Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG932C: Complete Technical Guide and Product Specifications

Product Details

The XC2S200-6FGG932C is a high-performance field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family. This versatile programmable logic device delivers exceptional value for cost-sensitive applications requiring moderate logic density and I/O capabilities. Designed for industrial control, telecommunications, and embedded systems, this FPGA combines proven reliability with flexible configuration options.

Key Features and Specifications

Core Architecture Specifications

Specification Details
Logic Cells 200,000 system gates
CLBs (Configurable Logic Blocks) 1,176 CLBs
Total I/O Pins 565 user I/O
Package Type FGG932 (Fine-pitch BGA)
Speed Grade -6 (Standard performance)
Operating Voltage 2.5V core / 3.3V I/O

Memory and Storage Capabilities

The XC2S200-6FGG932C integrates substantial embedded memory resources:

  • Block RAM: 56 Kbits of dual-port RAM
  • Distributed RAM: Available through CLB resources
  • Configuration Memory: Fast programming and reconfiguration
  • Look-Up Tables (LUTs): 4-input function generators per CLB

Package Information: FGG932

Physical Characteristics

Parameter Value
Package Style Fine-pitch Ball Grid Array
Total Balls 932 pins
Package Dimensions 31mm x 31mm
Ball Pitch 1.0mm
Body Thickness Optimized for PCB mounting

The FGG932 package provides maximum I/O availability, making it ideal for applications requiring extensive connectivity and signal routing flexibility.

Performance Specifications

Speed and Timing Parameters

  • Maximum Internal Clock Frequency: Up to 200 MHz
  • Propagation Delay: Optimized for -6 speed grade
  • Setup/Hold Times: Industry-leading performance
  • Toggle Frequency: High-speed operation capability

Power Consumption Profile

Operating Mode Typical Power
Static Power Low standby consumption
Dynamic Power Application-dependent
I/O Power Varies with switching frequency
Power Supply Multiple voltage domains supported

Application Areas and Use Cases

Industrial Applications

The XC2S200-6FGG932C excels in demanding industrial environments:

  • Motor Control Systems: Precision PWM generation and feedback control
  • Factory Automation: PLC replacement and control logic
  • Process Monitoring: Real-time data acquisition and processing
  • Industrial Communications: Protocol conversion and interface bridging

Communications Infrastructure

  • Digital Signal Processing: FIR/IIR filter implementation
  • Protocol Handling: Custom communication standards
  • Data Routing: High-speed packet processing
  • Interface Bridging: Multi-protocol connectivity

Consumer Electronics

  • Display Controllers: Video processing and scaling
  • Audio Processing: Digital audio effects and routing
  • Embedded Systems: System-on-chip implementations
  • Gaming Peripherals: Custom logic and interface control

Design Resources and Development Support

Design Tools Compatibility

Tool Category Support
ISE Design Suite Full support for synthesis and implementation
Vivado Legacy device support
IP Cores Extensive library available
Simulation Tools ModelSim, ISim compatible

Programming and Configuration

The XC2S200-6FGG932C supports multiple configuration modes:

  • Master Serial Mode: Self-configuring from external PROM
  • Slave Serial Mode: Configuration via external controller
  • JTAG Programming: Boundary scan and debug support
  • SelectMAP Mode: Parallel configuration for faster startup

Technical Advantages

Why Choose XC2S200-6FGG932C?

  1. High I/O Density: The 932-pin package maximizes available user I/O
  2. Proven Architecture: Spartan-II family’s mature, reliable design
  3. Cost-Effective: Optimal price-per-gate ratio
  4. Abundant Resources: Sufficient logic and memory for complex designs
  5. Wide Operating Range: Industrial temperature variants available

Competitive Advantages

  • Superior I/O Count: More connectivity options than smaller packages
  • Flexibility: Programmable logic adapts to changing requirements
  • Time-to-Market: Rapid prototyping and iterative development
  • Long-Term Availability: Established product with ongoing support

