The XC2S200-6FGG908C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, designed to deliver exceptional performance for complex digital designs. With 200,000 system gates and 5,292 logic cells, this FPGA provides designers with a flexible, cost-effective solution for implementing sophisticated digital circuits without the lengthy development cycles and high upfront costs associated with traditional ASICs.
Key Technical Specifications
Core Features and Capabilities
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
1,176 (28 x 42 array) |
| Maximum User I/O |
284 pins |
| Total Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (263 MHz) |
| Technology Node |
0.18μm CMOS |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
Performance Specifications Table
| Parameter |
Specification |
Benefits |
| Maximum Operating Frequency |
263 MHz |
High-speed signal processing |
| Power Supply |
2.5V Core / 3.3V I/O |
Low power consumption |
| Operating Temperature |
Commercial (0°C to +85°C) |
Reliable industrial operation |
| Technology Process |
0.18 micron |
Proven, stable technology |
| Configuration Time |
< 100ms |
Fast system boot-up |
Understanding the XC2S200-6FGG908C Part Number
The part number provides crucial information about this Xilinx FPGA:
- XC2S200: Spartan-II family with 200K system gates
- -6: Speed grade indicating 263 MHz performance
- FGG908: Fine-pitch Ball Grid Array package with enhanced thermal performance
- C: Commercial temperature range (0°C to +85°C)
Architecture and Design Features
Configurable Logic Block Architecture
The XC2S200-6FGG908C features a sophisticated CLB architecture organized in a 28 x 42 array, providing 1,176 total configurable logic blocks. Each CLB contains:
- Four logic slices with look-up tables (LUTs)
- Dedicated flip-flops for sequential logic
- Fast carry logic for arithmetic operations
- Distributed RAM capability for embedded memory
Memory Resources Overview
| Memory Type |
Capacity |
Applications |
| Block RAM |
56 Kbits (7 KB) |
Data buffering, FIFO implementation |
| Distributed RAM |
75,264 bits |
Small memory arrays, lookup tables |
| Total Available RAM |
131,264 bits |
Flexible memory architecture |
Input/Output Capabilities
The XC2S200-6FGG908C offers extensive I/O options with 284 maximum user I/O pins, supporting:
- Multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL)
- Programmable drive strength
- Configurable pull-up/pull-down resistors
- Hot swapping capability
- Individual I/O register configuration
Application Areas for XC2S200-6FGG908C
Industrial Automation and Control
The XC2S200-6FGG908C excels in industrial control applications requiring:
- Motor control systems
- Process automation controllers
- PLC (Programmable Logic Controller) implementations
- Real-time monitoring systems
- Sensor interface circuits
Communication Systems and Networking
Ideal for communication infrastructure:
- Protocol converters and bridges
- Network packet processors
- Data encryption/decryption modules
- Communication interface controllers
- Signal conditioning circuits
Digital Signal Processing Applications
Perfect for DSP implementations:
- Digital filters (FIR, IIR)
- Fast Fourier Transform (FFT) engines
- Image processing pipelines
- Audio signal processing
- Video processing systems
Consumer Electronics
Well-suited for consumer products:
- Display controllers
- Gaming systems
- Set-top boxes
- Digital cameras
- Audio/video equipment
Technical Advantages and Benefits
Compared to ASIC Solutions
| Feature |
XC2S200-6FGG908C FPGA |
Traditional ASIC |
| Initial Development Cost |
Low (no NRE) |
High ($100K-$1M+) |
| Time to Market |
Days to weeks |
6-12 months |
| Design Flexibility |
Fully reconfigurable |
Fixed after fabrication |
| Risk Level |
Low |
High |
| Prototype Cost |
Minimal |
Very high |
| Field Updates |
Fully supported |
Impossible |
Key Competitive Advantages
- Rapid Prototyping: Test and validate designs within days
- Cost-Effective: No mask costs or minimum order quantities
- Reconfigurable: Update designs in the field without hardware changes
- Proven Technology: Mature 0.18μm process ensures reliability
- Extensive Tool Support: ISE Design Suite with comprehensive libraries
Design Resources and Development Tools
Software and Design Environment
The XC2S200-6FGG908C is supported by Xilinx ISE Design Suite, offering:
- Schematic and HDL-based design entry
- Integrated synthesis tools
- Timing analysis and simulation
- FPGA programming and debugging tools
- IP core libraries for rapid development
Compatible Design Languages
| Language |
Support Level |
Use Case |
| VHDL |
Full |
Complex systems, aerospace |
| Verilog |
Full |
Communication, consumer |
| SystemVerilog |
Full |
Advanced verification |
| Schematic Entry |
Full |
Quick prototypes |
Power Consumption Characteristics
Operating Power Requirements
| Condition |
Typical Power |
Maximum Power |
| Static (Standby) |
50 mW |
100 mW |
| Dynamic (50% utilization) |
250 mW |
400 mW |
| Dynamic (100% utilization) |
500 mW |
750 mW |
Power Optimization Features
- Four Delay-Locked Loops (DLLs) for clock management
- Programmable I/O drive strength
- Flexible power supply options
- Low-power configuration modes
- Clock gating capabilities
Package and Physical Specifications
Mechanical Dimensions
| Parameter |
Specification |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Body Size |
