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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV50E-8PQG240C: High-Performance Xilinx Virtex-E FPGA Solution

Product Details

Overview of XCV50E-8PQG240C Field Programmable Gate Array

The XCV50E-8PQG240C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Virtex-E family. This advanced programmable logic device delivers exceptional performance for demanding digital applications, combining high-speed processing capabilities with flexible configuration options. Designed with 0.18μm CMOS technology, this FPGA represents a significant advancement in programmable logic solutions for engineers and system designers.

As part of the Virtex-E series, the XCV50E-8PQG240C offers outstanding versatility for applications ranging from telecommunications to industrial automation. This Xilinx FPGA provides the perfect balance of logic capacity, I/O resources, and performance characteristics for complex digital system implementations.

Key Specifications and Technical Features

Core FPGA Specifications

Specification Value
Manufacturer AMD/Xilinx
Part Number XCV50E-8PQG240C
Family Virtex-E
Logic Elements 1,728 CLBs
System Gates 50,000
Operating Voltage 1.8V Core
Package Type 240-Pin PQFP
Speed Grade -8 (High Performance)
Temperature Range Commercial (0°C to +85°C)
Technology Node 0.18μm CMOS

Performance Characteristics

Parameter Specification
Maximum Frequency Up to 250 MHz
User I/O Pins 176
Total Distributed RAM 16 Kb
Block RAM 32 Kb
Logic Cells Approximately 10,800
Routing Matrix 6-layer metal interconnect
Configuration Memory SRAM-based

Advanced Architecture and Design Benefits

Programmable Logic Architecture

The XCV50E-8PQG240C features Xilinx’s advanced CLB (Configurable Logic Block) architecture, providing exceptional flexibility for implementing complex digital functions. Each CLB contains multiple logic cells that can be configured to perform various combinational and sequential logic operations, making this FPGA ideal for diverse application requirements.

High-Speed Interconnect Network

With its sophisticated 6-layer metal routing architecture, the XCV50E-8PQG240C ensures optimal signal integrity and minimal propagation delays. This advanced interconnect system enables efficient place-and-route operations, resulting in superior design performance and reduced development time.

Memory Resources

The device incorporates both distributed RAM and dedicated block RAM resources, offering designers multiple options for memory implementation. This dual-memory architecture allows for optimized system designs where different memory types can be strategically deployed based on specific application needs.

Package and Pinout Configuration

PQ240 Package Details

Feature Description
Package Style Plastic Quad Flat Pack (PQFP)
Total Pins 240
Pin Pitch 0.5mm
Body Dimensions 32mm x 32mm
Package Height Standard low-profile design
Lead Count 240 gull-wing leads
Mounting Type Surface Mount Technology (SMT)

Pin Distribution

Pin Type Quantity Purpose
User I/O 176 Configurable input/output pins
Dedicated Input 8 Clock and control signals
Power (VCCINT) Multiple 1.8V core power supply
Power (VCCIO) Multiple I/O power supply (1.8V-3.3V)
Ground Multiple Ground connections
Configuration Several JTAG and configuration interface

Application Areas and Use Cases

Telecommunications Systems

The XCV50E-8PQG240C excels in telecommunications applications requiring high-speed data processing and protocol implementation. Its robust I/O capabilities and high-performance logic make it suitable for:

  • Digital signal processing (DSP) applications
  • Protocol conversion and bridging
  • Network packet processing
  • Baseband processing systems
  • Communication interface controllers

Industrial Automation

This FPGA provides reliable performance for industrial control systems where precision timing and real-time responsiveness are critical:

  • Motion control systems
  • Industrial networking protocols
  • Machine vision processing
  • Sensor data acquisition and processing
  • Real-time control systems

Embedded Systems Development

The versatile architecture supports various embedded system applications:

  • Custom peripheral controllers
  • Hardware acceleration engines
  • System-on-chip (SoC) prototyping
  • Embedded signal processing
  • Hardware/software co-design platforms

