The XCV600E-6FG676C is a powerful field-programmable gate array (FPGA) from AMD’s (formerly Xilinx) renowned Virtex-E family, designed to deliver exceptional performance for complex digital systems. This commercial-grade FPGA combines high logic density, flexible I/O options, and robust performance characteristics, making it an ideal choice for telecommunications, industrial control, and embedded system applications.
Overview of XCV600E-6FG676C FPGA
The XCV600E-6FG676C represents a significant advancement in programmable logic technology, offering engineers and designers a versatile platform for implementing sophisticated digital designs. As part of the Virtex-E series, this FPGA leverages advanced 0.18μm CMOS technology to deliver superior performance while maintaining commercial operating temperature specifications.
Key Features at a Glance
- 985,882 system gates for complex logic implementation
- 444 user I/O pins for extensive connectivity
- 294,912 RAM bits for embedded memory applications
- 676-pin FBGA package (27mm x 27mm) for high-density mounting
- Commercial temperature range: 0°C to 85°C (TJ)
- Speed grade -6 for reliable timing performance
Technical Specifications
Core Architecture Specifications
| Specification |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCV600E-6FG676C |
| Product Family |
Virtex-E |
| Logic Elements/Cells |
15,552 |
| Configurable Logic Blocks (CLBs) |
3,456 |
| System Gates |
985,882 |
| Device Logic Gates |
186,624 |
| Maximum Internal Frequency |
357 MHz |
Memory and I/O Capabilities
| Feature |
Specification |
| Total RAM Bits |
294,912 |
| Number of I/O |
444 user I/O pins |
| Maximum User I/Os |
444 |
| I/O Flexibility |
Multiple voltage standards supported |
Electrical and Physical Parameters
| Parameter |
Value |
| Supply Voltage (Core) |
1.71V ~ 1.89V (Typical 1.8V) |
| Process Technology |
0.18μm CMOS |
| Package Type |
676-FBGA (Fine-Pitch Ball Grid Array) |
| Package Dimensions |
27mm x 27mm |
| Pin Count |
676 pins |
| Mounting Type |
Surface Mount |
| Operating Temperature |
0°C ~ 85°C (Junction Temperature) |
| Moisture Sensitivity Level (MSL) |
Level 3 (168 Hours) |
Understanding the Virtex-E FPGA Architecture
The Virtex-E family revolutionized FPGA design by optimizing silicon efficiency through advanced place-and-route capabilities and aggressive multi-layer metal interconnect technology. The XCV600E-6FG676C builds upon this foundation with several architectural enhancements.
Logic Resources Breakdown
| Resource Type |
Quantity |
Purpose |
| CLBs (Configurable Logic Blocks) |
3,456 |
Primary logic implementation units |
| Logic Cells |
15,552 |
Fundamental programmable elements |
| Block RAM |
294,912 bits |
Distributed memory for data storage |
| System Gates |
985,882 |
Overall logic capacity metric |
I/O Banking and Configuration
The 444 I/O pins on the XCV600E-6FG676C support multiple voltage standards, enabling seamless interface with various system components. The 676-ball FBGA package provides optimal signal integrity for high-speed applications while maintaining a compact footprint suitable for space-constrained designs.
Performance Characteristics
Speed Grade Analysis
The -6 speed grade designation indicates this device’s timing characteristics. This commercial-grade speed bin offers:
- Balanced performance for most embedded applications
- Reliable timing closure for designs up to 357 MHz internal frequency
- Predictable delay characteristics for critical path analysis
- Industry-standard timing specifications for design portability
Power Consumption Considerations
| Power Aspect |
Details |
| Core Voltage |
1.8V nominal (1.71V – 1.89V range) |
| Power Efficiency |
0.18μm process technology |
| Dynamic Power |
Design-dependent (varies with logic utilization) |
| Static Power |
Optimized for commercial applications |
Application Areas for XCV600E-6FG676C
Telecommunications Systems
The high I/O count and substantial logic resources make the XCV600E-6FG676C excellent for:
- Protocol converters and bridges
- Digital signal processing pipelines
- Data packet processing engines
- Communication interface controllers
Industrial Control and Automation
Industrial applications benefit from:
- Real-time control system implementation
- Motor control and drive systems
- Sensor data acquisition and processing
- PLC (Programmable Logic Controller) functionality
Embedded Computing Solutions
The FPGA excels in:
- Coprocessor implementations for CPU offloading
- Custom peripheral interfaces
- High-speed data acquisition systems
- Image and video processing accelerators
Medical Electronics
Medical device designers utilize this FPGA for:
- Medical imaging systems
- Patient monitoring equipment
- Diagnostic instrumentation
- Real-time signal analysis
Programming and Configuration
Configuration Methods
| Method |
Interface |
Description |
| JTAG |
Standard 4-wire |
In-system programming and debugging |
| Master Serial |
SPI Flash |
Standalone boot from external memory |
| SelectMAP |
Parallel |
High-speed configuration interface |
| Slave Serial |
Chain configuration |
Multiple device programming |
Design Tools and Software
The XCV600E-6FG676C is supported by Xilinx ISE Design Suite, providing comprehensive development capabilities:
- HDL synthesis (VHDL and Verilog)
- Place and route optimization
- Timing analysis and closure
- Power estimation and optimization
- BitStream generation
Comparison with Other Virtex-E Devices
Virtex-E Family Positioning
| Device |
CLBs |
Logic Cells |
RAM Bits |
I/O Pins |
| XCV300E |
2,400 |
10,800 |
229,376 |
404 |
| XCV600E |
3,456 |
15,552 |
294,912 |
444 |
| XCV1000E |
6,144 |
27,648 |
524,288 |
548 |
| XCV2000E |
10,240 |
46,080 |
655,360 |
684 |
The XCV600E-6FG676C occupies a mid-range position, offering an optimal balance between logic capacity, I/O availability, and cost-effectiveness.