Contact manufacturer |
| Ball Pitch |
1.0 mm nominal |
| Package Height |
Per datasheet |
| Weight |
Lightweight design |
Thermal Characteristics
- Junction temperature range: 0°C to +85°C (Commercial)
- Thermal resistance (θJA): Varies by package
- Enhanced thermal dissipation through BGA substrate
- Compatible with standard heat sink solutions
Quality and Reliability Standards
Manufacturing Quality
The XC2S200-6FGG908C meets stringent quality standards:
- ISO 9001 certified manufacturing
- RoHS compliant (Pb-free options available)
- Automotive-grade variants available
- Full traceability documentation
- Extended reliability testing
Reliability Metrics
| Parameter |
Rating |
| MTBF |
> 1 million hours |
| ESD Protection |
HBM Class 1C (>2000V) |
| Latch-up Immunity |
>100 mA |
| Moisture Sensitivity |
MSL 3 |
Configuration and Programming Options
Configuration Methods
The XC2S200-6FGG908C supports multiple configuration modes:
- Master Serial Mode: Direct configuration from serial PROM
- Slave Serial Mode: Configuration from external controller
- JTAG Boundary Scan: In-system programming and debugging
- SelectMAP Mode: High-speed parallel configuration
Configuration Memory Options
| PROM Type |
Capacity |
Configuration Cycles |
| XC18V01 |
1 Mbit |
1 device |
| XC18V02 |
2 Mbit |
2 devices |
| Flash-based |
Various |
Multiple devices |
Comparison with Other Spartan-II Family Members
Spartan-II Family Comparison Table
| Device |
System Gates |
Logic Cells |
CLBs |
Max I/O |
Block RAM |
| XC2S50 |
50,000 |
1,728 |
384 |
176 |
32K |
| XC2S100 |
100,000 |
2,700 |
600 |
176 |
40K |
| XC2S150 |
150,000 |
3,888 |
864 |
260 |
48K |
| XC2S200 |
200,000 |
5,292 |
1,176 |
284 |
56K |
Ordering Information and Availability
Part Number Breakdown for Procurement
When ordering the XC2S200-6FGG908C, consider:
- Lead time: Typically 4-12 weeks depending on availability
- Minimum order quantity: Usually 1 unit for prototyping
- Volume pricing: Available for production quantities
- Packaging options: Trays or tape-and-reel
Recommended Alternative Part Numbers
If XC2S200-6FGG908C is unavailable, consider these alternatives:
- XC2S200-6FG456C: 456-pin FBGA package
- XC2S200-5FGG456C: Speed grade -5 variant
- XC2S200-6FG256C: 256-pin FBGA package
- XC2S150-6FG456C: Lower gate count option
Design Considerations and Best Practices
PCB Layout Guidelines
Critical design considerations for optimal performance:
- Power Supply Decoupling: Place 0.1μF capacitors near each power pin
- Ground Plane: Solid ground plane recommended
- Signal Integrity: Match impedance for high-speed signals
- Thermal Management: Adequate copper pour for heat dissipation
- Configuration Pins: Proper pull-up/pull-down resistors
Clock Distribution Best Practices
| Practice |
Recommendation |
| Clock Source |
Low-jitter oscillator preferred |
| DLL Usage |
Utilize for clock multiplication/division |
| Global Clocks |
Use dedicated clock pins |
| Clock Skew |
Minimize through proper routing |
Support and Documentation Resources
Technical Documentation Available
- Complete datasheet with electrical specifications
- Application notes for specific implementations
- Reference designs and example projects
- PCB layout guidelines
- Programming guides
Community and Technical Support
- Xilinx community forums
- Technical application engineers
- Training webinars and videos
- Design consultation services
- Third-party IP providers
Frequently Asked Questions About XC2S200-6FGG908C
What makes the XC2S200-6FGG908C suitable for prototyping?
The XC2S200-6FGG908C offers exceptional prototyping advantages with its reconfigurable architecture, allowing designers to test and modify designs rapidly without expensive mask sets or long fabrication cycles.
How does the -6 speed grade compare to other grades?
The -6 speed grade represents the fastest performance tier in the commercial temperature range, offering 263 MHz operation ideal for high-speed applications requiring maximum throughput.
What development tools are required?
Xilinx ISE Design Suite provides complete development environment including synthesis, simulation, implementation, and programming tools at no cost for supported devices.
Can the XC2S200-6FGG908C be used in industrial applications?
Yes, when properly specified with industrial temperature range variants, the XC2S200 series is suitable for industrial environments requiring extended temperature operation.
Conclusion: Why Choose XC2S200-6FGG908C
The XC2S200-6FGG908C represents an optimal balance of performance, flexibility, and cost-effectiveness for modern digital design applications. With 200,000 system gates, extensive I/O capabilities, and proven reliability, this FPGA delivers exceptional value for applications ranging from industrial automation to communication systems.
Its reconfigurable nature eliminates the risks and costs associated with ASIC development while providing the performance needed for demanding applications. Backed by comprehensive development tools and extensive documentation, the XC2S200-6FGG908C enables designers to bring innovative products to market faster and more cost-effectively than ever before.
Whether you’re developing prototype systems, implementing production designs, or upgrading legacy equipment, the XC2S200-6FGG908C offers the flexibility and performance to meet your digital design challenges.