Data Acquisition Systems

With its extensive I/O resources and flexible timing capabilities:

  • Multi-channel data acquisition
  • High-speed sampling systems
  • Instrumentation interfaces
  • Test and measurement equipment
  • Data logging systems

Speed Grade and Performance Analysis

Understanding the -8 Speed Grade

The “-8” speed grade designation indicates this is a high-performance variant within the XCV50E family. This speed grade offers:

  • Faster Clock-to-Output Times: Reduced propagation delays through logic elements
  • Higher Maximum Operating Frequencies: Support for demanding timing requirements
  • Improved Setup and Hold Times: Better timing margins for reliable operation
  • Enhanced Performance Headroom: Greater design flexibility for timing-critical applications

Performance Comparison

Speed Grade Relative Performance Typical Applications
-4 Standard General-purpose designs
-6 Enhanced Moderate-speed applications
-8 High Performance Timing-critical, high-speed systems

Power Consumption and Thermal Management

Operating Power Requirements

Power Domain Voltage Typical Current Purpose
VCCINT 1.8V Varies with utilization Core logic power
VCCIO 1.8V – 3.3V Depends on I/O standard I/O buffer power
VCCO Multiple banks Bank-specific Output driver power

Thermal Considerations

  • Operating temperature range: 0°C to +85°C (Commercial grade)
  • Recommended PCB thermal management practices
  • Heat sink compatibility with PQFP package
  • Junction temperature monitoring recommended for high-utilization designs

Configuration and Programming

Configuration Methods

The XCV50E-8PQG240C supports multiple configuration modes:

  1. JTAG Programming: Standard boundary-scan programming interface
  2. Master Serial Mode: Configuration from external serial PROM
  3. Slave Serial Mode: Configuration from external controller
  4. SelectMAP Mode: Parallel configuration for fast programming

Development Tools and Software Support

Tool Purpose Compatibility
ISE Design Suite Legacy development environment Full support
Vivado Design Suite Modern development platform Limited (via ISE)
ChipScope Pro On-chip debugging and analysis Supported
Impact Configuration and programming Full support

Quality and Reliability

Manufacturing Standards

  • Manufactured using advanced 0.18μm CMOS process technology
  • RoHS compliant versions available
  • Moisture sensitivity level (MSL) rated for safe handling
  • ESD protection on all user I/O pins

Reliability Features

  • Built-in CRC error detection for configuration
  • SRAM-based configuration with unlimited reconfiguration cycles
  • Comprehensive device testing and quality assurance
  • Industry-standard reliability specifications

Ordering Information and Packaging

Part Number Breakdown

XCV50E-8PQG240C decodes as follows:

  • XCV: Xilinx Virtex family identifier
  • 50E: 50,000 system gates, Enhanced (Virtex-E)
  • -8: Speed grade (high performance)
  • PQ: Package type (Plastic Quad)
  • G: Lead-free (RoHS compliant)
  • 240: Number of pins
  • C: Commercial temperature range

Available Package Options

Part Number Speed Grade Temperature Package Lead-Free
XCV50E-6PQ240C -6 Commercial PQFP Yes
XCV50E-7PQ240C -7 Commercial PQFP Yes
XCV50E-8PQG240C -8 Commercial PQFP Yes
XCV50E-8PQ240I -8 Industrial PQFP No

Design Guidelines and Best Practices

PCB Layout Recommendations

  1. Power Supply Decoupling: Place multiple decoupling capacitors near power pins
  2. Ground Plane: Utilize continuous ground plane for optimal signal integrity
  3. Thermal Relief: Ensure adequate thermal vias and heat dissipation paths
  4. Signal Integrity: Maintain controlled impedance for high-speed signals
  5. Clock Distribution: Implement proper clock routing techniques

