The XC2S200-6FGG914C is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for complex digital designs across telecommunications, industrial automation, embedded systems, and high-speed data processing applications.
Featuring a robust 914-ball Fine-pitch Ball Grid Array (FBGA) package, the XC2S200-6FGG914C offers maximum I/O flexibility with 284 user I/O pins, enabling seamless integration into space-constrained and demanding electronic designs. The -6 speed grade ensures optimal performance for time-critical applications requiring high-speed signal processing.
Key Technical Specifications
Core Performance Features
| Specification |
Value |
| Device Family |
Spartan-II |
| Part Number |
XC2S200-6FGG914C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
1,176 (28 x 42 array) |
| Speed Grade |
-6 (High Performance) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm |
| Maximum Operating Frequency |
263 MHz |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Total Embedded Memory |
131,328 bits |
Package and I/O Specifications
| Feature |
Details |
| Package Type |
FGG914 (Fine-pitch Ball Grid Array) |
| Total Balls |
914 |
| Maximum User I/O |
284 pins |
| Temperature Range |
Commercial (0°C to +85°C) |
| Package Material |
Pb-free (RoHS Compliant) |
Why Choose XC2S200-6FGG914C?
Superior Logic Density
With 200,000 system gates and 5,292 logic cells, the XC2S200-6FGG914C delivers substantial computational power for implementing sophisticated digital circuits. The 1,176 configurable logic blocks arranged in a 28×42 array provide the flexibility needed for complex algorithm implementation.
Maximum I/O Flexibility
The 914-ball FBGA package offers the highest pin count in the XC2S200 series, providing 284 user I/O pins. This exceptional I/O capability makes it perfect for applications requiring extensive external interface connections, including multi-channel data acquisition systems, communication hubs, and high-density signal processing platforms.
High-Speed Performance
The -6 speed grade designation indicates this device’s capability to operate at maximum performance levels, supporting clock frequencies up to 263 MHz. This makes the XC2S200-6FGG914C suitable for time-critical applications demanding low latency and high throughput.
Cost-Effective Programmability
Unlike fixed-function ASICs, the XC2S200-6FGG914C offers field-programmable flexibility, eliminating costly mask charges and lengthy fabrication cycles. Design updates and feature enhancements can be implemented through simple reprogramming, dramatically reducing time-to-market and development risks.
Primary Applications
Telecommunications Infrastructure
The XC2S200-6FGG914C excels in telecommunications equipment, including:
- Base station controllers
- Protocol converters
- Digital signal processing modules
- Network switching equipment
- Communication protocol implementations
Industrial Automation and Control
Perfect for industrial environments requiring:
- Motor control systems
- Process automation controllers
- Machine vision processors
- Sensor interface modules
- Real-time data acquisition systems
Embedded Systems Development
Ideal for embedded applications such as:
- Custom computing platforms
- Digital signal processors (DSP)
- Image processing systems
- Video/audio codec implementations
- Cryptographic accelerators
High-Speed Data Processing
Excellent choice for:
- Data acquisition systems
- High-frequency trading platforms
- Radar signal processing
- Scientific instrumentation
- Test and measurement equipment
Architecture Highlights
Configurable Logic Block (CLB) Structure
Each CLB in the XC2S200-6FGG914C contains:
- Four logic slices with look-up tables (LUTs)
- Fast carry logic for arithmetic operations
- Distributed RAM capabilities
- Flexible flip-flop configurations
- Dedicated multiplexer resources
Embedded Memory System
The dual-layer memory architecture includes:
- Distributed RAM: 75,264 bits integrated within CLBs for small, fast storage
- Block RAM: 56 Kbits organized in dedicated memory blocks for larger data buffers
- Configurable memory width and depth
- Synchronous read/write operations
Input/Output Architecture
The I/O blocks (IOBs) provide:
- Support for multiple I/O standards
- Programmable slew rate control
- Individual tri-state buffers
- Input delay compensation
- Output drive strength adjustment
Clock Management
Four Delay-Locked Loops (DLLs) positioned at chip corners offer:
- Clock deskewing capabilities
- Frequency synthesis
- Phase shifting
- Low-jitter clock distribution
Design Tools and Programming
Supported Development Software
The XC2S200-6FGG914C is fully supported by AMD Xilinx development tools:
- Vivado Design Suite – Comprehensive FPGA design environment
- ISE Design Suite – Legacy design software (compatible)
- FPGA Editor – Low-level design manipulation
- ChipScope Pro – On-chip debugging and verification
Programming Options
Multiple configuration methods available:
- JTAG boundary scan programming
- Serial peripheral interface (SPI) flash
- Master/slave serial mode
- SelectMAP parallel configuration
- Platform Flash PROM support
Comparison with Other Package Options
| Package Type |
Ball Count |
Max User I/O |
Typical Applications |
| FGG914 |
914 |
284 |
High-density designs, maximum I/O requirements |
| FGG456 |
456 |
284 |
Balanced size and I/O capability |
| FG256 |
256 |
176 |
Compact designs, moderate I/O needs |
| PQ208 |
208 |
176 |
Cost-sensitive applications |
The FGG914 package provides the largest physical footprint and highest ball count, making it the preferred choice when maximum signal integrity, thermal performance, and I/O density are required.
