256C features a comprehensive array of configurable logic blocks arranged in a 16 x 24 matrix. Each CLB contains multiple logic elements that can be programmed to implement any combinational or sequential logic function. This architecture provides designers with maximum flexibility when creating custom digital circuits.

High-Speed I/O Standards Support

One of the standout features of this Virtex-E FPGA is its extensive I/O compatibility. The device supports multiple industry-standard interfaces:

  • LVDS (Low Voltage Differential Signaling) – for high-speed point-to-point data transmission
  • BLVDS (Bus Low Voltage Differential Signaling) – for multi-point applications
  • LVPECL (Low Voltage Positive Emitter Coupled Logic) – for clock distribution and high-speed serial interfaces
  • LVCMOS/LVTTL – for general-purpose digital I/O

Clock Management with DLL Technology

The XCV50E-6FG256C incorporates eight fully digital Delay-Locked Loops (DLLs) that provide sophisticated clock management capabilities. These DLLs enable:

  • Precise clock distribution with minimal skew
  • Clock frequency multiplication and division
  • Phase shifting for advanced timing control
  • Clock domain crossing management

Primary Application Areas and Use Cases

Telecommunications and Networking Equipment

The XCV50E-6FG256C excels in telecommunications infrastructure, where it handles protocol conversion, signal processing, and data routing tasks. Its high-speed capabilities make it suitable for:

  • Software-Defined Radio (SDR) systems
  • Base station controllers
  • Network protocol processors
  • Digital signal processing applications

Industrial Control and Automation

Manufacturing and process control systems benefit from the FPGA’s ability to implement custom control algorithms and interface with diverse sensor types:

  • Programmable Logic Controllers (PLCs)
  • Motor control systems
  • Factory automation equipment
  • Real-time monitoring systems

Medical Imaging and Diagnostic Equipment

The processing power of the XCV50E-6FG256C supports demanding medical imaging applications:

  • MRI and CT scan image processing
  • Ultrasound signal processing
  • Digital X-ray systems
  • Real-time diagnostic equipment

Aerospace and Defense Applications

Military and aerospace systems require the reliability and performance that Virtex-E FPGAs provide:

  • Navigation systems
  • Satellite communication equipment
  • Radar signal processing
  • Secure communication systems

Programming and Development Tools

Compatible Development Software

Engineers can develop designs for the XCV50E-6FG256C using industry-standard tools:

Tool Suite Features Best For
ISE Design Suite Legacy support, proven stability Virtex-E family designs
Vivado Design Suite Modern interface, advanced features Migration and new designs
Foundation Series Schematic-based entry Visual design preference
Alliance Series HDL-based workflow VHDL/Verilog developers

Design Entry Methods

The XCV50E-6FG256C supports multiple design entry methodologies:

  1. HDL-Based Design: Use VHDL or Verilog hardware description languages for complex digital systems
  2. Schematic Entry: Visual circuit design for smaller projects or IP core integration
  3. IP Core Integration: Leverage pre-designed functional blocks to accelerate development
  4. Mixed-Mode Design: Combine HDL and schematic approaches for optimal results

Package and Pin Configuration Details

256-Pin FBGA Package Characteristics

Package Feature Specification
Package Type Fine Pitch Ball Grid Array (FBGA)
Total Pins 256
User I/O Count 176 pins
Ball Pitch 1.0 mm nominal
Package Dimensions 17 x 17 mm body size
Thermal Characteristics Enhanced heat dissipation

Pin Function Categories

The 256 pins are allocated across several functional categories:

  • Power Pins: Core voltage (VCCINT) and I/O voltage (VCCO) supplies
  • Ground Pins: Multiple GND connections for proper power distribution
  • Configuration Pins: JTAG, SelectMAP, or serial configuration interfaces
  • User I/O Pins: 176 general-purpose or specialized I/O connections
  • Dedicated Pins: Clock inputs, global routing resources

Performance Specifications and Operating Conditions

Speed Grade Analysis

The “-6” speed grade designation indicates this is a commercial-grade device optimized for standard operating conditions:

Parameter Minimum Typical Maximum Units
Clock Frequency 357 MHz
Propagation Delay Speed grade dependent ns
Setup Time Speed grade dependent ns
Hold Time Speed grade dependent ns

