The XC2S200-6FGG917C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for demanding digital design applications. This advanced programmable logic device offers an optimal balance of functionality, cost-effectiveness, and flexibility, making it an ideal choice for engineers developing complex embedded systems, communication protocols, and digital signal processing solutions.
As part of the Spartan-II 2.5V FPGA family, the XC2S200-6FGG917C represents a superior alternative to traditional mask-programmed ASICs, eliminating initial tooling costs and lengthy development cycles while providing field-upgradeable capabilities that ensure long-term adaptability.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| Logic Cells |
5,292 |
| System Gates |
200,000 |
| CLB Array Configuration |
28 × 42 (1,176 total CLBs) |
| Maximum User I/O |
284 pins |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Operating Voltage |
2.5V |
| Technology Node |
0.18μm |
| Speed Grade |
-6 (Commercial temperature range) |
| Package Type |
917-ball Fine-Pitch BGA (FGG917) |
Package Configuration Details
The FGG917 package provides superior thermal and electrical performance through its fine-pitch ball grid array design. This advanced packaging technology enables:
- High-density interconnection with 917 solder balls
- Enhanced signal integrity for high-speed applications
- Improved thermal dissipation characteristics
- Reduced package footprint compared to traditional leaded packages
- RoHS-compliant lead-free (Pb-free) option indicated by the “G” designation
Performance Characteristics
Speed Grade and Timing Performance
The -6 speed grade of the XC2S200-6FGG917C offers excellent timing characteristics optimized for commercial temperature applications:
| Performance Metric |
Specification |
| Maximum Operating Frequency |
Up to 263 MHz |
| Commercial Temperature Range |
0°C to +85°C |
| Delay-Locked Loops (DLLs) |
4 (one per corner) |
| Global Clock Resources |
4 dedicated clock inputs |
Configurable Logic Block (CLB) Architecture
Each CLB in the XC2S200-6FGG917C contains:
- Four logic slices for maximum flexibility
- Fast carry logic for arithmetic operations
- Distributed RAM capability for data storage
- Dedicated multiplexers for efficient routing
- Support for both combinatorial and sequential logic
Application Areas for XC2S200-6FGG917C
Digital Signal Processing (DSP)
The XC2S200-6FGG917C excels in DSP applications requiring real-time processing:
- Audio/video signal processing and filtering
- Image processing and compression algorithms
- Software-defined radio (SDR) implementations
- Digital filter implementations (FIR/IIR)
Communication Systems
Ideal for modern communication infrastructure:
- Protocol conversion and bridging
- Data encoding/decoding systems
- Network packet processing
- Interface controllers (UART, SPI, I2C)
Industrial Control Applications
Perfect for automation and control systems:
- Motor control and drive systems
- PLC (Programmable Logic Controller) replacements
- Sensor interface and data acquisition
- Real-time control loop implementations
Embedded System Development
Versatile platform for embedded applications:
- Custom peripheral development
- System-on-Chip (SoC) prototyping
- Hardware acceleration modules
- Rapid prototyping and development
Design Advantages and Benefits
Cost-Effective Alternative to ASICs
| ASIC Approach |
XC2S200-6FGG917C FPGA |
| High NRE costs ($100K+) |
Zero NRE investment |
| 12-18 month development cycle |
Immediate implementation |
| No field updates possible |
In-field reprogrammability |
| High risk of design errors |
Iterative design refinement |
| Minimum order quantities |
Flexible production volumes |
Programmability and Flexibility
The XC2S200-6FGG917C offers unmatched design flexibility:
- Reconfigurable architecture allows design modifications without hardware changes
- Field upgradeable functionality enables bug fixes and feature enhancements post-deployment
- Partial reconfiguration support for dynamic functionality updates
- Multiple configuration modes including JTAG, Master Serial, and Slave Serial
Development Ecosystem
Xilinx provides comprehensive development tools for the XC2S200-6FGG917C:
- ISE Design Suite for synthesis and implementation
- ChipScope Pro for in-system debugging
- Extensive IP core library for common functions
- Comprehensive simulation and verification tools
Memory Architecture and Resources
Block RAM Configuration
The XC2S200-6FGG917C includes 56K bits of block RAM organized as:
| Block RAM Feature |
Specification |
| Total Block RAM |
56 Kbits |
| Block RAM Columns |
2 (located on opposite sides of die) |
| Configurable Width |
1, 2, 4, 8, 16 bits |
| Depth Options |
Variable based on width configuration |
| Dual-Port Support |
True dual-port capability |
Distributed RAM Capabilities
With 75,264 bits of distributed RAM, designers can:
- Implement small memory buffers within logic fabric
- Create high-speed lookup tables (LUTs)
- Build FIFO structures for data buffering
- Develop shift register implementations
Input/Output Architecture
I/O Banking and Standards
The XC2S200-6FGG917C supports multiple I/O standards for versatile interfacing:
| I/O Standard |
Voltage Level |
Application |
| LVTTL |
3.3V |
General-purpose I/O |
| LVCMOS |
2.5V, 3.3V |
Low-voltage CMOS interface |
| PCI |
3.3V |
PCI bus interface |
| GTL+ |
Terminated |
High-speed backplane |
High I/O Count Benefits
With 284 maximum user I/O pins, the device enables:
- Complex multi-interface designs
- High-bandwidth data acquisition systems
- Multiple peripheral connections
- Extensive GPIO for custom applications
Power Management Features
Efficient Power Architecture
