Overview of the XC2S200-6FGG936C FPGA
The XC2S200-6FGG936C is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-II family, designed to deliver exceptional value for cost-sensitive applications. This device combines advanced features with reliable performance, making it ideal for industrial control systems, telecommunications equipment, and consumer electronics applications.
Key Technical Specifications
| Specification |
Details |
| Logic Cells |
200,000 system gates |
| CLBs (Configurable Logic Blocks) |
1,200 |
| Package Type |
FGG936 (Fine-Pitch Ball Grid Array) |
| Speed Grade |
-6 (Standard Performance) |
| Total I/O Pins |
Up to 624 user I/O |
| Operating Voltage |
2.5V core / 3.3V I/O |
| Temperature Range |
Commercial (0°C to +85°C) |
Architecture and Performance Features
Core Logic Architecture
The XC2S200-6FGG936C features Xilinx’s proven Spartan-II architecture, delivering robust performance for mid-range FPGA applications. The device provides sufficient logic resources for complex digital designs while maintaining power efficiency and cost-effectiveness.
Memory Resources
| Memory Type |
Capacity |
| Block RAM |
56 Kbits total |
| Distributed RAM |
Configurable from CLB resources |
| RAM Blocks |
14 blocks (4 Kbit each) |
Clock Management
The device includes dedicated clock management resources:
- DLLs (Delay Locked Loops): 4 DLLs for precise clock distribution
- Global Clock Networks: Low-skew distribution across the device
- Clock Frequency: Up to 200 MHz system performance
Package and Pin Configuration
FGG936 Package Details
The FGG936 package offers maximum I/O density for high pin-count applications:
| Package Feature |
Specification |
| Pin Count |
936 pins |
| Ball Pitch |
1.0mm |
| Package Dimensions |
31mm × 31mm |
| Thermal Performance |
Enhanced heat dissipation |
| Mounting Type |
Surface mount |
I/O Standards Support
The XC2S200-6FGG936C supports multiple I/O standards, ensuring compatibility with various system interfaces:
- LVTTL and LVCMOS (3.3V, 2.5V)
- PCI (33 MHz, 66 MHz compatible)
- GTL and GTL+
- SSTL-2 and SSTL-3
- HSTL Class I and II
Application Areas
Industrial Control Systems
The XC2S200-6FGG936C excels in industrial automation applications, providing:
- Real-time control processing
- Multiple protocol interfaces
- Reliable operation in demanding environments
- Long-term availability
Telecommunications Infrastructure
This FPGA is well-suited for telecom applications including:
- Protocol conversion and bridging
- Data packet processing
- Signal conditioning and filtering
- Interface standardization
Consumer Electronics
Cost-effective solution for high-volume consumer products:
- Digital signal processing
- Video/audio processing
- Display controllers
- Embedded system integration
Design Tools and Development Support
| Tool Category |
Available Resources |
| Design Software |
Xilinx ISE Design Suite |
| Synthesis |
XST (Xilinx Synthesis Technology) |
| Simulation |
ModelSim, ISim |
| Programming |
iMPACT, JTAG, Slave Serial |
| IP Cores |
CORE Generator System |
Power Management Characteristics
Power Consumption Profile
| Operating Mode |
Typical Power |
| Static Power |
Low standby current |
| Dynamic Power |
Depends on toggle rate and design |
| Core Voltage |
2.5V ± 5% |
| I/O Supply |
3.3V, 2.5V options |
Ordering and Configuration Information
Part Number Breakdown
XC2S200-6FGG936C
- XC2S200: Device family and density
- 6: Speed grade (standard performance)
- FGG936: Package type and pin count
- C: Commercial temperature range
Configuration Options
The device supports multiple configuration modes:
- Master Serial
- Slave Serial
- Master SelectMAP
- Slave SelectMAP
- Boundary Scan (JTAG)
Competitive Advantages
Why Choose the XC2S200-6FGG936C
- High I/O Count: Maximum connectivity with 936-pin package
- Proven Reliability: Mature Spartan-II architecture
- Design Flexibility: Abundant logic and memory resources
- Cost Efficiency: Optimal price-to-performance ratio
- Industry Support: Extensive documentation and tools
Integration and Design Considerations
PCB Layout Guidelines
| Design Parameter |
Recommendation |
| Power Plane Design |
Separate analog/digital planes |
| Decoupling |
0.1µF capacitors at each power pin |
| Signal Integrity |
Controlled impedance traces |
| Thermal Management |
Adequate copper pour for heat dissipation |
Compatible Components
The XC2S200-6FGG936C integrates seamlessly with standard components including:
- PROM configuration devices
- SRAM and Flash memory
- Standard logic interfaces
- Microcontroller and processor interfaces
Quality and Reliability Standards
The device meets stringent quality standards:
- RoHS compliant
- Automotive-grade options available
- Extended temperature range variants
- Comprehensive testing and validation
Resources for Xilinx FPGA Designers
Developers working with Xilinx FPGA solutions can access comprehensive design resources, application notes, and technical documentation to accelerate their development cycles and optimize system performance.
Conclusion: Maximizing Value with the XC2S200-6FGG936C
The XC2S200-6FGG936C represents an excellent choice for applications requiring substantial I/O capabilities combined with moderate logic resources. Its FGG936 package provides maximum connectivity options, while the Spartan-II architecture delivers proven reliability and performance. Whether you’re developing industrial control systems, telecommunications equipment, or consumer electronics, this FPGA offers the flexibility and features needed for successful product implementation.
For engineers seeking a balanced combination of logic capacity, I/O count, and cost-effectiveness, the XC2S200-6FGG936C stands as a compelling solution backed by Xilinx’s industry-leading support and design tools.