Temperature and Voltage Requirements

Operating Condition Specification
Core Voltage (VCCINT) 1.8V ±5%
I/O Voltage (VCCO) 1.5V to 3.3V (bank-dependent)
Commercial Temperature 0°C to +85°C
Junction Temperature See datasheet for thermal calculations

Comparison with Similar FPGA Models

Virtex-E Family Members

Model System Gates Logic Cells Max Frequency Package Options
XCV50E 71,693 1,728 357 MHz FG256, CS144, PQ240
XCV100E 143,387 3,456 357 MHz FG256, BG352, PQ240
XCV200E 286,773 6,912 357 MHz FG456, BG352, PQ240
XCV300E 430,160 10,368 357 MHz FG456, BG432, PQ240

Legacy System Support and Replacement Options

Maintaining Existing Designs

The XCV50E-6FG256C remains available for legacy system support, making it valuable for:

  • Production line continuity for established products
  • Repair and maintenance of deployed equipment
  • System upgrades without complete redesign
  • Cost-effective spare parts inventory

Migration Considerations

While the XCV50E-6FG256C is marked as not recommended for new designs, existing users should consider:

  • Pin compatibility with newer devices in the same package
  • Feature migration paths to current FPGA families
  • Design tool support and longevity
  • Supply chain availability through authorized distributors

Quality Assurance and Reliability Standards

Manufacturing Quality

AMD (formerly Xilinx) manufactures the XCV50E-6FG256C under stringent quality control processes:

  • ISO 9001 certified manufacturing facilities
  • Comprehensive electrical testing of every device
  • Traceability through unique device identification
  • RoHS compliance for environmental standards

Reliability Testing

Each device undergoes extensive reliability qualification:

  • Temperature cycling tests
  • High-temperature operating life testing
  • Moisture sensitivity level classification
  • Electrostatic discharge (ESD) protection verification

Procurement and Availability Information

Authorized Distribution Channels

The XCV50E-6FG256C is available through multiple authorized distributors including:

  • DigiKey Electronics – full traceability and authenticity guaranteed
  • Major electronic component distributors worldwide
  • Direct AMD/Xilinx sales channels for volume orders
  • Authorized franchise distributors with technical support

Ordering Information

Order Code Description
XCV50E-6FG256C Commercial grade, -6 speed, 256-pin FBGA
XCV50E-7FG256C Commercial grade, -7 speed (faster), 256-pin FBGA
XCV50E-6FG256I Industrial grade, -6 speed, 256-pin FBGA

Frequently Asked Questions About XCV50E-6FG256C

What is the difference between XCV50E-6FG256C and XCV50-6FG256C?

The “E” designation indicates Enhanced Virtex-E family, which operates at 1.8V core voltage compared to the standard Virtex 2.5V operation. The Virtex-E offers improved power efficiency and higher performance.

Can I use modern Vivado tools with this FPGA?

The XCV50E-6FG256C is best supported by ISE Design Suite (versions 14.7 and earlier). While Vivado targets newer architectures, ISE provides complete toolchain support for Virtex-E development.

What is the typical power consumption?

Power consumption varies based on design utilization, clock frequency, and I/O activity. Typical applications consume between 0.5W to 2W, with detailed calculations available through Xilinx XPower analysis tools.

Is this FPGA suitable for new product designs?

While technically capable, AMD has designated this as “not recommended for new designs.” Consider newer families like Artix-7 or Spartan-7 for new projects, which offer better performance, lower power, and modern tool support.

Conclusion: Why Choose XCV50E-6FG256C

The XCV50E-6FG256C represents a proven, reliable solution for applications requiring moderate logic capacity combined with high-performance operation. Its extensive I/O support, robust architecture, and proven track record make it particularly valuable for maintaining legacy systems and supporting long-lifecycle products in industrial, telecommunications, and aerospace applications.

For engineers working with existing Virtex-E designs, this FPGA continues to provide the performance and reliability needed to keep critical systems operational. The availability through authorized distributors ensures access to genuine components with full traceability and quality assurance.

Whether you’re maintaining deployed equipment, supporting legacy production lines, or completing designs already committed to the Virtex-E platform, the XCV50E-6FG256C delivers the programmable logic capabilities needed for demanding digital design applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.