The 2.5V core voltage of the XC2S200-6FGG917C delivers:
| Power Feature |
Benefit |
| 2.5V Core Operation |
Reduced power consumption |
| Multiple I/O Voltages |
Interface flexibility |
| Selective I/O Banking |
Optimized power distribution |
| Low Static Power |
Extended battery life in portable applications |
Configuration and Programming
Flexible Configuration Options
The XC2S200-6FGG917C supports multiple configuration modes:
- Master Serial Mode – FPGA controls configuration PROM
- Slave Serial Mode – External microcontroller drives configuration
- JTAG Mode – Boundary scan and in-system programming
- Boundary Scan – IEEE 1149.1 compliant testing
Configuration Memory
- Fast configuration times (typically milliseconds)
- Bitstream encryption support for IP protection
- CRC verification for configuration integrity
- Readback capability for verification
Reliability and Quality Standards
Manufacturing Quality
The XC2S200-6FGG917C meets stringent quality requirements:
- Manufactured using proven 0.18μm CMOS process
- Extensive production testing and screening
- High reliability in commercial environments
- Long product lifecycle support
Compliance and Certifications
| Standard |
Compliance |
| RoHS |
Lead-free option available (FGG917) |
| JEDEC |
Package standards compliant |
| ESD Protection |
Human Body Model (HBM) tested |
| Moisture Sensitivity |
MSL Level 3 |
Design Resources and Support
Getting Started with XC2S200-6FGG917C
Engineers can leverage extensive Xilinx resources:
- Comprehensive datasheets and technical documentation
- Application notes for common design patterns
- Reference designs and example projects
- Online community forums and technical support
Compatible Development Boards
While evaluating the XC2S200-6FGG917C, consider:
- Custom PCB design with 917-ball BGA footprint
- Professional prototyping services
- BGA rework and assembly considerations
- Thermal management planning for high-performance applications
Xilinx FPGA Product Line Integration
The XC2S200-6FGG917C represents Xilinx’s commitment to delivering versatile FPGA solutions across diverse application domains. As part of the broader Spartan-II family, this device shares architectural compatibility with other family members while offering unique advantages through its high I/O count and fine-pitch BGA packaging.
PCB Design Considerations for FGG917 Package
Layout Guidelines
Critical PCB design factors for the 917-ball package:
| Design Aspect |
Recommendation |
| PCB Layers |
Minimum 6-8 layers for complex designs |
| Ball Pitch |
1.00mm fine-pitch spacing |
| Pad Type |
Non-solder mask defined (NSMD) preferred |
| Via-in-Pad |
Recommended for high-density routing |
| Thermal Management |
Adequate ground planes and thermal vias |
Signal Integrity Considerations
- Controlled impedance routing for high-speed signals
- Proper power distribution network design
- Decoupling capacitor placement near BGA balls
- Ground plane integrity maintenance
- Differential pair routing for critical signals
Comparison with Alternative Solutions
XC2S200 vs. Other Spartan-II Devices
| Feature |
XC2S150 |
XC2S200-6FGG917C |
XC2S300 |
| Logic Cells |
3,888 |
5,292 |
7,776 |
| System Gates |
150K |
200K |
300K |
| Max User I/O |
260 |
284 |
344 |
| Block RAM |
48K |
56K |
72K |
| CLB Array |
24×36 |
28×42 |
32×48 |
Procurement and Availability
Ordering Information
When specifying the XC2S200-6FGG917C, note the following part number breakdown:
- XC2S200 – Device designation (200K gates)
- -6 – Speed grade (commercial temperature)
- FGG917 – Package type (917-ball fine-pitch BGA, lead-free)
- C – Commercial temperature range (0°C to +85°C)
Quality Assurance
All XC2S200-6FGG917C devices undergo:
- 100% functionality testing
- Boundary scan verification
- Speed and timing characterization
- Package integrity inspection
Technical Support and Documentation
Available Resources
Engineers working with the XC2S200-6FGG917C can access:
- Datasheet DS001 – Complete electrical and timing specifications
- User Guides – Detailed architectural descriptions
- Application Notes – Design best practices and solutions
- Answer Records – Technical issue resolutions
- IBIS Models – Signal integrity simulation
Future-Proof Design Strategy
Long-Term Advantages
Choosing the XC2S200-6FGG917C provides:
- Scalability – Easy migration to higher-density Spartan-II devices
- Longevity – Mature product with established supply chain
- Upgrade Path – In-field firmware updates extend product lifetime
- Risk Mitigation – Avoid ASIC obsolescence and redesign costs
- Development Speed – Rapid prototyping to production transition
Conclusion: Why Choose XC2S200-6FGG917C
The XC2S200-6FGG917C represents an optimal balance of performance, flexibility, and cost-effectiveness for mid-range FPGA applications. With its substantial logic resources, extensive I/O capabilities, and proven reliability, this device serves as an excellent foundation for:
- Professional embedded system development
- Communication infrastructure projects
- Industrial automation solutions
- Digital signal processing applications
- Rapid prototyping and product development
The combination of 200,000 system gates, 284 user I/O pins, and advanced BGA packaging makes the XC2S200-6FGG917C an ideal choice for engineers seeking a reliable, high-performance programmable logic solution that delivers both immediate functionality and long-term value.
Whether you’re developing next-generation communication systems, implementing sophisticated control algorithms, or building custom embedded platforms, the XC2S200-6FGG917C provides the resources, flexibility, and performance characteristics needed to bring your designs to life efficiently and cost-effectively.
