Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV50E-7FG256I: High-Performance Virtex-E FPGA for Industrial Applications

Product Details

Overview of XCV50E-7FG256I Field Programmable Gate Array

The XCV50E-7FG256I is a premium industrial-grade field programmable gate array (FPGA) from AMD’s renowned Virtex-E family. This advanced FPGA solution delivers exceptional performance with 50,000 system gates and operates reliably across an extended industrial temperature range of -40°C to 100°C, making it ideal for demanding embedded system applications.

Key Features and Specifications

Core FPGA Capabilities

The XCV50E-7FG256I FPGA stands out in the market with its robust feature set designed for industrial and commercial applications. This Xilinx FPGA combines high-speed performance with reliable operation in challenging environments.

Feature Specification
Logic Gates 50,000 System Gates
Logic Elements/Cells 1,728
Total RAM Bits 65,536
I/O Count 176
Voltage Supply 1.8V, 2.5V, 3.3V
Operating Temperature -40°C to 100°C (Industrial)
Package Type 256-FBGA (17×17)
Mounting Style Surface Mount

Advanced Architecture Design

Architecture Feature Details
LABs/CLBs 432 Configurable Logic Blocks
Maximum Distributed RAM 27K bits
Number of Block RAMs 16 blocks
Maximum User I/O 176 pins
Speed Grade -7 (high performance)

Technical Specifications in Detail

Electrical Characteristics

The XCV50E-7FG256I operates with multiple voltage rails ensuring compatibility with various system architectures:

  • Core Voltage: 1.8V (VCCINT)
  • I/O Voltage: 2.5V and 3.3V (VCCO)
  • Low power consumption in standby modes
  • ESD protection on all pins

Package Information

Package Details Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 256 pins
Package Dimensions 17mm x 17mm
Ball Pitch 1.0mm
Moisture Sensitivity Level MSL 3
Lead-Free Status RoHS Compliant

Applications and Use Cases

Industrial Control Systems

The XCV50E-7FG256I excels in industrial automation applications where reliability and extended temperature operation are critical. Its robust design makes it suitable for:

  • Manufacturing automation controllers
  • Process control systems
  • Industrial robotics interfaces
  • Factory floor monitoring systems

Embedded System Development

This FPGA provides an excellent platform for embedded systems requiring:

  • Custom logic implementation
  • High-speed data processing
  • Protocol conversion
  • Real-time control algorithms

Communication Infrastructure

The device supports various communication protocols and interfaces:

  • Network switching applications
  • Data routing systems
  • Protocol bridges
  • Signal processing modules

Automotive and Transportation

With its industrial temperature range and reliability:

  • Automotive control units
  • Railway signaling systems
  • Avionics support equipment
  • Vehicle diagnostic tools

Performance Characteristics

Speed and Timing

Performance Metric Specification
Maximum Operating Frequency Up to 200 MHz (design dependent)
Toggle Rate High-speed I/O capable
Speed Grade -7 (fastest commercial grade)
Propagation Delay Optimized for low latency

Memory Architecture

The XCV50E-7FG256I features a sophisticated memory hierarchy:

  • Block RAM: 16 dual-port RAM blocks (4,096 bits each)
  • Distributed RAM: Up to 27K bits using CLB resources
  • Total RAM: 65,536 bits for data buffering and storage
  • Flexible configuration for FIFO, RAM, or ROM implementations

Design and Development Tools

Software Support

Developers can leverage comprehensive design tools:

  • ISE Design Suite for FPGA development
  • Vivado Design Suite compatibility (legacy support)
  • ChipScope Pro for debugging
  • ModelSim for simulation

Development Resources

  • Reference designs and IP cores available
  • Evaluation boards for prototyping
  • Comprehensive documentation library
  • Application notes and technical guides

Comparison with Similar FPGAs

Virtex-E Family Positioning

Device Logic Cells RAM Bits I/O Application Focus
XCV50E 1,728 65,536 176 Entry industrial
XCV100E 3,456 131,072 196 Mid-range industrial
XCV200E 6,912 262,144 284 High-density industrial

