Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG930C: Complete Technical Guide and Product Overview

Product Details

Introduction to XC2S200-6FGG930C FPGA

The XC2S200-6FGG930C is a high-performance field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family. This versatile programmable logic device delivers exceptional value for cost-sensitive applications while maintaining robust performance capabilities. Designed for engineers seeking reliable, scalable solutions, this FPGA combines advanced architecture with practical functionality.

Key Technical Specifications

Core Performance Parameters

Specification Details
Logic Cells 200,000 system gates
CLBs (Configurable Logic Blocks) 1,176
Maximum User I/O 692 pins
Package Type FGG930 (Fine-Pitch BGA)
Speed Grade -6 (Standard performance)
Operating Voltage 2.5V core, 3.3V I/O

Memory and Storage Capabilities

Memory Type Capacity
Distributed RAM 28 Kbits
Block RAM 56 Kbits (14 blocks)
Total RAM 84 Kbits

Architecture and Design Features

Advanced FPGA Architecture

The XC2S200-6FGG930C leverages Xilinx’s proven Spartan-II architecture, delivering exceptional flexibility for diverse applications. The device features a symmetrical array of configurable logic blocks interconnected through a comprehensive routing matrix, enabling efficient implementation of complex digital designs.

Package Configuration

The FGG930 package offers 930 fine-pitch ball grid array connections, providing maximum I/O density for sophisticated multi-interface applications. This compact footprint enables designers to maximize board space while maintaining signal integrity across high-speed interfaces.

Performance Characteristics

Speed and Timing

Parameter Specification
Speed Grade -6
Maximum Toggle Frequency Up to 200 MHz (design-dependent)
Pin-to-Pin Delay Optimized for standard applications

Power Consumption Profile

The device implements efficient power management strategies, balancing performance with energy efficiency. The dual-voltage architecture separates core logic from I/O operations, optimizing power distribution across different functional blocks.

Application Areas

Industrial Applications

  • Process control systems
  • Factory automation equipment
  • Motor control and motion systems
  • Instrumentation and measurement devices

Communications Infrastructure

  • Protocol conversion bridges
  • Network interface controllers
  • Data acquisition systems
  • Signal processing modules

Consumer Electronics

  • Digital signal processing applications
  • Video and image processing
  • Audio processing systems
  • Interface bridging solutions

Design Implementation Guidelines

Development Tools Compatibility

The XC2S200-6FGG930C integrates seamlessly with Xilinx ISE Design Suite, providing comprehensive development capabilities from schematic capture through bitstream generation. Designers benefit from advanced synthesis, simulation, and debugging tools optimized for Spartan-II devices.

Programming and Configuration

Configuration Mode Description
Master Serial FPGA controls configuration PROM
Slave Serial External controller manages configuration
Boundary Scan (JTAG) In-system programming and testing
SelectMAP Parallel configuration interface

Environmental and Reliability Specifications

Operating Conditions

Parameter Range
Operating Temperature 0°C to +85°C (Commercial)
Storage Temperature -65°C to +150°C
Relative Humidity 5% to 95% non-condensing

Quality and Compliance

The device meets stringent quality standards, ensuring reliable operation in demanding environments. Manufacturing processes comply with industry-standard quality management systems, delivering consistent performance across production batches.

Competitive Advantages

Cost-Effective Solution

The Spartan-II family delivers exceptional price-performance ratio, making the XC2S200-6FGG930C ideal for volume production applications. The device balances capability with affordability, enabling cost-conscious designs without compromising functionality.

Proven Reliability

Years of field deployment demonstrate the Spartan-II architecture’s robustness across diverse operating conditions. The mature technology platform provides design stability and long-term availability assurance.

Comprehensive Ecosystem

Access to extensive documentation, reference designs, and community support accelerates development cycles. The established Xilinx FPGA ecosystem provides resources from initial concept through production deployment.

Pin Configuration and Packaging

FGG930 Package Details

Package Feature Specification
Total Balls 930
Ball Pitch 1.0 mm
Package Dimensions 31 mm × 31 mm
Height 2.23 mm maximum

I/O Banking Structure

The device organizes I/O pins into banks supporting multiple voltage standards, enabling flexible interface implementation. Each bank can be independently configured for specific voltage levels and signaling standards.

Getting Started with XC2S200-6FGG930C

Design Entry Options

Engineers can leverage multiple design entry methodologies including schematic capture, VHDL, and Verilog HDL. The flexible design flow accommodates various development preferences and existing design assets.

Synthesis and Implementation

Modern synthesis tools optimize logic utilization and timing performance automatically. Place-and-route algorithms efficiently map designs to the FPGA architecture, maximizing resource utilization while meeting timing constraints.

Technical Support and Resources

Documentation Access

Comprehensive datasheets, application notes, and user guides provide detailed technical information. These resources cover everything from basic device operation through advanced implementation techniques.

Community and Forums

Active user communities share knowledge, design examples, and troubleshooting advice. Collaborative problem-solving accelerates development and reduces time-to-market for new applications.

Conclusion

The XC2S200-6FGG930C represents a mature, reliable FPGA solution for applications requiring substantial logic capacity in a compact, high-I/O-count package. Its balanced combination of performance, cost-effectiveness, and proven reliability makes it an excellent choice for industrial, communications, and consumer applications. With comprehensive tool support and extensive documentation, designers can confidently implement sophisticated digital systems using this versatile programmable logic device.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.