Clocking Strategy

  • Utilize global clock resources for distribution of primary system clocks
  • Implement clock domain crossing techniques for multi-clock designs
  • Consider Digital Clock Managers (DCMs) for advanced clocking requirements
  • Plan clock tree synthesis for optimal timing performance

Resource Utilization Tips

  • Balance logic utilization across the device for optimal place-and-route
  • Leverage block RAM resources for memory-intensive applications
  • Implement pipeline stages for high-speed data paths
  • Use timing constraints effectively to guide synthesis and implementation

Comparison with Similar FPGA Devices

Within Virtex-E Family

Model System Gates Logic Cells I/O Block RAM
XCV50E 50,000 ~10,800 176 32 Kb
XCV100E 100,000 ~21,600 176 64 Kb
XCV200E 200,000 ~43,200 176 128 Kb
XCV300E 300,000 ~64,800 316 192 Kb

Alternative Package Options

The XCV50E is available in multiple package configurations:

  • CS144: 144-pin ChipScale package (smaller footprint)
  • FG256: 256-pin Fine-pitch BGA (more I/O)
  • PQ240: 240-pin PQFP (balanced solution)

Support and Resources

Technical Documentation

  • Comprehensive datasheet with electrical specifications
  • User guide detailing architecture and design methodologies
  • Application notes for specific use cases
  • Configuration guides and programming references

Development Resources

  • Reference designs and example projects
  • IP core libraries for common functions
  • Online design forums and community support
  • Technical support from AMD/Xilinx

Frequently Asked Questions

Q: What is the difference between XCV50E-8PQG240C and XCV50E-8PQ240C?

A: The “G” suffix indicates RoHS-compliant lead-free packaging. The XCV50E-8PQG240C uses lead-free solder balls, while XCV50E-8PQ240C uses standard tin-lead.

Q: Can I use this FPGA for video processing applications?

A: Yes, with 176 I/O pins and high-speed performance, this FPGA is suitable for moderate-resolution video processing applications, though larger devices may be preferred for high-definition video.

Q: What configuration memory size is required?

A: The XCV50E requires approximately 559,232 bits of configuration data, typically stored in a Xilinx XC18V01 or equivalent serial PROM.

Q: Is this device still in production?

A: While the Virtex-E family is a mature product line, availability varies. Check with authorized distributors for current stock and lead times.

Q: What I/O standards are supported?

A: The device supports multiple I/O standards including LVTTL, LVCMOS (1.8V, 2.5V, 3.3V), LVDS, SSTL, HSTL, and other industry-standard interfaces.

Why Choose XCV50E-8PQG240C?

The XCV50E-8PQG240C represents an excellent choice for engineers requiring:

  • Proven Technology: Mature and well-documented FPGA platform
  • Performance: High-speed operation with -8 speed grade
  • Flexibility: 176 I/O pins and versatile logic resources
  • Cost-Effectiveness: Balanced features for mid-range applications
  • Reliability: Commercial temperature range with robust design
  • Development Support: Extensive tools and resources available

Whether you’re designing telecommunications equipment, industrial control systems, or custom embedded solutions, the XCV50E-8PQG240C delivers the performance and flexibility needed for successful project implementation.

Conclusion

The XCV50E-8PQG240C Xilinx Virtex-E FPGA stands as a reliable, high-performance solution for a wide range of digital design applications. With its 50,000 system gates, 176 I/O pins, and advanced 0.18μm technology, this device offers the ideal combination of logic capacity, performance, and I/O resources for demanding embedded systems.

The -8 speed grade ensures optimal performance for timing-critical applications, while the 240-pin PQFP package provides a practical form factor for professional PCB designs. Whether you’re developing next-generation telecommunications equipment, sophisticated industrial controllers, or custom data acquisition systems, the XCV50E-8PQG240C provides the programmable logic foundation for innovation.

For engineers seeking a proven, well-supported FPGA platform with excellent performance characteristics, the XCV50E-8PQG240C remains a compelling choice in the programmable logic landscape.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.