Power Consumption Characteristics
Operating Voltage Requirements
| Power Rail |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic supply |
| VCCO |
1.5V to 3.3V |
I/O bank supply (configurable) |
| VCCAUX |
2.5V |
Auxiliary circuits (DLLs, etc.) |
Power Optimization Features
- Low quiescent current consumption
- Dynamic power scaling based on switching activity
- Selective clock gating capabilities
- Power-down mode support for inactive logic
Quality and Reliability
Manufacturing Standards
- Advanced 0.18μm CMOS process technology
- Rigorous testing and quality control
- RoHS compliant Pb-free packaging
- Automotive-grade temperature options available
Long-Term Availability
As part of the established Spartan-II family, the XC2S200-6FGG914C benefits from:
- Extended product lifecycle support
- Comprehensive documentation and application notes
- Large installed base with proven field reliability
- Active community support and design resources
Getting Started with XC2S200-6FGG914C
Development Board Options
Several third-party development boards feature the XC2S200 series:
- Evaluation platforms with peripheral interfaces
- Academic teaching boards
- Custom prototype platforms
- Professional development kits
Design Resources
Access comprehensive support materials:
- Detailed datasheets with electrical specifications
- Application notes for common design patterns
- Reference designs and IP cores
- Technical support forums and communities
Ordering Information
Part Number Breakdown:
- XC2S200 – Device family and gate count
- -6 – Speed grade (highest performance)
- FGG914 – Package type (914-ball FBGA)
- C – Commercial temperature range (0°C to +85°C)
Xilinx (now AMD) has established itself as the global leader in programmable logic solutions. The Spartan-II family represents a mature, proven platform with:
- Decades of successful deployments across industries
- Comprehensive ecosystem of tools and IP
- Extensive third-party support
- Migration paths to newer FPGA families
Whether you’re developing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG914C delivers the perfect balance of performance, flexibility, and cost-effectiveness.
Technical Support and Documentation
Available Resources
Designers working with the XC2S200-6FGG914C can access:
- Complete datasheet with timing specifications
- PCB layout guidelines for FGG914 package
- Thermal management application notes
- Signal integrity design recommendations
- Configuration and programming guides
Community and Support
- Active user forums with experienced developers
- AMD technical support channels
- Third-party consulting services
- Academic and research partnerships
Conclusion
The XC2S200-6FGG914C represents an excellent choice for engineers requiring high-performance programmable logic with maximum I/O flexibility. Its 914-ball FBGA package, 200,000 system gates, and 284 user I/O pins make it ideal for complex digital designs in telecommunications, industrial automation, and embedded systems.
With proven reliability, comprehensive tool support, and the flexibility of field-programmable technology, the XC2S200-6FGG914C continues to be a trusted solution for demanding applications worldwide.
For detailed specifications, pricing information, and technical support, explore the complete range of Xilinx FPGA solutions to find the perfect device for your next project.
