The XC2S200-6FGG904C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family, engineered to deliver exceptional performance for complex digital applications. This advanced FPGA features 200,000 system gates, 5,292 logic cells, and comes in a robust 904-ball Fine-pitch Ball Grid Array (FGG904) package, making it ideal for space-constrained, high-reliability applications across telecommunications, industrial automation, and embedded systems.

With its commercial-grade temperature range and -6 speed grade designation, the XC2S200-6FGG904C represents a cost-effective solution for designers seeking programmable logic capabilities without the lengthy development cycles and high costs associated with traditional ASICs.

Key Technical Specifications

Core Performance Features

Package and Environmental Specifications

Advanced Architecture of XC2S200-6FGG904C

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG904C features a sophisticated array of 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers that enable flexible implementation of complex digital circuits, boolean functions, and state machines.

Memory Resources

This Xilinx FPGA provides dual memory architecture:

• Distributed RAM: 75,264 bits of distributed memory integrated within CLBs for fast, local data storage
• Block RAM: 56 Kbits of dedicated block memory organized in columns, perfect for buffering, FIFO operations, and lookup tables

Delay-Locked Loops (DLLs)

Four strategically positioned Delay-Locked Loops at each corner of the die provide precise clock management, enabling clock multiplication, division, and phase shifting for synchronous design requirements.

Primary Applications and Use Cases

Telecommunications Infrastructure

The XC2S200-6FGG904C excels in telecommunications applications including:

• Protocol implementation and conversion
• Data packet processing
• Network routing and switching
• Base station signal processing
• Communication channel encoding/decoding

Industrial Automation and Control

Ideal for industrial environments requiring:

• Programmable Logic Controllers (PLC) implementation
• Motor control and drive systems
• Process automation interfaces
• Sensor data acquisition and processing
• Real-time control systems

Digital Signal Processing

Perfect for DSP applications such as:

• Audio and video signal processing
• Image processing and enhancement
• Filter implementation (FIR/IIR)
• FFT computation
• Modulation/demodulation circuits

Embedded Systems Development

Widely used in embedded applications including:

• System-on-Chip (SoC) prototyping
• Custom peripheral interfaces
• Hardware acceleration
• Legacy system integration
• Cryptographic processing

Comparison Table: XC2S200-6FGG904C vs. Other Spartan-II Variants

Design Advantages and Benefits

Reconfigurability and Flexibility

Unlike mask-programmed ASICs, the XC2S200-6FGG904C offers:

• In-field reprogramming for design updates and bug fixes
• No NRE costs eliminating initial tooling expenses
• Rapid prototyping accelerating time-to-market
• Design iteration without hardware changes

Cost-Effective Solution

The Spartan-II architecture provides:

• Lower unit costs compared to equivalent ASIC solutions for low to medium volumes
• Reduced development risk through programmable implementation
• Elimination of lengthy fabrication cycles
• Proven, reliable silicon technology

High Integration Density

With 904 balls in the FGG package, designers benefit from:

• Maximum I/O connectivity for complex system integration
• Efficient board space utilization
• Enhanced signal integrity with fine-pitch BGA technology
• Robust mechanical connection for high-reliability applications

Programming and Development Tools

Xilinx ISE Design Suite

The XC2S200-6FGG904C is fully supported by Xilinx ISE (Integrated Software Environment), providing:

• HDL synthesis (VHDL, Verilog)
• Constraint-driven place and route
• Timing analysis and verification
• BitGen configuration file generation
• ChipScope Pro for embedded logic analysis

Configuration Methods

Multiple configuration options include:

• JTAG boundary scan for in-system programming
• Slave Serial mode for microprocessor-based configuration
• Master Serial mode with external PROM
• SelectMAP parallel for high-speed configuration

Technical Comparison: Speed Grades

Note: The -6 speed grade, featured in the XC2S200-6FGG904C, is exclusively available in commercial temperature range and offers the highest performance within the Spartan-II family.

