When your project calls for flexible circuits, you need a partner who actually gets the technical stuff—not just another factory pushing boards out the door.
PCBSync specializes in FPC (Flexible Printed Circuit) manufacturing from prototype to volume production. We handle single-layer, double-layer, and multi-layer flex boards, along with rigid-flex combinations for applications where traditional PCBs just won’t cut it.
What we actually do:
Our FPC capabilities cover the full range—polyimide base materials, copper weights from 1/2oz to 2oz, and coverlay or solder mask finishing depending on your assembly needs. We work with fine-pitch components down to 0.3mm and can accommodate tight bend radius requirements for wearables, medical devices, automotive sensors, and consumer electronics.
On the assembly side, we’re set up for both SMT and through-hole work on flex substrates. This includes component placement on dynamic flex zones, stiffener attachment, and connector integration. Our team knows flex circuits behave differently than rigid boards during reflow—warping, thermal expansion, fixture requirements—we’ve dealt with it all.
Why people work with us:
Honestly? Turnaround and communication. Engineering support is included, not upsold. If your Gerber files have issues or your stackup doesn’t make sense for your application, we’ll tell you before production starts. DFM review is standard.
Lead times run 5-7 days for quick-turn prototypes, 2-3 weeks for production quantities. We ship worldwide with full traceability and IPC Class 2/3 inspection standards.
Bottom line:
FPC projects have more variables than rigid boards. Material selection, bend cycles, assembly sequence—details matter. PCBSync has the experience to catch problems early and deliver boards that actually work in your application.
Get a quote at pcbsync.com or reach out directly for technical consultation.