Package Information: 676-FBGA
Physical Package Details
| Attribute |
Specification |
| Package Type |
FBGA (Fine-Pitch Ball Grid Array) |
| Ball Count |
676 balls |
| Body Size |
27mm x 27mm |
| Ball Pitch |
Fine pitch for high-density routing |
| Thermal Performance |
Enhanced thermal dissipation |
PCB Design Considerations
When designing with the 676-FBGA package:
- Use minimum 6-layer PCB for proper power distribution
- Implement ground planes for signal integrity
- Follow Xilinx PCB design guidelines for routing
- Consider thermal vias for heat management
- Ensure proper impedance matching for high-speed signals
Quality and Reliability
Environmental Specifications
| Parameter |
Rating |
| Storage Temperature |
-65°C to +150°C |
| Operating Temperature (Junction) |
0°C to +85°C |
| Moisture Sensitivity |
MSL 3 (168 hours at 30°C/60% RH) |
| ESD Protection |
Built-in protection on all pins |
Standards Compliance
- RoHS Status: Non-compliant (contains lead)
- Product Status: Obsolete (legacy design support)
- Quality Grade: Commercial temperature range
- Manufacturing Process: Proven 0.18μm technology
Sourcing and Availability
Current Market Status
The XCV600E-6FG676C is classified as obsolete by AMD/Xilinx, meaning active production has ceased. However, the device remains available through:
- Authorized distributors with existing stock
- Electronic component brokers
- Surplus and excess inventory channels
- Qualified aftermarket suppliers
Packaging Options
| Package Format |
Description |
Use Case |
| Tray |
Standard packaging |
Production quantities |
| Tube |
Individual device protection |
Sample and prototype |
| Custom |
Volume-specific |
High-volume manufacturing |
Design Migration and Alternatives
Legacy Design Support
For existing designs using XCV600E-6FG676C, consider:
- Securing long-term inventory for product lifecycle
- Qualifying alternative sources for continuity
- Evaluating migration paths to current-generation FPGAs
- Implementing last-time-buy strategies
Modern Alternatives
Designers starting new projects should consider current-generation Xilinx FPGA families:
- Artix-7 Series: Cost-optimized for volume applications
- Kintex-7 Series: Mid-range performance and capacity
- Zynq-7000: Integration of ARM processors with FPGA fabric
- Spartan-7: Entry-level FPGA solutions
Frequently Asked Questions
What makes the XCV600E-6FG676C suitable for embedded applications?
The combination of 444 I/O pins, 294,912 RAM bits, and 15,552 logic cells provides sufficient resources for implementing complex embedded system peripherals, custom interfaces, and processing functions while maintaining a compact 676-ball package.
Can I still purchase the XCV600E-6FG676C for new designs?
While the device is obsolete, inventory is still available through authorized distributors and aftermarket suppliers. For new designs, consider evaluating modern alternatives from the 7-series or UltraScale families that offer enhanced performance and active product support.
What programming tools are required?
The XCV600E-6FG676C requires Xilinx ISE Design Suite for development. Programming hardware options include Platform Cable USB, Digilent programming cables, or any JTAG-compatible programmer supporting Xilinx devices.
What is the typical power consumption?
Power consumption varies significantly based on design implementation, clock frequency, I/O activity, and logic utilization. The core operates at 1.8V nominal voltage. Use Xilinx Power Estimator (XPE) tool within ISE for accurate power analysis of specific designs.
Is the device compatible with lead-free assembly processes?
The XCV600E-6FG676C is not RoHS compliant and contains lead. Special exemptions may apply for industrial and legacy equipment. Consult local regulations regarding lead-bearing components in your target market.
Conclusion
The XCV600E-6FG676C FPGA represents proven Virtex-E technology, offering substantial logic resources, flexible I/O capabilities, and reliable performance for commercial-grade applications. With 3,456 CLBs, 444 I/O pins, and 294,912 RAM bits in a compact 676-ball FBGA package, this device continues to serve legacy designs while designers consider migration paths to current-generation FPGA families.
Whether maintaining existing systems or evaluating this FPGA for specialized applications, the XCV600E-6FG676C delivers the programmable logic capabilities that made the Virtex-E family an industry standard. For comprehensive Xilinx FPGA solutions and expert guidance on FPGA selection, explore modern alternatives that build upon this proven architectural foundation.