Pin Configuration and I/O Capabilities

I/O Standards Support

The XC2S200-6FGG904C supports multiple I/O standards:

• LVTTL (Low Voltage TTL)
• LVCMOS (1.8V, 2.5V, 3.3V)
• PCI (33MHz, 66MHz compliant)
• GTL/GTL+ for high-speed backplane
• HSTL and SSTL for memory interfaces

Maximum User I/O Distribution

All I/O counts exclude the four dedicated global clock input pins

Power Consumption and Thermal Characteristics

Operating Voltage Requirements

Power Optimization Features

• Individual I/O bank voltage configuration
• Unused logic automatically disabled
• Low static power consumption
• Dynamic power scaling based on utilization

Quality and Reliability Standards

The XC2S200-6FGG904C meets stringent quality requirements:

• JEDEC standards for semiconductor reliability
• Automotive-grade options available for extended temperature
• Comprehensive testing including boundary scan and functional verification
• Long-term availability with lifecycle management support

Ordering Information and Part Number Breakdown

XC2S200-6FGG904C decoding:

• XC2S200: Device type (Spartan-II, 200K gates)
• -6: Speed grade (commercial, high performance)
• FGG904: Package (Fine-pitch BGA, 904 balls)
• C: Commercial temperature range (0°C to +85°C)

Lead-Free Alternative

For RoHS-compliant applications, specify XC2S200-6FGG904G (note the “G” suffix for green/Pb-free packaging).

Design Resources and Documentation

Engineers working with the XC2S200-6FGG904C should reference:

• DS001: Spartan-II Family Data Sheet
• UG: User Guides for architecture and design
• XAPP: Application notes for specific implementations
• Answer Records: Technical support database
• Reference Designs: Pre-verified IP cores and examples

Competitive Alternatives and Migration Paths

Within Spartan-II Family

Next-Generation Migration

For new designs, consider:

• Spartan-3 family: Enhanced features, lower power, more gates
• Spartan-6 family: DDR3 support, higher performance, DSP slices
• Spartan-7 family: Latest architecture, AXI interfaces, improved power efficiency

Frequently Asked Questions

What is the main advantage of the FGG904 package?

The FGG904 package provides maximum I/O density with 904 balls, enabling complex multi-interface designs while maintaining excellent signal integrity through fine-pitch BGA technology.

Is the XC2S200-6FGG904C suitable for new designs?

While the Spartan-II family is mature and proven, AMD Xilinx recommends considering newer Spartan-7 devices for new designs due to enhanced features, lower power consumption, and longer-term availability.

Can I use 5V logic with this FPGA?

The XC2S200-6FGG904C operates with 2.5V core voltage and supports I/O voltages from 1.8V to 3.3V. For 5V tolerance, series resistors may be required as specified in the datasheet.

What development tools are required?

The Xilinx ISE Design Suite (version 14.7 or earlier) fully supports the Spartan-II family, including synthesis, implementation, and bitstream generation. Modern Vivado does not support legacy Spartan-II devices.

How many logic gates can I practically implement?

While rated at 200,000 system gates, actual capacity depends on design complexity. Typical utilization ranges from 60-80% of theoretical maximum, accounting for routing resources and implementation efficiency.

Conclusion: Why Choose XC2S200-6FGG904C

The XC2S200-6FGG904C represents a proven, reliable FPGA solution for engineers requiring substantial logic resources, flexible I/O configuration, and cost-effective programmable logic. With its 904-ball fine-pitch package, this device offers maximum connectivity for complex digital systems while maintaining the design flexibility inherent to FPGA technology.

Whether implementing communication protocols, industrial control systems, digital signal processing algorithms, or embedded system interfaces, the XC2S200-6FGG904C delivers the performance, reliability, and versatility demanded by professional electronics design.

For procurement, technical support, and design consultation, contact authorized AMD Xilinx distributors or visit the official product documentation portal for the most current specifications and availability information.