Quality and Reliability

Industrial Grade Certification

The XCV50E-7FG256I meets stringent industrial standards:

  • Extended temperature range: -40°C to 100°C operation
  • Enhanced screening for industrial reliability
  • Long-term availability for production designs
  • Quality management per ISO standards

Environmental Compliance

  • RoHS compliant (lead-free)
  • REACH regulation compliant
  • Halogen-free options available
  • Environmental stress testing certified

Installation and Implementation

PCB Design Considerations

When integrating the XCV50E-7FG256I:

  1. Power supply decoupling: Place bypass capacitors close to power pins
  2. Thermal management: Ensure adequate airflow or heatsinking
  3. Signal integrity: Follow high-speed design guidelines
  4. Clock distribution: Use dedicated clock resources
  5. Ground planes: Implement solid ground planes

Programming and Configuration

Multiple configuration options available:

  • JTAG boundary scan programming
  • SelectMAP parallel configuration
  • Serial configuration modes
  • Master/Slave configuration support

Ordering Information and Availability

Part Number Breakdown

XCV50E-7FG256I decodes as:

  • XC: Xilinx Commercial FPGA
  • V50E: Virtex-E, 50K gates
  • 7: Speed grade (-7)
  • FG256: Fine-pitch BGA, 256 pins
  • I: Industrial temperature range

Package Variants

Suffix Temperature Range Application
C 0°C to 85°C Commercial
I -40°C to 100°C Industrial (this variant)

Frequently Asked Questions

What is the main difference between XCV50E-7FG256I and XCV50E-7FG256C?

The primary difference is the operating temperature range. The “I” grade operates from -40°C to 100°C (industrial), while the “C” grade operates from 0°C to 85°C (commercial).

How many logic resources are available in the XCV50E?

The XCV50E provides 1,728 logic cells organized in 432 configurable logic blocks (CLBs), equivalent to approximately 50,000 system gates.

What power supply voltages does the XCV50E-7FG256I require?

The device requires three voltage rails: 1.8V for the core (VCCINT), and 2.5V or 3.3V for I/O (VCCO), depending on your interface requirements.

Is the XCV50E-7FG256I suitable for high-temperature environments?

Yes, with its industrial temperature rating of -40°C to 100°C, this FPGA is specifically designed for demanding high-temperature industrial applications.

What development tools are needed to program this FPGA?

You’ll need Xilinx ISE Design Suite or compatible tools, along with a JTAG programming cable for configuration and debugging.

Advantages of Choosing XCV50E-7FG256I

Proven Technology

  • Mature platform with extensive deployment history
  • Reliable performance in industrial environments
  • Broad ecosystem of IP cores and reference designs
  • Long-term support from AMD/Xilinx

Cost-Effective Solution

  • Competitive pricing for 50K gate density
  • Reduced development time with available tools
  • Lower total cost of ownership
  • Scalable to other Virtex-E family members

Technical Excellence

  • High-speed operation with -7 speed grade
  • Flexible I/O standards support
  • Robust memory architecture
  • Excellent signal integrity

Technical Support and Resources

Documentation Available

  • Datasheet with complete electrical specifications
  • User guides for configuration and operation
  • Application notes for common implementations
  • PCB layout guidelines

Community and Support

  • Active user community forums
  • Technical support from AMD/Xilinx
  • Third-party IP vendor ecosystem
  • Training materials and webinars

Conclusion

The XCV50E-7FG256I represents an excellent choice for engineers developing industrial-grade embedded systems requiring reliable FPGA performance. With its combination of 50,000 system gates, industrial temperature operation, comprehensive I/O capabilities, and proven Virtex-E architecture, this device delivers exceptional value for demanding applications.

Whether you’re designing industrial control systems, communication infrastructure, or embedded processing solutions, the XCV50E-7FG256I provides the performance, reliability, and flexibility needed for successful product development. Its extensive development tool support and mature technology platform ensure reduced time-to-market while maintaining the quality standards required for industrial deployments.

For detailed technical specifications, design resources, and purchasing information, consult the official AMD/Xilinx documentation or contact authorized distributors.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.