Integration and Implementation Guidelines

PCB Design Considerations

Consideration Recommendation
Layer Count Minimum 6-8 layers for complex designs
Decoupling Multiple capacitors per power domain
Thermal Management Adequate copper pour and airflow
Signal Integrity Controlled impedance for high-speed signals

Power Supply Requirements

The XC2S200-6FGG932C requires carefully designed power distribution:

  • Core Voltage (VCCINT): 2.5V ±5% tolerance
  • I/O Voltage (VCCO): 1.5V to 3.3V (bank-dependent)
  • Auxiliary Voltage (VCCAUX): 2.5V for DLLs and other functions
  • Current Capacity: Design for peak transient loads

Reliability and Quality Standards

Environmental Specifications

  • Operating Temperature: Commercial (0°C to 85°C) or Industrial (-40°C to 100°C)
  • Storage Temperature: -65°C to 150°C
  • Humidity: Standard IC environmental ratings
  • ESD Protection: Human Body Model compliant

Quality Certifications

The device meets stringent quality standards including RoHS compliance and standard semiconductor reliability metrics.

Comparison with Alternative Solutions

When to Select XC2S200-6FGG932C

Choose this FPGA when your application requires:

  • High pin count: Projects needing 400+ I/O connections
  • Moderate logic density: Designs with 100K to 250K equivalent gates
  • Cost sensitivity: Budget-conscious projects requiring FPGA flexibility
  • Proven technology: Applications where mature, stable platforms are preferred

Getting Started with XC2S200-6FGG932C

Development Workflow

  1. Requirements Analysis: Define logic resources and I/O needs
  2. Design Entry: Use HDL (Verilog/VHDL) or schematic capture
  3. Synthesis: Compile design to FPGA primitives
  4. Implementation: Place and route for optimal performance
  5. Programming: Configure device and verify functionality

Essential Design Resources

  • Datasheet: Complete electrical and timing specifications
  • User Guide: Architecture overview and design guidelines
  • Reference Designs: Example projects and IP cores
  • Application Notes: Best practices and optimization techniques

Support and Resources

For comprehensive technical support and additional Xilinx FPGA product information, designers can access extensive documentation, reference designs, and community forums.

Available Documentation

Resource Type Content
Technical Datasheet Electrical characteristics and AC/DC parameters
Packaging Specifications Mechanical drawings and thermal data
Application Notes Design guidelines and optimization tips
Errata Known issues and workarounds

Procurement and Availability

Ordering Information

The complete part number XC2S200-6FGG932C breaks down as follows:

  • XC2S200: Device family and logic density
  • -6: Speed grade designation
  • FGG932: Package type and pin count
  • C: Commercial temperature range

Supply Chain Considerations

When sourcing the XC2S200-6FGG932C, consider:

  • Authorized Distributors: Ensure authentic components
  • Lead Times: Plan for potential extended delivery schedules
  • Inventory Management: Stock critical components for production continuity
  • Alternative Sourcing: Identify backup suppliers for business continuity

Conclusion

The XC2S200-6FGG932C represents an excellent choice for engineers seeking a balance between logic resources, I/O capability, and cost-effectiveness. Its 932-pin fine-pitch BGA package delivers maximum connectivity options while maintaining the proven Spartan-II architecture’s reliability and ease of use.

Whether you’re designing industrial control systems, communications equipment, or embedded applications, this FPGA provides the flexibility and performance needed for successful implementation. With comprehensive tool support, extensive documentation, and a mature ecosystem, the XC2S200-6FGG932C continues to serve as a reliable solution for diverse electronic design challenges.

Next Steps

To begin your design with the XC2S200-6FGG932C:

  1. Review complete datasheets and technical documentation
  2. Download appropriate development tools
  3. Explore reference designs relevant to your application
  4. Consult with technical support for design-specific questions
  5. Prototype and validate your design before production commitment

The combination of adequate logic resources, abundant I/O, and proven architecture makes the XC2S200-6FGG932C a compelling choice for modern FPGA-based designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.